Electronic device having heat collection / diffusion structure

Abstract

An electronic device (100, 200, 300, 400, 500, 800, 900, 1000, 1200, 1300,1400, 1500, 1900, 2000, 2200, 2300, 2400, 2600) having an improved heating state is disclosed. The disclosed electronic device (100, 200, 300, 400, 500, 800, 900, 1000, 1200, 1300, 1400, 1500, 1900, 2000, 2200, 2300, 2400, 2600) can comprise: a housing (210) including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board (910) inserted between the first surface and the second surface; an electronic component (114, 912) disposed on the printed circuit board; a shielding structure (840, 920, 1020, 1220, 1320, 2540, 2640) mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device (100, 200, 300, 400, 500, 800, 900, 1000, 1200, 1300, 1400, 1500, 1900, 2000, 2200, 2300, 2400, 2600); and a heat pipe (450, 650, 750, 850, 950, 1050, 1350, 1450, 1550, 1650, 1750, 1850, 1920, 2020, 2120, 2250, 2350, 2550, 2650, 2750, 2850, 2950) including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure (840, 920, 1020, 1220, 1320, 2540, 2640), and the first end portion is disposed closer to the shielding structure (840, 920, 1020, 1220, 1320, 2540, 2640) than the second end portion. Additionally, other examples are possible. Figure 4