Light-emitting diode package

Abstract

A light emitting diode package is disclosed. The light emitting diode package includes: a light em itting diode chip (110) emitting light and a light transmissive member (120). The light transmissive member covers at least an upper surface of the light emitting diode chip and includes a light transmissive resin (121) and reinforcing fillers (122) . The reinforcing fillers have at least two side surfaces having different lengths and are dispersed in the light transmissive resin.

Description

Light Emitting Diode Package

[0001] The present invention relates to a light-emitting diode package.

[0002] Light-emitting diodes emit light of various wavelengths through the recombination of electrons and holes at the junction of p- and n-type semiconductors when current is applied. Due to various advantages over the filaments used in conventional light-emitting devices, such as a long lifespan, low power consumption, and excellent driving characteristics, the demand for light-emitting diodes is continuously increasing.

[0003] Light-emitting diode packages containing light-emitting diodes are used as light sources in various fields, such as backlight sources for display devices.

[0004] A light-emitting diode package covers the light-emitting diode chip with a transparent resin to protect the light-emitting diode chip. Alternatively, the light-emitting diode package covers the light-emitting diode chip with a transparent resin interspersed with wavelength-converting material to convert the wavelength of light emitted from the light-emitting diode chip.

[0005] Generally, epoxy resin or silicone resin is used as the transparent resin. However, transparent resin has a higher coefficient of thermal expansion compared to the light-emitting diode chip.

[0006] Therefore, the transparent resin expands or contracts significantly in response to temperature changes caused by the light-emitting diode chip or other factors. Since there is a large difference in the degree of expansion or contraction due to temperature changes between the light-emitting diode chip and the transparent resin, cracks occur in the transparent resin. If cracks occur in the transparent resin, the reliability of the light-emitting diode package and the display device to which the light-emitting diode package is applied is degraded.

[0007] The problem to be solved by the present invention is to provide a light-emitting diode package with improved reliability by preventing the occurrence of cracks.

[0008] In addition, the problem to be solved by the present invention is to provide a light-emitting diode package with improved reliability while minimizing the reduction in light efficiency.

[0009] According to an embodiment of the present invention, a light-emitting diode package comprising a light-emitting diode chip and a light-transmitting member is provided. The light-transmitting member covers at least the upper surface of the light-emitting diode chip and comprises a light-transmitting resin and a reinforcing filler. The reinforcing filler has at least two sides having different lengths and is interspersed in the light-transmitting resin.

[0010] In an embodiment of the present invention, a light-emitting diode package can prevent cracking of the transparent resin and improve reliability by using a reinforcing filler with a low coefficient of thermal expansion.

[0011] A light-emitting diode package according to an embodiment of the present invention can minimize the reduction in light efficiency while improving reliability by using a light-transmitting reinforcing filler.

[0012] FIG. 1 is an exemplary diagram of a light-emitting diode package according to a first embodiment of the present invention.

[0013] Figures 2 and 3 are SEM images of a conventional light-emitting diode package.

[0014] Figure 4 is an SEM image of a light-emitting diode package according to the first embodiment of the present invention.

[0015] FIG. 5 is an exemplary diagram of a light-emitting diode package according to a second embodiment of the present invention.

[0016] FIG. 6 is an exemplary diagram of a light-emitting diode package according to a third embodiment of the present invention.

[0017] FIG. 7 is an exemplary diagram of a light-emitting diode package according to a fourth embodiment of the present invention.

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. The embodiments described below are provided as examples to ensure that the concept of the present invention is sufficiently conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. Furthermore, in the drawings, the width, length, thickness, etc., of components may be exaggerated for convenience. Throughout the specification, identical reference numerals indicate identical components, and similar reference numerals indicate corresponding similar components.

[0019] A light-emitting diode package according to the present embodiment includes a light-emitting diode chip that emits light and a light-transmitting member. The light-transmitting member covers at least the upper surface of the light-emitting diode chip and includes a light-transmitting resin and a reinforcing filler. The reinforcing filler has at least two sides having different lengths and is interspersed in the light-transmitting resin.

[0020] The above reinforcing filler may include at least one of glass fibers composed of Si, Al, Fe, Ba, Ca, Mg, and Na.

[0021] Furthermore, the reinforcing filler may include at least one of glass fibers composed of SiO2, Al2O3, MgO, CaO, Na2O, K2O, and B2O3.

[0022] The content of the reinforcing filler may be 10 wt% or more and 200 wt% or less of the transparent resin.

[0023] Alternatively, the content of the reinforcing filler may be 50 wt% or more and 100 wt% or less of the transparent resin.

[0024] According to one embodiment, the light-transmitting member can cover the side and top surfaces of the light-emitting diode chip.

[0025] Additionally, the light-emitting diode package may further include a barrier member that covers the side of the light-transmitting member and reflects light emitted from the side of the light-emitting diode chip.

[0026] The above barrier member may further include the above reinforcing filler.

[0027] According to another embodiment, the light-transmitting member can cover the upper surface of the light-emitting diode chip.

[0028] Additionally, the light-emitting diode package may further include a barrier member covering the side of the light-emitting diode chip.

[0029] The above barrier member may further include the above reinforcing filler.

[0030] The light-transmitting member may further cover the upper surface of the barrier member.

[0031] Alternatively, the barrier member may further cover the side of the light-transmitting member.

[0032] The light-transmitting member may further include a wavelength-converting material scattered in the light-transmitting resin.

[0033] Next, the phototherapy device of the present invention will be described in detail through drawings.

[0034] FIG. 1 is an exemplary diagram of a light-emitting diode package according to a first embodiment of the present invention.

[0035] A light-emitting diode package (100) according to the first embodiment of the present invention includes a light-emitting diode chip (110) and a light-transmitting member (120).

[0036] The light-emitting diode chip (110) is formed by a gallium nitride-based semiconductor stack on a growth substrate for growing a semiconductor layer. The light-emitting diode chip (110) emits ultraviolet or visible light.

[0037] The light-emitting diode chip (110) may have an electrode (not shown) located on at least one of the upper and lower portions. For example, the light-emitting diode chip (110) may have an electrode formed on the upper portion and be electrically connected to an external component via wire bonding. Alternatively, the light-emitting diode chip (110) may have an electrode formed on the lower portion and be electrically connected to an external component via flip chip bonding. Alternatively, the light-emitting diode chip (110) may have electrodes formed on the upper and lower portions, respectively, so that the lower portion is connected to an external component via flip chip bonding and the upper portion is connected via wire bonding.

[0038] The light-transmitting member (120) covers the light-emitting surface of the light-emitting diode chip (110). For example, the light-transmitting member (120) covers the top surface and the side surface of the light-emitting diode chip (110). The light-transmitting member (120) formed in this way can protect the light-emitting diode chip (110) from the external environment.

[0039] Additionally, the light-transmitting member (120) has a structure in which the portion covering the side of the light-emitting diode chip (110) is thicker than the portion covering the top surface of the light-emitting diode chip (120). That is, the thickness of the light-transmitting member (120) from the side to the side of the light-emitting diode chip (120) is thicker than the thickness from the top surface to the top surface of the light-emitting diode chip (110).

[0040] The light-transmitting member (120) includes a light-transmitting resin (121), a reinforcing filler (122), and a wavelength conversion material (123). The reinforcing filler (122) and the wavelength conversion material (123) are light-transmitting materials and are scattered in the light-transmitting resin (121). If a filler that does not transmit light, such as a general metal filler or carbon filler, is scattered in the light-transmitting resin (121), the light efficiency of the light-emitting diode package is reduced. Therefore, the light-emitting diode package (100) of the present embodiment can prevent a reduction in light efficiency or minimize a reduction in light efficiency by using a light-transmitting reinforcing filler (122).

[0041] For example, the transparent resin (121) may be a resin composed of at least one of silicone resin, epoxy resin, and polyimide resin. This is an example of a material for the transparent resin (121), but the present invention is not limited thereto. Any known material may be used as long as it is a resin that transmits light.

[0042] The transparent resin (121) has a greater coefficient of thermal expansion than the light-emitting diode chip (110). Additionally, since the transparent resin (121) is in contact with the light-emitting diode chip (110), it directly receives light and heat generated from the light-emitting diode chip (110).

[0043] Therefore, in conventional light-emitting diode (LED) packages, the transparent resin degrades due to light and heat from the LED chip, causing cracks. External substances such as moisture, air, and dust penetrate the interior of the LED package through these cracks, or light that is not converted to a specific wavelength is emitted to the outside, thereby reducing the reliability of the LED package.

[0044] The light-emitting diode package (100) of the present embodiment includes reinforcing fillers (122) scattered in a transparent resin (121). The reinforcing fillers (122) prevent the reliability of the light-emitting diode package from decreasing due to the difference in the coefficient of thermal expansion between the transparent resin (121) and the light-emitting diode chip (110).

[0045] The reinforcing filler (122) is a structure having at least two sides of different lengths. For example, the reinforcing filler (122) may be a long rod structure having a long axis and a short axis.

[0046] The reinforcing filler (122) may include at least one of glass fibers composed of Si, Al, Fe, Ba, Ca, Mg, and Na. For example, the reinforcing filler (122) may include at least one of glass fibers composed of SiO2, Al2O3, MgO, CaO, Na2O, K2O, and B2O3.

[0047] The content of the reinforcing filler (122) of the light-transmitting member (120) may be 10 wt% or more and 200 wt% or less of the light-transmitting resin (121). Alternatively, the content of the reinforcing filler (122) of the light-transmitting member (120) may be 50 wt% or more and 100 wt% or less of the light-transmitting resin (121).

[0048] Glass fibers are resistant to heat and have a low coefficient of thermal expansion. In addition, glass fibers are not affected by light and have excellent chemical resistance. Therefore, the reinforcing filler (122) made of glass fibers also has a low coefficient of thermal expansion and excellent heat resistance and chemical resistance.

[0049] Since the reinforcing filler (122) has a low coefficient of thermal expansion, it can reduce the degree to which the transparent resin (121) expands or contracts with temperature changes. Therefore, the reinforcing filler (122) can prevent cracks from forming in the transparent resin (121). Additionally, by preventing cracks from forming, the reinforcing filler (122) can prevent external substances from penetrating into the interior of the transparent resin (121) through the cracks.

[0050] Additionally, since the reinforcing filler (122) has a long rod structure, it can block the path of the crack and prevent the crack from advancing further. Furthermore, the reinforcing filler (122) with a long rod structure can prevent external substances from penetrating the transparent resin (121). Also, even if external substances penetrate the transparent resin (121), the penetration path is extended due to the long rod structure of the reinforcing filler (122).

[0051] In this way, the heat resistance and chemical resistance of the light-transmitting member (120) of the light-emitting diode package (100) of the present embodiment are improved by the reinforcing filler (122), thereby improving reliability.

[0052] The wavelength conversion material (123) converts the wavelength of light from the light-emitting diode chip (110) so that the light-emitting diode package (100) emits light of a specific color. For example, the wavelength conversion material (123) may include at least one of a phosphor and a QD (Quantum Dot).

[0053] In this embodiment, the light-transmitting member (120) is described as including a wavelength conversion material (123), but the light-transmitting member (120) is not required to include the wavelength conversion material (123). If the wavelength range of light to be emitted from the light-emitting diode package (100) and the wavelength range of light emitted from the light-emitting diode chip (110) are the same, the wavelength conversion material (123) may be omitted.

[0054] If the light-emitting member (120) does not need to convert the light of the light-emitting diode chip (110), it may not include a wavelength conversion material (123).

[0055] Tables 1 and 2 are experimental results comparing the reliability of a conventional light-emitting diode package (10, 20) and a light-emitting diode package (100) of the present embodiment.

[0056] The first and second experimental groups are conventional light-emitting diode packages (10, 20).

[0057] FIG. 2 is an SEM image of a conventional light-emitting diode package (10) corresponding to the first experimental group, and FIG. 3 is an SEM image of a conventional light-emitting diode package (20) corresponding to the second experimental group. The SEM image is a photograph taken with a scanning electron microscope.

[0058] Referring to FIG. 2, the first experimental group, a conventional light-emitting diode package (10), has a light-transmitting member (11) composed of a light-transmitting resin (121) and a wavelength-converting material (123) scattered in the light-transmitting resin (121), and does not contain a filler.

[0059] Referring to FIG. 3, the conventional light-emitting diode package (20) of the second experimental group comprises a light-transmitting member (21) that includes a light-transmitting resin (121), a wavelength-converting material (123), and a filler (22). The filler (22) used in the second experimental group has a general structure rather than a long rod structure like the reinforcing filler (122) of the present embodiment, and has a content of 80 wt%. For example, the filler (22) is a silica filler.

[0060] The third to seventh experimental groups are light-emitting diode packages (100) of the present embodiment.

[0061] FIG. 4 is an SEM image of a light-emitting diode package (100) of the present embodiment corresponding to the 3rd to 7th experimental groups.

[0062] The light-emitting diode package (100) of the present embodiment, which is the third to seventh experimental group, has a light-transmitting member (120) comprising a light-transmitting resin (121), a wavelength conversion material (123), and a reinforcing filler (122). The reinforcing filler (122) has a long rod structure as shown in FIG. 4.

[0063] The reinforcing filler (122) content is 5 wt% for the third experimental group, 10 wt% for the fourth experimental group, 50 wt% for the fifth experimental group, 100 wt% for the sixth experimental group, and 150 wt% for the seventh experimental group.

[0064] Table 1 is the result of an experiment comparing the timing of cracks occurring in the light-transmitting members (11, 21, 120) of a conventional light-emitting diode package (10, 20) and a light-emitting diode package (100) of the present embodiment.

[0065] The experiment was conducted at 100°C with a current of 1000 mA provided to the light-emitting diode chips (110) of each experimental group.

[0066] Classification Experiment Time (hour) 500 1000 1500 2000 2500 3000 3500 Experiment Group 1 Pass Through Crack------Experiment Group 2 Pass Through Crack------Experiment Group 3 Pass Through Crack-----Experiment Group 4 Pass Through Crack------Experiment Group 5 Pass Through Pass Through Crack--Experiment Group 6 Pass Through Pass Through Pass Through Crack Experiment Group 7 Pass Through Pass Through Pass Through Crack

[0067] Looking at Table 1, cracks occurred in the light-transmitting members (11, 21, 120) in the first, second, and third experimental groups after 1,000 hours from the start of the experiment. From these experimental results, it can be seen that a general filler (22) that is not a long rod structure cannot prevent cracks from occurring in the light-transmitting member (21) and ultimately does not help improve the reliability of the light-emitting diode package (20). In addition, it can be seen that a light-emitting diode package with a reinforcing filler (122) content of 5 wt% or less does not have a significant difference in reliability compared to a conventional light-emitting diode package.

[0068] However, in all of the 4th to 7th experimental groups, cracks occurred after 1500 hours. Therefore, it can be seen that the reliability of the light-emitting diode package (100) of the present embodiment is improved compared to the conventional light-emitting diode package (10, 20) when the light-emitting diode package (100) includes a light-transmitting member (120) with a reinforcing filler (122) content of 10 wt% or more.

[0069] In addition, the crack initiation time for experimental group 5 is 2,500 hours, which is a significant difference from the crack initiation time of experimental group 4, which is 1,500 hours. Also, experimental groups 6 and 7 have a crack initiation time of 3,500 hours, which is a significant difference from the crack initiation time of experimental group 5, which is 2,500 hours.

[0070] However, if the content of the reinforcing filler (122) exceeds 200 wt%, the viscosity of the light-transmitting material becomes so high that it is difficult to mold, making it difficult to apply to experiments and packages.

[0071] Through this experiment, it can be seen that the reliability of the light-emitting diode package (100) is improved when the content of the reinforcing filler (122) of the light-emitting member (120) is 10 wt% or more and 200 wt% or less. Additionally, it can be seen that the reliability of the light-emitting diode package (100) is improved to a meaningful level compared to before when the content of the reinforcing filler (122) of the light-emitting member (120) is 50 wt% or more. Additionally, it can be seen that the reliability of the light-emitting diode package (100) is improved to a meaningful level compared to before when the content of the reinforcing filler (122) of the light-emitting member (120) is 100 wt% or more.

[0072] That is, in the light-emitting diode package (100) of the present embodiment, reliability is improved if the light-transmitting member (120) includes a reinforcing filler (122) with a content of 10 wt% or more and 200 wt% or less.

[0073] Furthermore, the reliability of the light-emitting diode package (100) can be further improved if the light-emitting member (120) contains a reinforcing filler (122) with a content of 50 wt% 200 wt% or less or 100 wt% 200 wt% or less.

[0074] Table 2 is an example diagram showing the luminous flux according to the reinforcing filler (122) content of the light-emitting diode package (100) of the present embodiment when a current of 350 mA is supplied to the light-emitting diode chip (110).

[0075] Luminous Flux (lm) Comparison Experiment 1 102.82 100% Experiment 3 102.61 99.8% Experiment 4 101.90 99.3% Experiment 5 100.57 98.7% Experiment 6 98.56 98.0% Experiment 7 95.41 96.8%

[0076] Referring to Table 2, the luminous flux of the first experimental group, which does not contain a filler, is reduced compared to the luminous flux of the third to seventh experimental groups, which contain a reinforcing filler (122). The third experimental group has a luminous flux difference of 0.2% compared to the first experimental group. The fourth experimental group has a luminous flux difference of 0.7% compared to the first experimental group and a luminous flux difference of 0.5% compared to the third experimental group. The fifth experimental group has a luminous flux difference of 1.3% compared to the first experimental group and a luminous flux difference of 0.6% compared to the fourth experimental group. The sixth experimental group has a luminous flux difference of 2% compared to the first experimental group and a luminous flux difference of 0.7% compared to the fifth experimental group. The 7th experimental group has a luminous flux difference of 3.2% with the 1st experimental group and a luminous flux difference of 1.2% with the 6th experimental group. The 3rd to 6th experimental groups, which have a luminous flux difference of 2% or less with the 1st experimental group, have a luminous flux reduction rate of 0.7% or less as the content of the reinforcing filler (122) increases. However, the 7th experimental group has a luminous flux difference of 1.2% with the 6th experimental group, so the luminous flux reduction rate increased rapidly.

[0077] Through this experiment, it can be seen that in order to minimize the reduction in light efficiency of the light-emitting diode package (100), the content of the reinforcing filler (122) of the light-transmitting member (120) must be 100 wt% or less.

[0078] That is, the reliability of the light-emitting diode package (100) according to an embodiment of the present invention is improved when the reinforcing filler (122) content of the light-transmitting member (120) is 10 wt% or more and 200 wt% or less.

[0079] In addition, the light-emitting diode package (100) according to an embodiment of the present invention has greater reliability when the reinforcing filler (122) content of the light-transmitting member (120) is 50 wt% or more and 200 wt% or less than when the reinforcing filler (122) content is less than 50 wt%.

[0080] In addition, when the reinforcing filler (122) content of the light-transmitting member (120) according to an embodiment of the present invention is 50 wt% or more and 100 wt% or less, the reduction in light efficiency is minimized and the reliability is greatly improved.

[0081] A light-emitting diode package (100) can be manufactured through the steps of preparing a support substrate (not shown), placing a light-emitting diode chip (110) on the support substrate, forming a light-transmitting member (120), polishing the upper surface of the light-transmitting member (120), singulating, and removing the support substrate.

[0082] First, a plurality of light-emitting diode chips (110) can be placed on a support substrate. At this time, the plurality of light-emitting diode chips (110) are placed spaced apart from each other.

[0083] Afterwards, a light-transmitting member (120) can be formed on a support substrate to cover a plurality of light-emitting diode chips (110).

[0084] Next, the upper surface of the light-transmitting member (120) can be polished. While polishing the upper surface of the light-transmitting member (120), the reinforcing filler (122) can be exposed through the upper surface of the light-transmitting member (120).

[0085] Next, the light-transmitting member (120) can be cut between multiple light-emitting diode chips (110) to singulate into individual light-emitting diode packages (100). At this time, as the light-transmitting member (120) is cut, the reinforcing filler (122) can be exposed through the side of the light-transmitting member (120).

[0086] Afterwards, the support substrate can be removed to manufacture the individual unit light-emitting diode package (100) shown in FIG. 1.

[0087] Subsequently, when describing a light-emitting diode package of another embodiment, descriptions of configurations that overlap with the light-emitting diode package of the previous embodiment are omitted or briefly described. Therefore, for detailed descriptions of configurations that have been omitted or briefly described, please refer to the description of the previous embodiment.

[0088] FIG. 5 is an exemplary diagram of a light-emitting diode package according to a second embodiment of the present invention.

[0089] A light-emitting diode package (200) according to a second embodiment includes a light-emitting diode chip (110), a light-transmitting member (120), and a barrier member (210).

[0090] The light-transmitting member (120) covers the side and top surfaces of the light-emitting diode chip (110). Additionally, the light-transmitting member (120) comprises a light-transmitting resin (121), a reinforcing filler (122), and a wavelength conversion material (123). The reinforcing filler (122) and the wavelength conversion material (123) are interspersed within the light-transmitting resin (121). Here, the wavelength conversion material (123) may be omitted depending on the wavelength of light emitted from the light-emitting diode chip (110).

[0091] The barrier member (210) is formed of a light-reflecting material and reflects light emitted from the light-emitting diode chip (110). For example, the barrier member (210) may be formed of silicone resin, epoxy resin, or a mixture thereof. Additionally, the barrier member (210) may include reflective materials such as TiO2, SiO2, and Al2O3 to improve light reflectivity.

[0092] According to the present embodiment, the barrier member (210) covers the side of the light-transmitting member (120) and exposes the upper surface of the light-transmitting member (120). That is, the barrier member (210) can reflect light emitted from the side of the light-emitting diode chip (110) and allow it to be emitted to the outside through the upper surface of the light-transmitting member (120). Accordingly, the barrier member (210) can prevent light loss through the side of the light-emitting diode package (200), thereby improving the light efficiency of the light-emitting diode package (200).

[0093] Additionally, the barrier member (210) can prevent external material from penetrating the light-transmitting member (120) and the light-transmitting diode chip (110) through the side of the light-transmitting diode package (200), thereby improving the reliability of the light-transmitting diode package (200).

[0094] Additionally, the barrier member (210) may include a reinforcing filler (122).

[0095] The barrier member (210) has a reduced degree of expansion or contraction due to temperature changes by means of a reinforcing filler (122) having a low coefficient of thermal expansion. Therefore, the barrier member (210) can fix the light-transmitting member (120) so that its length or volume does not change due to temperature changes. Additionally, the barrier member (210) can prevent the light-transmitting member (120) from peeling off from the light-emitting diode chip (110).

[0096] Additionally, the reinforcing filler (122) with a long rod structure can prevent external material from penetrating into the interior of the light-emitting diode package (200) through the barrier member (210). Furthermore, the reinforcing filler (122) with a long rod structure can prevent external material from reaching the light-transmitting member (120) by blocking the penetration path or increasing the penetration path even if it penetrates the barrier member (210).

[0097] Therefore, if the barrier member (210) includes a reinforcing filler (122), it is possible to prevent the components forming the light-emitting diode package (200) from deteriorating due to the influence of external materials.

[0098] In this embodiment, the barrier member (210) is described as including a reinforcing filler (122), but this embodiment is not limited thereto. If the reliability of the light-emitting diode package (200) is prevented from decreasing and external substances can be sufficiently prevented from penetrating into the interior even without the reinforcing filler (122), the reinforcing filler (122) may be omitted.

[0099] FIG. 6 is an exemplary diagram of a light-emitting diode package according to a third embodiment of the present invention.

[0100] In addition, FIG. 7 is an exemplary diagram of a light-emitting diode package according to a fourth embodiment of the present invention.

[0101] The light-emitting diode package (300, 400) according to the third and fourth embodiments includes a light-emitting diode chip (110), a light-transmitting member (120), and a barrier member (210).

[0102] A light-transmitting member (120) covers the upper surface of a light-emitting diode chip (110). Additionally, the light-transmitting member (120) comprises a light-transmitting resin (121), a reinforcing filler (122), and a wavelength-converting material (123). The reinforcing filler (122) and the wavelength-converting material (123) are interspersed within the light-transmitting resin (121). Here, the wavelength-converting material (123) may be omitted depending on the wavelength of light emitted from the light-emitting diode chip (110).

[0103] Referring to FIG. 6, the light-emitting diode package (300) of the third embodiment has a barrier member (210) covering the side of the light-emitting diode chip (110) and the side of the light-transmitting member (120).

[0104] Referring to FIG. 7, in the light-emitting diode package (400) of the fourth embodiment, a barrier member (210) is positioned below a light-transmitting member (120) to cover the side of a light-emitting diode chip (110). That is, in the light-emitting diode package (400) of the fourth embodiment, the light-transmitting member (120) covers both the upper surface of the light-emitting diode chip (110) and the upper surface of the barrier member (210).

[0105] The barrier member (210) is formed of a light-reflecting material and reflects light emitted from the light-emitting diode chip (110). For example, the barrier member (210) may be formed of silicone resin, epoxy resin, or a mixture thereof. Additionally, the barrier member (210) may include reflective materials such as TiO2, SiO2, and Al2O3 to improve light reflectivity.

[0106] Additionally, the barrier member (210) may have reinforcing fillers (122) scattered inside. The barrier member (210) can fix the light-transmitting member (120) so that its length or volume does not change with temperature changes by means of the reinforcing fillers (122). Additionally, the barrier member (210) can prevent external material from penetrating into the interior of the light-emitting diode package (300, 400) through the barrier member (210) by means of the reinforcing fillers (122).

[0107] According to the third and fourth embodiments, the barrier member (210) covers the side of the light-emitting diode chip (110) and reflects light emitted from the side of the light-emitting diode chip (110). The light emitted from the side of the light-emitting diode chip (110) can be reflected from the barrier member (210) and directed toward a light-transmitting member (120) located above the light-emitting diode chip (110).

[0108] Accordingly, the light-emitting diode package (300, 400) according to the third and fourth embodiments can have its light efficiency improved by preventing light from being lost through the side of the light-emitting diode package (300, 400) through the barrier member (210).

[0109] As explained above, the detailed description of the present invention has been made through embodiments with reference to the attached drawings, but since the above-described embodiments are merely preferred examples of the present invention, the present invention should not be understood as being limited only to the above-described embodiments, and the scope of the rights of the present invention should be understood as the claims set forth below and equivalent concepts.

Claims

1. A light-emitting diode chip that emits light; and A light-transmitting member covering at least the upper surface of the light-emitting diode chip and including a light-transmitting resin and a reinforcing filler; A light emitting diode package wherein the reinforcing filler has at least two sides having different lengths and is dispersed in the light-transmitting resin.

2. In claim 1, A light emitting diode package wherein the reinforcing filler comprises at least one of Si, Al, Fe, Ba, Ca, Mg, and Na components.

3. In claim 2, A light emitting diode package wherein the reinforcing filler comprises at least one of glass fibers composed of SiO2, Al2O3, MgO, CaO, Na2O, K2O and B2O3.

4. In claim 1, A light emitting diode package in which the content of the reinforcing filler is 10 wt% or more and 200 wt% or less of the light-transmitting resin.

5. In claim 1, The above light-emitting member is a light-emitting diode package that covers the side and upper surfaces of the light-emitting diode chip.

6. In claim 5, A light emitting diode package further comprising a barrier member that covers a side surface of the light emitting diode member and reflects light emitted from the side surface of the light emitting diode chip.

7. In claim 6, A light emitting diode package wherein the barrier member further comprises the reinforcing filler.

8. In claim 1, The above light-emitting member is a light-emitting diode package that covers the upper surface of the light-emitting diode chip.

9. In claim 8, A light emitting diode package further comprising a barrier member covering a side surface of the light emitting diode chip.

10. In claim 9, A light emitting diode package wherein the barrier member further comprises the reinforcing filler.

11. In claim 9, A light emitting diode package in which the above light-transmitting member further covers the upper surface of the above barrier member.

12. In claim 9, A light emitting diode package in which the above barrier member further covers the side of the above light transmitting member.

13. In claim 1, A light emitting diode package wherein the light-transmitting member further includes a wavelength conversion material dispersed in the light-transmitting resin.

14. In claim 1, A light emitting diode package in which the reinforcing filler is exposed through the upper surface and side surface of the light transmitting member.

15. In claim 1, The above light-emitting member is a light-emitting diode package in which the thickness from the side to the side of the light-emitting diode chip is thicker than the thickness from the top to the top surface of the light-emitting diode chip.