Load lock device

Abstract

A load lock device includes a load lock chamber including a first conveyance port connected to a transfer chamber connected to a reduced-pressure processing device, and a second conveyance port connected to a loader chamber; a substrate holder configured to hold a substrate in the load lock chamber; a driving mechanism arranged below the load lock chamber to move the substrate holder up and down and connected to the substrate holder via a connecting member; an extension chamber extended from a lower portion of the load lock chamber to a side; and a pump arranged below the extension chamber and configured to discharge a gas in the load lock chamber via the extension chamber. The extension chamber includes a bottom surface with an opening at a position deviated from a vertically lower position of the substrate holder, and the pump is connected to the opening. Fig 1.

Description

Load lock device

[0001] The present invention relates to a load lock device.

[0002] Patent Document 1 discloses a load lock device having a vacuum chamber, a substrate table that moves up and down within the vacuum chamber, and a high-vacuum pump connected to the vacuum chamber through an opening disposed below the substrate table on the bottom surface of the vacuum chamber.

[0003] In a configuration where a pump is disposed through an opening disposed below the substrate table on the bottom surface of the vacuum chamber, particles generated by the pump or particles sucked by the pump and rebounded by the pump can rise up and reach the space above the substrate, and can adhere to the substrate. Such particles can cause manufacturing defects in articles manufactured using the substrate. If the gap between the side surface of the substrate table and the inner surface of the vacuum chamber is reduced to suppress the rise of particles into the space above the substrate, the exhaust efficiency by the pump may decrease.

[0004] Japanese Patent Application Laid-Open No. 11-217670

[0005] The present invention provides an advantageous technique for reducing the rise of particles from the pump into the space above the substrate.

[0006] One aspect of the present invention relates to a load lock device, the load lock device including: a load lock chamber having a first transfer port connected to a transfer chamber connected to a decompression processing device and a second transfer port connected to a loader chamber; a substrate holder that holds a substrate within the load lock chamber; a drive mechanism disposed below the load lock chamber so as to move the substrate holder up and down and connected to the substrate holder via a connecting member; an extension chamber extending laterally from a lower portion of the load lock chamber; and a pump disposed below the extension chamber and discharging the gas of the load lock chamber through the extension chamber, wherein the extension chamber has a bottom surface having an opening at a position shifted from directly below the substrate holder, and the pump is connected to the opening.

[0007] A schematic diagram showing the configuration of a processing apparatus including a load lock device according to one embodiment of the present invention. A diagram illustrating the operation of a processing apparatus including a load lock device according to one embodiment of the present invention. A diagram illustrating the operation of a processing apparatus including a load lock device according to one embodiment of the present invention. A diagram illustrating the operation of a processing apparatus including a load lock device according to one embodiment of the present invention. A diagram illustrating the operation of a processing apparatus including a load lock device according to one embodiment of the present invention. A plan view showing the arrangement of the load lock chamber, extension chamber and gas dispersion section.

[0008] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention to the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, the same or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0009] Figure 1 schematically shows the configuration of a processing apparatus including a load lock device 100 according to one embodiment of the present invention. The load lock device 100 may have a load lock chamber 110 located between a loader chamber 30 and a transfer chamber 20. The loader chamber 30 may be maintained in an atmospheric environment. In the loader chamber 30, for example, substrates S may be supplied from a carrier. Alternatively, substrates S may be supplied to the loader chamber 30 from a preprocessing apparatus. The loader chamber 30 may be equipped with a filter 32 on its ceiling, through which a downflow may be supplied to the internal space of the loader chamber 30. A transport robot 34 may be located in the loader chamber 30, and the substrates S may be transported by the transport robot 34. The transport robot 34 may transport the substrates S from the loader chamber 30 to the load lock chamber 110 through a valve 50. The load lock chamber 110 into which the substrates S have been transported is sufficiently depressurized. Subsequently, the transfer robot 22 positioned in the transfer chamber 20 can transfer the substrate S from the load lock chamber 110 to the transfer chamber 20 through the valve 40. Then, the transfer robot 22 can transfer the substrate S from the transfer chamber 20 to the vacuum processing apparatus 10 through the valve 60. The vacuum processing apparatus 10 may be, for example, a CVD apparatus, a PVD apparatus, an etching apparatus, a plasma processing apparatus, or an electron beam lithography apparatus.

[0010] The load lock chamber 110 may have a first transport port 111 connected to a transfer chamber 20 connected to a depressurization device 10, and a second transport port 112 connected to a loader chamber 30. In one example, the height of the first transport port 111 (e.g., the height of the lower end of the first transport port 111) is lower than the height of the second transport port 112 (e.g., the height of the lower end of the second transport port 112). The first transport port 111 may be configured to communicate with the internal space of the transfer chamber 20 through a valve 40. The second transport port 112 may be configured to communicate with the internal space of the loader chamber 30 through a valve 50.

[0011] The load lock device 100 may include a substrate holder 120 that holds a substrate S within a load lock chamber 110. The substrate holder 120 may include, for example, a plurality of contact portions 124 that contact and hold the substrate S. The load lock device 100 may include a drive mechanism 130. The drive mechanism 130 may be positioned below the load lock chamber 110 to raise and lower the substrate holder 120. The drive mechanism 130 may be connected to the substrate holder 120 via a connecting member 122.

[0012] The load lock chamber 110 may include an extension chamber 140 extending laterally from the bottom of the load lock chamber 110, and a pump 150 positioned below the extension chamber 140 for discharging gas from the load lock chamber 110 through the extension chamber 140. The extension chamber 140 may have a bottom surface 144 with an opening 142 positioned offset from the vertically below the substrate holder 120. The pump 150 may be connected to the opening 142. Although not shown, a valve may be positioned between the pump 150 and the opening 142.

[0013] The pump 150 may include, for example, a rotary pump and a turbomolecular pump positioned between the rotary pump and the opening 142. The turbine of the turbomolecular pump rotates at high speed during operation. When particles attracted by the turbomolecular pump collide with the turbine, they may be ejected from the turbine. Furthermore, regardless of whether the pump 150 is a turbomolecular pump or not, the pump 150 itself may generate particles. Therefore, it is preferable to connect the pump 150 to an opening 142 provided in the bottom surface 144 of an extension chamber 140 that extends laterally from the lower part of the load lock chamber 110. This reduces the possibility of particles from the pump 150 reaching the space above the substrate S through the gap G between the side surface of the substrate holder 120 and the inner surface of the load lock chamber and adhering to the substrate S.

[0014] The load lock device 100 may include a gas introduction unit 160 for introducing gas (e.g., clean dry air or nitrogen gas) into the load lock chamber 110. The gas introduction unit 160 may be positioned above the path between the substrate holder 120 and the transfer chamber 20 when the substrate S is being transported to the transfer chamber 20 through the first transport port 111. In one example, the gas introduction unit 160 may be positioned above the first transport port 111. The gas introduction unit 160 may include a gas dispersion unit 162 for dispersing the gas into the internal space of the load lock chamber 110. At least a portion of the gas dispersion unit 162 may be positioned inside the load lock chamber 110. The gas dispersion unit 162 may be positioned opposite the second transport port 112. The gas introduction unit 160 may include a flow rate adjustment valve 164 for adjusting the gas introduction.

[0015] A gas discharge line 52 may be connected to a valve 50 located between the second transport port 112 of the load lock chamber 110 and the loader chamber 30. Through the gas discharge line 52, gas in the space near the second transport port 112 can be discharged to the space outside the load lock chamber 110. A pump (not shown) may be connected to the gas discharge line 52.

[0016] At least a portion of the second transport port 112 may be positioned above (vertically above) the extension chamber 140. Alternatively, at least a portion of the extension chamber 140 may be positioned between the second transport port 112 and the pump 150. Such a configuration is advantageous for reducing the footprint of the load lock device 100.

[0017] At least a portion of the loader chamber 30 may be positioned above (vertically above) the extension chamber 140. Alternatively, at least a portion of the extension chamber 140 may be positioned between the loader chamber 30 and the pump 150. Such a configuration is also advantageous in reducing the footprint of the load lock device 100.

[0018] As illustrated in Figures 1 to 5, the substrate holder 120 can be positioned at multiple locations within the internal space of the load lock chamber 110. These multiple locations may include positions where a portion of the side surface of the substrate S held by the substrate holder 120 faces the gas dispersion section 162, as illustrated in Figure 1. Here, the portion of the side surface (outer peripheral surface) of the substrate S held by the substrate holder 120 may face the gas dispersion section 162 with respect to a direction parallel to the surface of the substrate S.

[0019] Figure 6 is a plan view showing the arrangement of the load lock chamber 110, the extension chamber 140, and the gas dispersion section 162. This plan view can also be understood as an orthogonal projection onto the floor on which the load lock device 100 is located. The substrate holder 120 may be located between the gas dispersion section 162 and the extension chamber 140 in the plan view or the orthogonal projection. Alternatively, the opening 142 may be located between the gas dispersion section 162 and the extension chamber 140 in the plan view or the orthogonal projection.

[0020] The substrate S held by the substrate holder 120 may have a rectangular shape. Alternatively, the substrate S held by the substrate holder 120 may have a circular shape with a notch indicating a reference orientation. However, the substrate S held by the substrate holder 120 may have other shapes.

[0021] The area of ​​the gap G between the side surface of the substrate holder 120 and the inner surface of the load lock chamber 110 is preferably smaller than the cross-sectional area of ​​the second transport port 112. More preferably, the area of ​​the gap G is smaller than 1 / 2, 1 / 3, or 1 / 4 of the cross-sectional area of ​​the second transport port 112. This configuration is advantageous because, when a substrate S is transported from the loader chamber 30 through the second transport port 112 into the internal space of the load lock chamber 110, the amount of gas introduced from the gas dispersion unit 162 into the internal space of the load lock chamber 110 is discharged through the second transport port 112 and the gas discharge line 52 is greater than the amount discharged from the space above the substrate S through the gap G into the space below the substrate holder 120. This is effective in suppressing the entry of particles from the loader chamber 30 into the internal space of the load lock chamber 110 through the second transport port 112.

[0022] The area of ​​the gap G between the side surface of the substrate holder 120 and the inner surface of the load lock chamber 110 is preferably smaller than the cross-sectional area of ​​the opening 142 provided in the bottom surface 144 of the extension chamber 140. Such a configuration is advantageous in reducing the amount of particles from the pump 150 that reach the space above the substrate S through the gap G and adhere to the substrate S. The area of ​​the gap G is preferably smaller than the cross-sectional area (cross-sectional area in the vertical plane) of the connection portion 146 between the load lock chamber 110 and the extension chamber 140. Such a configuration is also advantageous in reducing the amount of particles from the pump 150 that reach the space above the substrate S through the gap G and adhere to the substrate S.

[0023] The height dimension Hh of the substrate holder 120 is preferably greater than the dimension Lg of the gap G between the side surface of the substrate holder 120 and the inner surface of the load lock chamber 110 (the distance between the side surface of the substrate holder 120 and the inner surface of the load lock chamber 110). Such a configuration is advantageous in suppressing the passage of particles from the pump 150 through the gap G. The height dimension Hh of the substrate holder 120 is preferably 3 times or more and 115 times or less the maximum dimension of the gap G. Such a configuration is advantageous in suppressing the passage of particles from the pump 150 through the gap G while suppressing the enlargement of the load lock chamber 110.

[0024] The height dimension He of the extension chamber 140 is preferably greater than the height dimension Hh of the substrate holder 120. Such a configuration is advantageous for increasing the efficiency of gas discharge by the pump 150. When the substrate S moves between the load lock chamber 110 and the transfer chamber 20 through the first transport port 111, the height of the lower end of the substrate holder 120 is preferably greater than the height of the ceiling surface 145 of the extension chamber 140. Such a configuration is advantageous for increasing the efficiency of gas discharge by the pump 150 in this state.

[0025] Figures 2, 3, 4, and 5 illustrate the operation of the processing apparatus shown in Figure 1. First, gas is introduced (supplied) from the gas introduction section 160 into the internal space of the load lock chamber 110, and the gas in the internal space is discharged to the external space of the load lock chamber 110 by the pump 150. At this time, the amount of gas introduced from the gas introduction section 160 into the internal space may be greater than the amount of gas discharged by the pump 150 so that the pressure in the internal space increases. When the pressure in the internal space becomes equal to or greater than atmospheric pressure, as shown in Figure 2, the valve 50 may be opened and the discharge of gas through the gas discharge line 52 may be started. After that, the substrate S may be transported from the loader chamber 30 to the substrate holder 120 in the internal space of the load lock chamber 110 by the transport robot 34.

[0026] Subsequently, as shown in Figure 3, the valve 50 may be closed and the substrate holder 120 may be driven upward by the drive mechanism 130. Also, with gas introduced into the internal space of the load lock chamber 110 from the gas introduction section 160, the discharge rate of gas from the internal space by the pump 150 is increased, and the internal space is depressurized. After that, the introduction of gas into the internal space by the gas introduction section 160 is stopped, and the discharge rate of gas from the internal space by the pump 150 may be further increased.

[0027] Once the pressure inside the load lock chamber 110 has been sufficiently reduced, the substrate holder 120 may be driven downward by the drive mechanism 130 to a height to transport the substrate S to the transfer chamber 20, as shown in Figure 4. Then, as shown in Figure 5, the valve 40 is opened, and the transport robot 22 transports the substrate S from the inside of the load lock chamber 110 to the transfer chamber 20, and further to the depressurization processing device 10. After that, the valve 40 is closed, and the substrate S is processed in the depressurization processing device 10.

[0028] Subsequently, the valve 40 may be opened, and the substrate S of the pressure reduction device 10 may be transported by the transport robot 22 into the internal space of the load lock chamber 110, as shown in Figure 5. After that, the valve 40 may be closed.

[0029] Subsequently, gas is introduced from the gas inlet 160 into the internal space of the load lock chamber 110, while the pump 150 discharges the gas from the internal space to the external space of the load lock chamber 110. At this time, the amount of gas introduced from the gas inlet 160 into the internal space may be greater than the amount of gas discharged by the pump 150 so that the pressure in the internal space increases. When the pressure in the internal space becomes equal to or greater than atmospheric pressure, as shown in Figure 2, the valve 50 may be opened and the discharge of gas through the gas discharge line 52 may begin. After that, the transport robot 34 may transport the substrate S from the substrate holder 120 in the internal space of the load lock chamber 110 to the loader chamber 30. After that, the valve 50 may be closed and the discharge of gas through the gas discharge line 52 may be stopped.

[0030] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention.

[0031] 100: Load lock device, 110: Load lock chamber, 111: First transport port, 112: Second transport port, 120: Substrate holder, 130: Drive mechanism, 140: Extension chamber, 142: Opening, 144: Bottom surface, 150: Pump, 160: Gas introduction section, 162: Gas dispersion section

Claims

1. A load lock device comprising: a load lock chamber having a first transfer port connected to a transfer chamber connected to a reduced pressure processing device, and a second transfer port connected to a loader chamber; a substrate holder for holding a substrate within said load lock chamber; a drive mechanism arranged below said load lock chamber to raise and lower said substrate holder and connected to said substrate holder via a connecting member; an extension chamber extending laterally from a lower portion of said load lock chamber; and a pump arranged below said extension chamber for discharging gas from said load lock chamber via said extension chamber, wherein said extension chamber has a bottom surface with an opening at a position offset from vertically below said substrate holder, and said pump is connected to said opening.

2. The load lock device according to claim 1, further comprising a gas inlet located above the path between the substrate holder and the transfer chamber when the substrate is being transferred to the transfer chamber through the first transfer port.

3. The load lock device according to claim 2, wherein the height of the first transfer port is lower than the height of the second transfer port.

4. The load lock device according to claim 2 or 3, characterized in that the gas introduction section includes a gas dispersion section that disperses gas, and the gas dispersion section is disposed at a position opposite the second transfer port.

5. The load lock device according to any one of claims 2 to 4, wherein the area of ​​the gap between the side surface of the substrate holder and the inner surface of the load lock chamber is smaller than the cross-sectional area of ​​the second transfer port.

6. The load lock device according to any one of claims 2 to 4, wherein the area of ​​the gap between the side surface of the substrate holder and the inner surface of the load lock chamber is smaller than half the cross-sectional area of ​​the second transfer port.

7. The load lock device according to any one of claims 1 to 4, wherein the area of ​​the gap between the side surface of the substrate holder and the inner surface of the load lock chamber is smaller than the cross-sectional area of ​​the opening.

8. A load lock device according to any one of claims 1 to 4, characterized in that the area of ​​the gap between the side surface of the substrate holder and the inner surface of the load lock chamber is smaller than the cross-sectional area of ​​the connection portion between the load lock chamber and the extension chamber.

9. The load lock device according to any one of claims 1 to 8, wherein the height dimension of the substrate holder is greater than the dimension of the gap between the side surface of the substrate holder and the inner surface of the load lock chamber.

10. A load lock device according to any one of claims 1 to 8, characterized in that the height dimension of the substrate holder is 3 times or more and 115 times or less the maximum dimension of the gap between the side surface of the substrate holder and the inner surface of the load lock chamber.

11. The load lock apparatus according to any one of claims 1 to 10, wherein the extension chamber has a height dimension greater than the height dimension of the substrate holder.

12. A load lock device according to any one of claims 1 to 11, characterized in that, when a substrate is moved between the load lock chamber and the transfer chamber through the first transfer port, the height of the lower end of the substrate holder is higher than the height of the ceiling surface of the extension chamber.

13. The load lock apparatus according to any one of claims 1 to 12, wherein at least a portion of the second transfer port is disposed above the extension chamber.

14. The load lock apparatus according to any one of claims 1 to 12, wherein at least a portion of the extension chamber is disposed between the second transfer port and the pump.

15. The load lock apparatus according to any one of claims 1 to 12, wherein at least a portion of the loader chamber is disposed above the extension chamber.

16. The load lock apparatus according to any one of claims 1 to 12, wherein at least a portion of the extension chamber is disposed between the loader chamber and the pump.

17. The load lock apparatus according to claim 1, further comprising a gas dispersion unit that distributes gas in the internal space of the load lock chamber, the gas dispersion unit being positioned opposite the second transfer port, and at least a portion of the second transfer port being positioned above the extension chamber.

18. The load lock apparatus according to claim 1, further comprising a gas dispersion unit that disperses gas in the internal space of the load lock chamber, the gas dispersion unit being positioned opposite the second transfer port, and at least a portion of the extension chamber being positioned between the second transfer port and the pump.

19. The load lock apparatus according to claim 1, further comprising a gas dispersion unit that distributes gas in the internal space of the load lock chamber, the gas dispersion unit being positioned opposite the second transfer port, and at least a portion of the loader chamber being positioned above the extension chamber.

20. The load lock apparatus according to claim 1, further comprising a gas dispersion unit that disperses gas in the internal space of the load lock chamber, the gas dispersion unit being arranged to face the second transfer port, and at least a portion of the extension chamber being arranged between the loader chamber and the pump.

21. The load lock apparatus according to any one of claims 17 to 20, wherein the positions at which the substrate holder can be positioned include a position where a portion of the side of the substrate held by the substrate holder faces the gas dispersion unit.

22. The load lock apparatus according to claim 1, further comprising a gas dispersion section that distributes gas in the internal space of the load lock chamber, and wherein the substrate holder is located between the gas dispersion section and the extension chamber in an orthogonal projection onto a floor on which the load lock apparatus is placed.

23. The load lock apparatus according to claim 1, further comprising a gas dispersion unit that distributes gas in the internal space of the load lock chamber, wherein the substrate holder is located between the gas dispersion unit and the opening in an orthogonal projection onto a floor on which the load lock apparatus is placed.