Wafer-level reflow soldering equipment

Abstract

The present invention provides a wafer-level reflow soldering equipment, which belongs to the technology field of reflow soldering, and solves the problems of low efficiency and poor wafer reflow soldering processing effect of existing reflow soldering equipment, comprising an EFEM system and a technological area box arranged on a rear side of the EFEM system, two wafer reloading machines are arranged on a front side of the EFEM system, a control system is arranged on a side of the EFEM system, a conveying robot and an equipment fan filter are arranged in the EFEM system, a rotary welding system, a valve terminal box, a power box, a power distribution cabinet, an exhaust system and a formic acid storage tank are arranged in the technological area box, the formic acid storage tank is connected with the rotary welding system through a pipeline, and an air inlet of the formic acid storage tank is connected with an external liquid nitrogen tank through the pipeline. The present invention can stably transport and place the wafer, perform uniform heating treatment by first heating up and then cooling down the wafer, uniform cooling treatment by rapidly cooling the wafer, and realize positioning loading and auxiliary cooling treatment, which ensures high wafer processing efficiency and good processing effect. Fig 1.