Surface mountable light emitting diode package with inclined light emitting surface

Abstract

A surface mountable light emitting diode (LED) package with inclined light emitting surface is presented herein. An optoelectronic component (e.g., 710, 720, 730) comprises the surface mountable package (102), which comprises a top surface (112), a cavity, and a mounting surface (114) that is parallel to the top surface (112) to facilitate an attachment, via an automatic surface mount technology pick-and-place equipment, of the mounting surface (114) to a printed circuit board of the optoelectronic component (e.g., 710, 720, 730). The cavity comprises a material that facilitates a transmission of electromagnetic radiation comprising visible light and infrared light, optoelectronic device(s) positioned within the cavity that generate and / or receive the electromagnetic radiation, and a light emitting surface that is adjacent to the top surface (112) and that is inclined at an angle relative to a vertical axis of a plane of the top surface (112) to facilitate, via the material, a transmission / reception of the electromagnetic radiation from / by the optoelectronic device(s).