IC chip mounting apparatus and IC chip mounting method

Abstract

The present invention is an IC chip (C) mounting apparatus (1) for mounting an IC chip at a reference position (Pref) of an inlay antenna (AN) while conveying the antenna, the IC chip mounting apparatus including: a nozzle (32) configured to suck an IC chip when located at a first position (PA) and to place the IC chip at the reference position of the antenna when located at a second position (PK); a nozzle attachment (3H) to which the nozzle is attached; an image acquisition unit (CA3) configured to acquire an image of the IC chip sucked by the nozzle; and a correction amount determination unit (102) configured to determine correction amounts for the IC chip sucked by the nozzle (32), based on the image acquired by the image acquisition unit (CA3). The correctionamounts includes a first correction amount for correcting an angle of the nozzle around the axis, a second correction amount for correcting a position of the antenna in a conveying direction (D1) of the antenna, and a third correction amount for correcting the position of the antenna (AN) in a width direction (D2).

Description

IC chip mounting device and IC chip mounting method

[0001] The present invention relates to an IC chip mounting device and an IC chip mounting method.

[0002] With the widespread use of RFID tags, the production of sheet-like inlays, each having an antenna and an IC chip electrically connected to the antenna, is expanding. Manufacturing an inlay involves a process of placing a supplied IC chip on a predetermined reference position on an antenna formed on a base substrate, which serves as a reference for mounting the IC chip. It is known that the position of the IC chip is corrected to accurately mount the IC chip on the reference position of the antenna (see, for example, Japanese Patent Application Laid-Open No. 2008-123406). Japanese Patent Application Laid-Open No. 2008-123406 describes a mounting device equipped with a stage that moves a synchronized roller, which holds an IC chip by suction, back and forth and left and right relative to a film substrate.

[0003] However, the mounting device described in JP 2008-123406 A is limited to moving the synchronized rollers back and forth and left and right (i.e., X-axis and Y-axis) relative to the film substrate, and has limitations in terms of more accurate positioning relative to the antenna. Therefore, one aspect of the present invention aims to improve the accuracy of the mounting position of an IC chip when mounting an IC chip on an antenna during the inlay manufacturing process.

[0004] One aspect of the present invention is an IC chip mounting device for transporting an antenna for inlay and mounting an IC chip at a predetermined reference position on the antenna, the device comprising: a nozzle configured to suck an IC chip when the nozzle is at a first position and to place the IC chip at the reference position on the antenna when the nozzle is at a second position; a nozzle mounting part to which the nozzle is mounted; a first rotating part that rotates the nozzle about its axis; a second rotating part that rotates the nozzle mounting part so that the nozzle moves from the first position to the second position; a moving mechanism that moves the nozzle; and a mechanism for moving the IC chip mounted on the nozzle when the nozzle is at a predetermined position between the first position and the second position. an image acquisition unit that acquires an image of the chip; and a correction amount determination unit that determines, based on the image acquired by the image acquisition unit, the following correction amounts for the IC chip adsorbed to the nozzle: a first correction amount that is a correction amount for the angle around the axis of the nozzle, a second correction amount that is a correction amount for the position of the antenna in the transport direction, and a third correction amount that is a correction amount for the position in the width direction; wherein the first rotation unit rotates the nozzle around the axis based on the first correction amount, the second rotation unit rotates the nozzle attachment unit at an angular velocity adjusted based on the second correction amount, and the moving mechanism moves the nozzle in the width direction perpendicular to the transport direction of the antenna based on the third correction amount.

[0005] According to one aspect of the present invention, it is possible to improve the accuracy of the mounting position of an IC chip when the IC chip is mounted on an antenna in the inlay manufacturing process.

[0006] 14 is a plan view of an antenna according to an embodiment, and a partially enlarged view thereof before and after mounting an IC chip. FIG. 15 is a view showing an antenna sheet and a roll body around which the antenna sheet is wound. FIG. 16 is a view showing a portion corresponding to an IC chip placement step in an IC chip mounting device according to an embodiment. FIG. 17 is a view showing a chip-containing tape and an enlarged cross section thereof. FIG. 18 is a side view of a rotary mounter in an IC chip mounting device according to an embodiment. FIG. 19 is a plan view and a side view of a nozzle unit mounted on the rotary mounter. FIG. 19 is a view schematically explaining the relationship between the rotary mounter and the antenna sheet. FIG. 20 is a perspective view showing a state in which the chip-containing tape is separated by a separation roller. FIG. 21 is a view explaining the operation of supplying an IC chip from the chip-containing tape to the nozzle unit. FIG. 22 is a front view showing a widthwise movement mechanism of the rotary mounter. FIG. 23 is a functional block diagram of a control unit that controls the rotary mounter. FIG. 24 is a view showing an example of an image captured by an imaging device. FIG. 25 is a view illustrating an IC chip sucked to a nozzle before and after rotation of the nozzle. FIG. 26 is a view showing a portion corresponding to a curing step in an IC chip mounting device according to an embodiment. FIG. 27 is a view showing a part of a pressing unit and an ultraviolet irradiator as seen from arrow J in FIG. 25. FIG. 26 is a view showing a method of conveying an antenna sheet according to an embodiment. FIG. 27 is a view explaining an IC chip placement step according to an embodiment. 18 is a diagram illustrating a curing process according to an embodiment. FIG. 19 is a diagram illustrating a configuration example of an ultraviolet curing unit in FIG. 18. FIG.

[0007] The present invention is related to patent applications Nos. 2019-235370 and 2020-216369, filed with the Japan Patent Office on December 26, 2019 and December 25, 2020, respectively, the entire contents of which are incorporated herein by reference.

[0008] An IC chip mounting device and an IC chip mounting method according to an embodiment will be described below with reference to the drawings. The IC chip mounting device 1 according to the embodiment is a device that mounts an IC chip on a thin-film antenna when manufacturing a contactless communication inlay such as an RFID inlay. While FIG. 1 illustrates an exemplary antenna AN having a predetermined antenna pattern, the present invention is not limited to this antenna pattern. FIG. 1 also illustrates enlarged views of a portion E before and after an IC chip C is mounted on the antenna AN. In this example, the IC chip C is mounted at a predetermined reference position Pref that is determined in advance based on the antenna pattern. The IC chip C is extremely small, e.g., having a length and width of several hundred μm, and it is necessary to accurately mount this extremely small IC chip C at the reference position Pref.

[0009] Mounting an IC chip C on an antenna AN requires an IC chip placement process in which adhesive is applied toward the reference position Pref of the antenna AN and the IC chip C is placed on the adhesive, and a hardening process in which the adhesive is hardened to strengthen the connection between the antenna AN and the IC chip C.

[0010] In the IC chip placement process described below, as shown in FIG. 2 , a roll PR is installed, which is a roll of a strip-shaped antenna sheet AS (an example of an antenna continuum) on a substrate BM, on which multiple antennas AN are formed at a regular pitch. The antenna sheet AS is continuously drawn from the roll PR and fed into the IC chip placement line. The material of the substrate BM is not particularly limited, but examples include paper substrates such as fine paper, coated paper, and art paper; synthetic resin films made from PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), and PS (polystyrene); sheets combining multiple types of the above synthetic resins; and composite sheets combining synthetic resin films and paper. The antenna AN is formed, for example, by attaching a metal foil to the substrate BM, or by screen printing or vapor-depositing a conductive material in a predetermined pattern on the substrate BM.

[0011] In the following description, an XYZ coordinate system is defined as shown in Figure 2. In the following description, when referring to diagrams of the state in which the antenna sheet AS is arranged in each process, a view viewed in the YZ plane will be referred to as a front view, a view viewed in the XY plane as a plan view, and a view viewed in the XZ plane as a side view. The X direction is the direction in which the antenna sheet AS drawn out from the roll body PR is transported in each process described below, and is also referred to as the transport direction D1 as appropriate. The Y direction is the width direction of the antenna sheet AS, and is also referred to as the width direction D2 as appropriate. The Z direction is the direction perpendicular to the antenna sheet AS.

[0012] (1) IC Chip Placement Process The IC chip placement process will be described below with reference to Figures 3 to 10. Figure 3 is a diagram showing the portion of the IC chip mounting device 1 according to the embodiment that corresponds to the IC chip placement process. Figure 4 shows a plan view of the chip-containing tape CT and an enlarged view of its cross section A-A. In the IC chip placement process, the IC chip mounting device 1 can precisely place extremely small IC chips relative to the reference positions Pref (see Figure 1) of each antenna AN on the antenna sheet AS.

[0013] As shown in Figure 3, in the IC chip placement process, the IC chip mounting device 1 includes a conveyor 81, a dispenser 2, a rotary mounter 3, an ultraviolet irradiator 41, imaging devices CA1 to CA3, a tape feeder 71, a tape body take-up reel 72, a film take-up reel 73, and a separation roller 74.

[0014] The conveyor 81 (an example of a conveying unit) conveys the antenna sheet AS, which is drawn out from a roll PR (see FIG. 2), downstream in the process at a predetermined conveying speed. The upper surface of the conveyor 81 corresponds to the conveying surface. The dispenser 2 dispenses a fixed amount of anisotropic conductive paste (ACP; hereinafter simply referred to as "conductive paste") toward the reference position Pref of each antenna AN being conveyed. This conductive paste is an example of an ultraviolet-curing adhesive. The dispenser 2 is configured to adjust the dispensing position in the width direction in order to accurately position the dispensing position relative to the reference position Pref of each antenna AN.

[0015] The imaging device CA1 is provided upstream of the dispenser 2 and captures an image of a portion of each antenna AN near a reference position Pref in order to determine a position to apply the conductive paste. The imaging device CA2 is provided downstream of the dispenser 2 and captures an image of a portion of each antenna AN near the reference position Pref in order to inspect whether the conductive paste has been applied to each antenna AN and to inspect whether the conductive paste has been accurately applied to an area including the reference position Pref.

[0016] The rotary mounter 3 is a chip mounter that places IC chips on the conductive paste applied to each antenna AN and rotates counterclockwise in FIG. 3 . The rotary mounter 3 is attached to and suspended from a suspension plate 86. The suspension plate 86 is supported on a support base 85 so as to be movable in the Y direction. This allows the rotary mounter 3 to be suspended from above on the support base 85 and movable in the Y direction. As described below, the rotary mounter 3 picks up IC chips from the chip-containing tape and releases and places (mounts) the picked-up IC chips toward the reference positions Pref of each antenna AN on the antenna sheet AS. At this time, a process is performed to correct the position and orientation of the picked-up IC chips so that the IC chips are accurately placed at the reference positions Pref of the antennas AN. The imaging device CA3 captures an image of the IC chips in a state where they are attracted to a nozzle (described below) for a correction process to correct the position and orientation of the IC chips when mounting them on the antennas AN.

[0017] The tape feeder 71 is loaded with a wound chip-including tape containing IC chips, and is configured to sequentially draw out the chip-including tape in the direction of the arrow in FIG. 3 at a speed synchronized with the rotary mounter 3. Here, an example of the chip-including tape will be described with reference to FIG. 4 . As shown in FIG. 4 , the chip-including tape CT includes a tape main body T having recesses Td formed at regular intervals, each recess containing an IC chip C, and a covering film CF attached to the tape main body T so as to cover the recesses Td. The recesses Td are formed, for example, by embossing the tape main body T. An IC chip C is contained in each recess Td along the extension direction of the chip-including tape CT. Mounting holes H are formed at regular intervals along the extension direction of the chip-including tape CT. These mounting holes H are provided to accurately position the chip-including tape CT relative to the circumferential surface of the separation roller 74, and are inserted into protrusions 74p (described later) provided on the separation roller 74 when the chip-including tape CT is transported to the separation roller 74.

[0018] 4, suction holes Ts are formed between the bottom surface of the recess Td and the back surface (the surface opposite to the surface to which the covering film CF is adhered) of the tape main body T. The suction holes Ts are provided to allow the separation roller 74 to suck the IC chip C so that the IC chip C does not fall out of the recess Td when the covering film CF is peeled off.

[0019] 3 again, the separation roller 74 peels off the covering film CF from the chip-including tape CT supplied from the tape feeder 71 via one or more auxiliary rollers, separating the tape into the tape main body T and the covering film CF. The IC chips C exposed by the peeling off of the covering film CF are successively sucked by the nozzles provided in the rotary mounter 3. After the separation roller 74 separates the chip-including tape CT into the tape main body T and the covering film CF, the tape main body T is taken up onto the tape main body take-up reel 72 via one or more auxiliary rollers, and the covering film CF is taken up onto the film take-up reel 73 via one or more auxiliary rollers.

[0020] Next, the rotary mounter 3 will be described with reference to Figures 5 to 7. Figure 5 is a side view of the rotary mounter 3 in the IC chip mounting device 1 of the embodiment. Figure 6A is a plan view of the nozzle unit mounted on the rotary mounter 3. Figure 6B is a side view of the nozzle unit 30. Figure 7 is a diagram that schematically explains the relationship between the rotary mounter 3 and the antenna sheet AS.

[0021] As shown in Fig. 5, the rotary mounter 3 has a plurality of nozzle units 30-1 to 30-12 (12 in the illustrated example) arranged radially from a rotary head 3H (an example of a nozzle mounting portion). In the following description, when referring to matters common to the nozzle units 30-1 to 30-12, they will be collectively referred to as nozzle unit 30. Although the rotary head 3H is not shown in detail, it is connected to a rotary drive motor (rotary drive motor M31, described later) that rotates the nozzle units 30-1 to 30-12 counterclockwise in Fig. 5, a vacuum pump that adsorbs IC chips onto the nozzle unit 30, and a blower that releases IC chips from the nozzle unit 30.

[0022] 6 , the nozzle unit 30 includes a nozzle 32, a sleeve 33, a solenoid valve 35, and a cylinder drive motor M30. The nozzle 32 is provided at the tip of the nozzle unit 30 and is connected to the cylinder drive motor M30 inside the sleeve 33. The cylinder drive motor M30 (an example of a first rotating part) is a motor (e.g., a stepping motor) that rotates the nozzle 32 about its axis. The nozzle 32 has a passage formed therein that can communicate with an intake pipe 36 and an exhaust pipe 37. The intake pipe 36 and the exhaust pipe 37 are connected to the sleeve 33. The intake pipe 36 is connected to a vacuum pump (not shown), and the exhaust pipe 37 is connected to a blower (not shown). The solenoid valve 35 is, for example, a three-port solenoid valve, and is configured to open the passage 34 of the nozzle 32 and the intake pipe 36 and close the exhaust pipe 37, or to open the passage 34 of the nozzle 32 and the exhaust pipe 37 and close the intake pipe 36, depending on the state of current flowing through the solenoid valve 35. The solenoid valve 35 is configured to perform either a suction operation in which air is sucked by the nozzle 32 through the intake pipe 36, or a discharge operation in which air is discharged from the nozzle 32 through the exhaust pipe 37.

[0023] 7, the rotary head 3H is rotated counterclockwise by a rotary drive motor (not shown), thereby sequentially switching the position of each nozzle unit 30 on the circumference of the rotary head 3H. In other words, as the rotary head 3H rotates, a specific nozzle unit 30 moves along a circular orbit on a plane perpendicular to the conveyance surface, and is positioned in turn at each of the 12 positions PA to PL on the circumference of the rotary head 3H, starting from position PA in the counterclockwise direction and ending at position PL.

[0024] Here, position PA (an example of a first position) is a position where the nozzle unit 30 picks up a new IC chip C from the chip-containing tape CT. Position PE is a position where the imaging device CA3 captures an image of the IC chip C while it is being picked up by the nozzle of the nozzle unit 30. Position PK (an example of a second position) is a position where the picked-up IC chip C is released onto the conductive paste applied to the antenna AN on the transported antenna sheet AS. At position PK, the movement direction of the nozzle tip coincides with the transport direction D1 of the antenna sheet AS. At position PK, air is discharged from the nozzle of the nozzle unit 30 to release the IC chip C. At position PL, the IC chip C has already been released at position PK, so the nozzle unit 30 is not picking up an IC chip C. Note that at position PL, air may be discharged from the nozzle to remove any dust that may adhere to the nozzle. Figure 7 shows an example in which a dust collection tray TR is placed at position PL to collect dust that may be released from the nozzle.

[0025] 7, the nozzle unit 30-1 at position PA picks up a new IC chip C there, rotates counterclockwise while still holding the IC chip C, and when it reaches position PK, it releases the IC chip C, and when it returns to position PA, it picks up a new IC chip C. This IC chip mounting method allows IC chips to be continuously placed on each antenna AN without stopping the transport of the antenna sheet AS, resulting in high productivity.

[0026] The angular velocity of the rotary head 3H and the conveying speed of the antenna sheet AS are set or controlled so that the nozzle units 30 that reach position PK in sequence emit IC chips C toward the reference positions Pref of each antenna AN of the antenna sheet AS being conveyed from upstream. In order to reliably position the IC chips C, it is preferable to provide a section in which the speed of the tip of the nozzle unit 30 near position PK and the conveying speed of the antenna sheet AS are equal.

[0027] In this embodiment, an example is shown in which twelve nozzle units 30 are arranged on the rotary head 3H, but this is not limitative. The number of nozzle units 30 arranged on the rotary head 3H can be set as desired.

[0028] Next, the operation of adsorbing the IC chip C by the nozzle unit 30 will be described with reference to Figures 8 and 9. Figure 8 is a perspective view showing the state in which the chip-containing tape CT is separated by the separation roller 74. Figure 9 is a side view of the vicinity of the separation roller 74, and is a diagram illustrating the operation in which the IC chip C is supplied from the chip-containing tape CT to the nozzle unit 30. In Figure 9, only the chip-containing tape CT is shown in cross section so that the state of the chip-containing tape CT can be seen.

[0029] 8, the protrusion 74p of the separation roller 74 is inserted into the mounting hole H of the chip-containing tape CT supplied from the tape feeder 71, and the chip-containing tape CT is then fed while being positioned in the width direction of the tape. At this time, the covering film CF of the chip-containing tape CT is peeled off by the branching member 75 and directed toward the film take-up reel 73. Meanwhile, the tape body T of the chip-containing tape CT is directed toward the tape body take-up reel 72.

[0030] 9, the IC chip C exposed by peeling off the cover film CF is immediately sucked by the nozzle unit 30. At this time, to prevent the IC chip C from falling during the short time between when the IC chip C is exposed and when it is sucked by the nozzle unit 30, the separation roller 74 is provided with a suction path (not shown) for sucking the IC chip C toward the center of rotation of the separation roller 74. The IC chip C is sucked through this suction path and suction holes Ts (see FIG. 4) provided in the tape main body T.

[0031] Next, referring to FIG. 10 , the movement mechanism 8 that moves the rotary head 3H in the width direction D2 will be described. FIG. 10 is a front view of the movement mechanism 8. The movement mechanism 8 is provided to enable correction of the position of the IC chip C absorbed by the nozzle unit 30 in the width direction D2. As shown in FIG. 10 , the movement mechanism 8 includes a bearing 76, a shaft 77, a suspension plate 86, a guide plate 87, a slider 88, and a width direction drive motor M32. The bearing 76, the shaft 77, and the width direction drive motor M32 are mounted on a support base 85. The shaft 77 is a rod-shaped member having a threaded portion and is rotated by the width direction drive motor M32. The shaft 77 is rotatably supported by bearings 76 (two locations) fixed to the upper surface of the support base 85. The rotary head 3H is attached to the suspension plate 86. A threaded hole (not shown) is formed in the upper end of the suspension plate 86, and this hole fits into the threaded portion of the shaft 77. Therefore, the suspension plate 86 and the rotary head 3H attached to the suspension plate 86 can move in the width direction D2 in response to the rotation of the shaft 77. Note that a hollow portion is provided in the upper part of the support base 85 and the guide plate 87 within the movable range of the suspension plate 86 in the width direction D2. The slider 88 is attached to the suspension plate 86 and slides on the upper surface of the guide plate 87 in response to the movement of the suspension plate 86 in the width direction D2. With the above-described configuration, the movement mechanism 8 can displace the rotary head 3H in the width direction D2 in response to the rotational drive of the width direction drive motor M32.

[0032] In this embodiment, an example is shown in which the nozzle units 30 attached to the rotary head 3H are moved in the width direction D2 by moving the rotary head 3H in the width direction D2 using the movement mechanism 8, but this is not limiting. For example, the rotary head may be configured so that each nozzle unit 30 can be individually displaced in the width direction D2 inside the rotary head without moving the rotary head in the width direction D2.

[0033] Referring again to FIG. 3 , an ultraviolet irradiator 41 is provided near the position where an IC chip is released from the nozzle unit 30 of the rotary mounter 3 onto the antenna AN (position PK in FIG. 7 ). The ultraviolet irradiator 41 is configured to irradiate ultraviolet light onto the conductive paste on the transported antenna AN. The purpose of ultraviolet light irradiation by the ultraviolet irradiator 41 is different from the purpose of ultraviolet light irradiation performed in the curing process (described below), which is a process subsequent to the IC chip placement process, and is intended to adjust the viscosity of the conductive paste on the antenna AN. From this perspective, it is preferable that the integrated amount of ultraviolet light applied to the conductive paste by the ultraviolet irradiator 41 be less than the integrated amount of ultraviolet light applied to the conductive paste in the subsequent curing process. Since the integrated amount of ultraviolet light is expressed as the product of the light intensity and the irradiation time, the integrated amount of light can be adjusted by adjusting at least one of the light intensity and the irradiation time.

[0034] In the IC chip mounting device 1 of this embodiment, a thermosetting adhesive such as epoxy resin may be applied to the antenna AN by the dispenser 2, and a thermosetting device may be provided instead of the ultraviolet irradiator 41.

[0035] In FIG. 3 , the ultraviolet irradiator 41 is positioned to irradiate ultraviolet light after the IC chip is placed, but this is not limited thereto. The ultraviolet irradiator 41 may be positioned to irradiate ultraviolet light before the IC chip is placed, or may be positioned to irradiate ultraviolet light simultaneously with the IC chip being placed. When ultraviolet light is irradiated after the IC chip is placed, the viscosity of the conductive paste is reduced, making it less likely for the IC chip to shift or tilt after being placed on the conductive paste. When ultraviolet light is irradiated before or simultaneously with the IC chip being placed, the IC chip is placed on conductive paste with reduced viscosity, making it less likely for the IC chip to move after being placed on the conductive paste, making it less likely for the IC chip to shift or tilt. In either case, irradiating ultraviolet light near the position where the IC chip is placed can prevent the IC chip from becoming unstable on the conductive paste due to the fluidity of the conductive paste. In other words, irradiation by the ultraviolet irradiator 41 has the advantage of improving the accuracy of IC chip placement.

[0036] Next, control performed by the control unit 100 that controls the rotary mounter 3 will be described with reference to FIGS. 11 to 13. FIG. 11 is a functional block diagram of the control unit 100. FIG. 12 shows an example of an image captured by the imaging device CA1. FIG. 13 is a diagram illustrating an IC chip C sucked onto the nozzle 32 before and after rotation of the nozzle 32. The state before rotation of the nozzle in FIG. 13 shows an example of an image captured by the imaging device CA3. The state after rotation of the nozzle in FIG. 13 shows the X, Y, and Z axes when the nozzle is at position PK (see FIG. 7).

[0037] The control unit 100 is mounted on a circuit board (not shown) and is electrically connected to the imaging devices CA1 to CA3, the dispenser 2, the cylinder drive motor M30, the rotation drive motor M31, the width direction drive motor M32, the solenoid valve 35, and the ultraviolet irradiator 41. The rotation drive motor M31 (an example of a second rotation unit) is a drive means that rotates the nozzle units 30-1 to 30-12 in the rotary head 3H. The control unit 100 includes a microcomputer, memory (RAM (Random Access Memory), ROM (Read Only Memory)), storage, and a group of drive circuits. The microcomputer reads and executes programs recorded in the memory to realize the functions of the ejection position adjustment means 101, the IC chip correction means 102, the valve control means 103, and the curing execution means 104.

[0038] The discharge position adjustment means 101 has a function of determining the discharge position of the conductive paste based on an image captured by the imaging device CA1 and adjusting the discharge timing of the conductive paste and the position of the dispenser 2 in the width direction D2. The method of determining the discharge position of the conductive paste is as follows, with reference to FIG. 12 . The image captured by the imaging device CA1 is an image of a portion of the antenna AN near a reference position Pref, as exemplified in FIG. 12 . The discharge position adjustment means 101 identifies the reference position Pref from a characteristic portion of the shape included in the image. Specifically, the discharge position adjustment means 101 analyzes the shape of the antenna AN in the image of FIG. 12 , identifies reference lines L1 and L2 that are parallel to each other in the X direction, and reference lines L3 and L4 that are parallel to each other in the Y direction, and identifies the intersection of the center line of the reference lines L1 and L2 and the center line of the reference lines L3 and L4 as the reference position Pref.

[0039] The point Pj1 in the image of FIG. 12 is the target position of the reference position Pref on the image, and is a position determined in advance based on the results of calibration between the image captured by the imaging device CA1 and the conductive paste dropping position of the dispenser 2. That is, by adjusting the discharge timing and the position in the width direction D2 of the dispenser 2 so that the reference position Pref identified on the image coincides with the target position Pj1, the conductive paste can be applied to the actual reference position of the antenna AN. In the example of FIG. 12, in order for the reference position Pref identified on the image to coincide with the target position Pj1, the position needs to be adjusted by x1 in the X direction and y1 in the Y direction. Specifically, the discharge timing from the dispenser 2 is determined based on x1, taking into account the transport speed of the antenna AN, and the displacement of the dispenser 2 in the width direction D2 is performed based on y1. That is, the discharge position adjustment unit 101 transmits a control signal to the dispenser 2 to instruct the discharge timing and the displacement in the width direction D2, and the dispenser 2 performs a discharge operation based on the control signal.

[0040] The image captured by the imaging device CA2 is the same as that shown in FIG. 12, except that the conductive paste has been applied.

[0041] The IC chip correction means 102 has a function of correcting the IC chip sucked by the nozzle 32. The IC chip correction method is as follows, with reference to FIGS. 12 and 13 . As shown in the state before rotation in FIG. 13 , the image captured by the imaging device CA3 (an example of an image acquisition unit) includes the nozzle end 32e of the nozzle 32 and the IC chip C sucked by the nozzle end 32e. Point Pc1 is the center position of the IC chip C before the nozzle rotates. Point Pj2 in the image in FIG. 13 is the target position for the center position of the IC chip C on the image, and is set to coincide with the target position Pj1 in FIG. 12 . In other words, by matching the center position of the IC chip C with the target position Pj1, the IC chip C can be placed at the reference position of the actual antenna AN to be transported.

[0042] The center of rotation Prc around the axis of the nozzle 32 is not the theoretical center of rotation of each nozzle due to variations in the installation of the nozzle units 30-1 to 30-12. The center of rotation Prc differs for each nozzle unit and is identified, for example, based on previously obtained measurement data. First, when the center Pc1 of the IC chip C shown in the image is rotated around the center of rotation Prc around the axis of the nozzle 32, the amount of rotation is determined until the reference line of the IC chip C (for example, the reference edge Sc of the IC chip C in FIG. 13) becomes parallel to the Y direction. In the example of the state after rotation shown in FIG. 13, the IC chip C in the captured image is rotated around the center of rotation Prc so that the reference edge Sc of the IC chip C becomes parallel to the Y direction. The rotation angle at this time is identified as the correction amount (an example of a first correction amount) for the rotation direction of the IC chip C. Here, if the center position of the IC chip C after movement is set to point Pc2, in order to align point Pc2 with the target position Pj2, the correction amount in the X direction (an example of the second correction amount) is specified as x2, and the correction amount in the Y direction (an example of the third correction amount) is specified as y2.

[0043] The IC chip correction means 102 sends a control signal corresponding to the amount of correction in the rotational direction of the nozzle 32 about its axis to the cylinder drive motor M30, thereby rotating the nozzle 32 about its axis from position PE (the position imaged by the imaging device CA3) to position PK where the IC chip is released. The IC chip correction means 102 sends a control signal corresponding to the X-direction correction amount x2 to the drive circuit that drives the rotation drive motor M31, thereby adjusting the angular velocity of the rotary head 3H. The IC chip correction means 102 sends a control signal corresponding to the Y-direction correction amount y2 to the drive circuit that drives the width direction drive motor M32, thereby adjusting the position of the rotary head 3H in the width direction D2. Adjusting the position of the rotary head 3H in the width direction D2 also adjusts the position of the nozzle 32 in the width direction D2.

[0044] In the IC chip mounting device 1 of this embodiment, the IC chip correction means 102 corrects the position of the IC chip in the X direction and Y direction, and the orientation of the IC chip in a plane perpendicular to the axis of the nozzle, which has the advantage of very high mounting accuracy relative to the reference position of the IC chip antenna.

[0045] The valve control means 103 controls each solenoid valve 35 of the 12 nozzle units 30-1 to 30-12 included in the rotary mounter 3 so as to perform either suction or exhaust air from each nozzle unit 30 depending on the position of each nozzle unit 30. Specifically, the valve control means 103 controls the solenoid valve 35 so as to suck air from the nozzle unit 30 when the nozzle unit 30 is located at positions PA to PJ (see FIG. 7), and controls the solenoid valve 35 so as to exhaust air from the nozzle unit 30 when the nozzle unit 30 is located at positions PK and PL.

[0046] The curing execution means 104 sends a predetermined drive signal to the ultraviolet irradiator 41 so that ultraviolet light is irradiated from the ultraviolet irradiator 41 at a preset integrated light amount to each of the carried antennas AN.

[0047] (2) Hardening Step Next, the hardening step will be described with reference to Fig. 14 and Fig. 15. In the hardening step, the conductive paste applied to each antenna that has undergone the IC chip placement step described above is hardened to strengthen the physical connection between the antenna and the IC chip, and to ensure electrical continuity between the antenna and the IC chip.

[0048] 14 is a diagram showing a portion corresponding to the curing step in the IC chip mounted device 1 of the embodiment. FIG. 15 is a diagram showing a part of the pressing unit 6 and the ultraviolet irradiator 42 as seen from the arrow J in FIG.

[0049] As shown in Figure 14, the IC chip mounting device 1 in the curing process includes a conveyor 82, a curing device 4, and an imaging device CA4. The conveyor 82 transports the antenna sheet AS, which is transported from the upstream IC chip placement process, downstream at a predetermined transport speed. The imaging device CA4 is located above the antenna sheet AS at the most upstream side in the curing process (i.e., the most downstream side in the IC chip placement process), and captures images of each antenna AN transported from the IC chip placement process. The imaging device CA4 is provided to inspect whether the IC chips are placed in the appropriate positions in the IC chip placement process.

[0050] As shown in Figure 14, the curing device 4 has one or more pressing units 6 and ultraviolet irradiators 42. The pressing units 6 move up and down in a direction perpendicular to the conveyance surface, pressing the IC chips placed on the conductive paste of the antennas AN while irradiating each antenna AN with ultraviolet light. The number of pressing units 6 is not important, but can be set to any number from the standpoints of productivity and cost. The ultraviolet irradiators 42 are arranged along the conveyance direction D1. Therefore, it is possible to simultaneously irradiate ultraviolet light to many antennas AN on the antenna sheet AS.

[0051] FIG. 15 shows the state in which ultraviolet light is irradiated onto each antenna AN by the ultraviolet irradiator 42. As shown in FIG. 15, the pressing unit 6 has a structure in which a pressing portion 61 is attached to the tip of a shaft 63. The side of the pressing portion 61 of the pressing unit 6 (i.e., the side on which the ultraviolet irradiator 42 is disposed) is open. The glass plate 61p constituting the pressing surface of the pressing portion 61 is formed of glass that transmits ultraviolet light. The ultraviolet irradiator 42 has a light source 42e, such as an LED (Light Emitting Device). The light source 42e is configured to irradiate ultraviolet light toward the antenna AN from a direction oblique to the conveyance plane. By irradiating ultraviolet light while pressing the IC chip on the conductive paste applied to each antenna AN, the conductive paste applied to each antenna AN hardens, strengthening the physical connection between the antenna and the IC chip and ensuring electrical continuity between the antenna and the IC chip.

[0052] As described above, a strip-shaped antenna sheet having a plurality of antennas formed on a substrate at a fixed pitch is fed into the line, and an IC chip is mounted on each antenna through an IC chip placement process and a curing process. In the IC chip placement process, the IC chip mounting device of this embodiment applies adhesive toward the antenna's reference position and places the IC chip on the adhesive, and then hardens the adhesive in the curing process to strengthen the connection between the antenna and the IC chip. Particularly in this embodiment, in the IC chip placement process, the position of the IC chip in the X and Y directions and the orientation of the IC chip in a plane perpendicular to the axis of the nozzle that sucks the IC chip are corrected. This improves the accuracy of the IC chip mounting position when the IC chip is mounted on the antenna.

[0053] Although the embodiments of the IC chip mounting device and IC chip mounting method have been described above, the present invention is not limited to the above-described embodiments. Furthermore, the above-described embodiments can be improved or modified in various ways without departing from the spirit of the present invention.

[0054] For example, in the embodiment shown in FIG. 3, the antenna sheet AS is transported in one direction on the conveyor 81 during the IC chip placement process, but this is not limited to this. In one embodiment, as shown in FIG. 16, the antenna sheet AS may be transported using suction drums 92 and 94 and multiple transport rollers (e.g., transport rollers 91, 93, and 95 in FIG. 17) during the IC chip placement process. In FIG. 16, the dispenser 2 dispenses conductive paste at the reference position of the antenna AN on the antenna sheet AS at the highest position of the suction drum 92. Furthermore, the IC chip is placed on the conductive paste at the highest position of the suction drum 94. In this case, it is preferable that at least the suction drums 92 and 94 are suction rollers that adsorb the back surface of the antenna sheet AS. This prevents misalignment of the antenna sheet AS (especially in the longitudinal direction), allowing for accurate discharge of the conductive paste and placement of the IC chip.

[0055] In one embodiment, instead of releasing the IC chip onto the conductive paste applied to the antenna AN of the transported antenna sheet AS, the IC chip may be placed by pressing it against the conductive paste. FIG. 17 shows a time series of the operation of the rotary mounter 3 when placing the IC chip by pressing it against the conductive paste. In one embodiment, each nozzle unit 30 of the rotary mounter 3 is configured to be individually movable in the radial direction (diameter direction) by a built-in drive device. State ST1 is a state in which the nozzle unit 30 has adsorbed an IC chip C. To place the adsorbed IC chip C, as shown in state ST2, the nozzle unit 30 is moved toward the reference position (i.e., downward, i.e., in the Z direction in FIG. 2 ) so as to extend in the radial direction (diameter direction), and the IC chip C is placed on the conductive paste by pressing it against the conductive paste applied to the antenna AN. After placing the IC chip C, adsorption is released, and the nozzle unit 30 is returned to the position of state ST1. For example, by performing the operations of states ST1 to ST3 at the timing when the nozzle unit 30 reaches position PK (see FIG. 7), the IC chip C is placed on the conductive paste applied to the antenna AN.

[0056] The curing process of one embodiment is shown in Figure 18. Figure 18 shows a curing device 4A used in the curing process of one embodiment. The curing device 4A has multiple UV curing units 43 removably attached to a mounting plate 44. Multiple mounting plates 44 with different mounting positions are prepared according to the spacing between adjacent antennas AN on the antenna sheet AS, and by replacing the mounting plate 44 according to the spacing, it is possible to accommodate various antenna sheets AS. A support shaft 45 supports the mounting plate 44 and is configured to be able to raise and lower the mounting plate 44. The antenna sheet AS transported from the IC chip placement process is sent to the curing process via transport rollers 96 to 98. The transport roller 97 is configured to be able to raise and lower by a drive device (not shown).

[0057] An example configuration of the ultraviolet curing unit 43 is shown in FIG. 19. As shown in FIG. 19, the ultraviolet curing unit 43 incorporates a light source 432 (e.g., an LED light source) for irradiating ultraviolet light within a housing 431. The light source 432 is supplied with power via a cable 436 (not shown in FIG. 18) provided from outside the ultraviolet curing unit 43. A condenser lens for condensing the ultraviolet light irradiated by the light source 432 may be provided within the housing 431. A holding plate 434 is connected to the housing 431 and holds a glass plate 435. The ultraviolet light irradiated from the light source 432 is irradiated onto the conductive paste applied to each antenna AN, curing the conductive paste.

[0058] 18 again, the conveying state shows the state in which the antenna sheet AS is conveyed from the IC chip placement process. The conveyance of the antenna sheet AS is stopped when the antenna AN, on which the uncured conductive paste is applied, is positioned directly below the ultraviolet curing unit 43. Then, with the conveyance of the antenna sheet AS stopped (stopped state), the ultraviolet curing unit 43 is moved downward, and ultraviolet light is irradiated onto the antenna AN while it is pressed by the glass plate 435, thereby curing the conductive paste.

[0059] Even when the conveyor is stopped, the antenna sheet AS is conveyed from the IC chip placement process, and the conveyor roller 97 descends under its own weight while ultraviolet light is being irradiated, absorbing the conveyed antenna sheet AS between the conveyor rollers 96 and 98. When ultraviolet light irradiation is completed, the antennas AN corresponding to the number of ultraviolet light curing units 43 are rapidly conveyed downstream, and the uncured antennas AN are stopped so that they are positioned directly below the ultraviolet light curing units 43. In other words, in the curing process of one embodiment, the conveying state and the stopped state (state in which ultraviolet light is being irradiated) of the antenna sheet AS are repeated. When the antennas AN are rapidly conveyed, the conveyor roller 97 rises due to the tension applied to the antenna sheet AS.

[0060] In one embodiment, the curing process may be performed using a thermal curing device. That is, if a thermosetting adhesive such as an epoxy resin is applied in the dispenser 2, the adhesive is cured by a thermal curing process. Similar to FIG. 18 , FIG. 20 illustrates a curing device 4B configured to repeatedly convey and stop the antenna sheet AS. Unlike the curing device 4A, the curing device 4B includes multiple thermal curing units 46. Each thermal curing unit 46 is provided with a heat source that is powered by a cable (not shown). When the antenna sheet AS is stopped, the support shaft 45 is driven downward, and each thermal curing unit 46 presses the corresponding antenna AN to heat and cure the adhesive. When heating is complete, the support shaft 45 is driven upward, and the antenna sheet AS is conveyed.

[0061] 18, when the conductive paste is cured with ultraviolet light, instead of the ultraviolet curing unit 43 with a built-in light source, a pressing unit that presses the antenna AN through a glass plate may be used, and an ultraviolet irradiation device may be provided that irradiates ultraviolet light from the outside in the width direction or from diagonally above the conductive paste on the stopped and pressed antenna AN. In one embodiment, to prevent the antenna sheet AS from being stopped when irradiating ultraviolet light, multiple ultraviolet curing units 43 may be circulated in conjunction with the moving speed of the antenna sheet AS, and ultraviolet light may be irradiated from the built-in light source while pressing the antenna AN. Similarly, in one embodiment, when the conductive paste is thermally cured, multiple thermal curing units 46 may be circulated in conjunction with the moving speed of the antenna sheet AS, and heat the antenna AN while pressing it.

Claims

1. An IC chip mounting device for transporting an antenna for inlay and mounting an IC chip at a predetermined reference position on the antenna, comprising: a nozzle configured to pick up an IC chip when in a first position and to place the IC chip at the reference position on the antenna when in a second position; a nozzle mounting section to which the nozzle is attached; a first rotation section that rotates the nozzle about its axis; a second rotation section that rotates the nozzle mounting section so that the nozzle moves from the first position to the second position; a movement mechanism that moves the nozzle; an image acquisition section that acquires an image of the IC chip attracted to the nozzle when the nozzle is in a predetermined position between the first position and the second position; and a correction amount determination section that determines, based on the image acquired by the image acquisition section, the following correction amounts for the IC chip attracted to the nozzle: a first correction amount that is the correction amount for the angle around the axis of the nozzle, a second correction amount that is the correction amount for the position of the antenna in the transport direction, and a third correction amount that is the correction amount for the position in the width direction. the first rotation unit rotates the nozzle about its axis based on the first correction amount; the second rotation unit rotates the nozzle attachment unit at an angular velocity adjusted based on the second correction amount; and the movement mechanism moves the nozzle in a width direction perpendicular to a transport direction of the antenna based on the third correction amount.

2. An IC chip mounting device as described in claim 1, comprising: a conveying unit that conveys an antenna continuum on which a plurality of said antennas are successively formed on a predetermined conveying surface; and said second rotating unit that rotates said nozzle mounting unit so that said nozzle moves in a circular orbit on a plane perpendicular to said conveying surface and so that the direction of movement of said nozzle when said nozzle is in said second position coincides with the conveying direction of said antenna continuum.

3. An IC chip mounting device according to claim 1 or 2, wherein a plurality of nozzles are attached to the nozzle attachment section, and the second rotating section rotates the nozzle attachment section, causing each nozzle to move in turn from the first position to the second position, and placing an IC chip at the reference position of each antenna of the transported antenna continuum.

4. An IC chip mounting device according to any one of claims 1 to 3, wherein a plurality of nozzles are attached to the nozzle attachment section, the correction amount determination section determines the first correction amount corresponding to each nozzle, and the first rotation section rotates the corresponding nozzle around its axis based on the first correction amount determined corresponding to each nozzle.

5. The IC chip mounting device according to any one of claims 1 to 4, wherein the movement mechanism moves the nozzle in the width direction by moving the nozzle attachment part in the width direction.

6. An IC chip mounting device according to any one of claims 1 to 5, wherein the nozzle mounting portion is suspended from a support base.

7. The IC chip mounting device according to any one of claims 1 to 6, wherein the nozzle disposes the IC chip at the reference position of the antenna by discharging the IC chip toward the reference position of the antenna.

8. An IC chip mounting device according to any one of claims 1 to 6, wherein the movement mechanism further moves the nozzle while it is holding an IC chip by suction, thereby bringing the IC chip closer to the antenna, and disposing the IC chip at the reference position of the antenna by releasing the nozzle from suction on the IC chip when the nozzle is at the reference position.

9. An IC chip mounting method for transporting an antenna for inlay and mounting an IC chip at a predetermined reference position of the antenna, comprising: when a nozzle attached to a nozzle mounting part is at a first position, adsorbing an IC chip using the nozzle; rotating the nozzle mounting part so as to move the nozzle from the first position toward a second position; acquiring an image of the IC chip adsorbed to the nozzle when the nozzle is at a predetermined position between the first position and the second position; determining, based on the acquired image, correction amounts for the IC chip adsorbed to the nozzle, a first correction amount which is a correction amount for the angle around the axis of the nozzle, a second correction amount which is a correction amount for the position of the antenna in the transport direction, and a third correction amount which is a correction amount for the position in the width direction perpendicular to the transport direction; rotating the nozzle around the axis based on the first correction amount; rotating the nozzle mounting part at an angular velocity adjusted based on the second correction amount; and moving the nozzle in the width direction based on the third correction amount. and disposing the IC chip sucked by the nozzle at the reference position of the antenna when the nozzle is at a second position.

10. A method for mounting an IC chip for inlay according to claim 9, comprising: transporting an antenna continuum on which a plurality of said antennas are successively formed on a predetermined transport surface; rotating said nozzle attachment part so that said nozzle moves in a circular orbit on a plane perpendicular to said transport surface, and the direction of movement of said nozzle when said nozzle is in said second position coincides with the direction of transport of said antenna continuum.

11. An IC chip mounting method according to claim 9 or 10, wherein a plurality of nozzles are attached to the nozzle attachment part, the nozzle attachment part is rotated so that each nozzle moves in turn from the first position to the second position, and when each nozzle is at the second position, an IC chip is placed at the reference position of each antenna of the antenna continuum being transported by each nozzle.

12. An IC chip mounting method according to any one of claims 9 to 11, wherein a plurality of nozzles are attached to the nozzle attachment portion, the first correction amount is determined for each nozzle, and the corresponding nozzle is rotated around its axis based on the first correction amount determined for each nozzle.

13. The IC chip mounting method according to any one of claims 9 to 12, wherein the nozzle is moved in the width direction by moving the nozzle attachment part in the width direction.

14. An IC chip mounting method according to any one of claims 9 to 13, wherein arranging the IC chip at the reference position of the antenna is performed by discharging the IC chip from the nozzle toward the reference position of the antenna.

15. An IC chip mounting method according to any one of claims 9 to 13, wherein the IC chip is placed at the reference position of the antenna by moving the nozzle while it is holding the IC chip by suction, bringing the IC chip close to the antenna, and then releasing the nozzle from suction to the IC chip when it reaches the reference position.