Joint block for electrical bus duct assembly
MYPI2025001219A0Pending Publication Date: 2026-08-21HENIKWON CORP SDN BHD
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Patent Information
- Application Number
- MYPI2025001219
- Authority / Receiving Office
- MY · MY
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2026-08-21
Abstract
Disclosed is a joint block (100) that can be assembled relatively in lesser duration over conventional joint blocks. The joint block (100) includes a plurality of pairs of insulating plates (105a, 105b) positioned parallel to each other in a spaced apart manner, and a pair of conducting plates (110a, 110b) positioned in a spaced apart manner, configuring a first gap (G) therebetween, between each pair of insulating plates (105a, 105b). The first gap (G) is maintained by a first interface block (135) positioned between the pair of conducting plates(110a, 110b). The outer periphery of the interface block (135) is configured to enable coupling and decoupling to the conducting plates(110a, 110b). An insulating tube (107) is received through the insulating plates (105a, 105b), conducting plates (110a, 110b) and the interface blocks (135) to form the assembly, held in bound state with the help of pressure plates (180, 185) applied to ends of the assembly and tightened with the help of a holding bolt (125) received through the pressure plates (180, 185) and the insulating tube (107). The most illustrative drawing is Fig. 4B
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