Resin molding apparatus and method of manufacturing resin molded product

MY214963AActive Publication Date: 2026-08-18TOWA
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Patent Information

Application Number
MYPI2021004830
Authority / Receiving Office
MY · MY
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-08-25
Filing Date
2021-08-24
Publication Date
2026-08-18
Estimated Expiration
2041-08-24
Patent Text Reader

Abstract

A resin molding apparatus (110) includes: a first molding mold (110D) provided with a first member (113) and a second member (112) configured to move relative to the first member (114), and configured to form a cavity (110C) by the first member (113) and the second member (112); a second molding mold (110U) configured to hold a substrate (10); and a mask member (130) so as to be relatively immovable with respect to the first member (113), configured to make contact with a portion of the substrate (10) when the first molding mold (110D) and the second molding mold (110U) are clamped, and formed with a flow portion (132) through which a resin material (30) existing in the cavity (110C) and pressurized by the second member (112) is capable of flowing.
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