Interposer with flexible portion

Abstract

To address the issue of shrinking volume that can be allocated for electrical components, a system can use an interposer (102) with a flexible portion (104). A first portion (106) of the interposer (102) can electrically connect to a top side (118) of a motherboard (110). A flexible portion (104) of the interposer (102), adjacent to the first portion (106), can wrap around an edge (116) of the motherboard (110). A peripheral portion (108) of the interposer (102), adjacent to the flexible portion (104), can electrically connect to a bottom side (102) of the motherboard (110). The peripheral portion (108) can be flexible or rigid. The interposer (102) can define a cavity (122) that extends through the first portion (106) of the interposer (102). A chip package (404) can electrically connect to the first portion (106) of the interposer (102). The chip package (404) can be coupled to at least one electrical component that extends into the cavity (122) when the chip package (404) is connected to the interposer (102). The most illustrative drawing is Figure 1