Method of dividing packaged substrate

Abstract

A method of dividing a packaged substrate (100) includes a first measuring step of measuring the height of an upper surface (117) of the packaged substrate (100) held on a holding table (10), thereby generating first height data, a half-cut groove forming step of forming a half-cut groove (201) in the packaged substrate (100) with a first cutting blade (21) that has been positioned at a height for forming a groove having a predetermined depth (142), on the basis of the first height data, a burr reducing step of positioning a deburring tool at a predetermined height from the upper surface (117) of the packaged substrate (100) on the basis of the first height data and moving the deburring tool and the holding table (10) relatively to each other to reduce the heights of burrs (300) developed around the half-cut groove (201), and a dividing step of dividing the packaged substrate (100) into a plurality of chips (140) with a second cutting blade (22) having a smaller edge thickness (26) than a width of the half-cut groove (201). The most suitable drawing: FIG. 5