A thermoformed tray for holding microelectronics components

Abstract

The present invention discloses a thermoformed tray (100) for holding microelectronics components, the tray comprising a plurality of pockets (101) evenly spaced apart from each other on a base surface of the tray (100), such that the pockets (101) are arranged in a matrix profile and configured with sizes that correspond to one or more types of microelectronics components, a plurality of transverse extrusions (102) on said base surface for maintaining structural integrity of the tray (100) when the tray (100) is loaded with the microelectronics component, a plurality of groove profiles (103) along an inner perimeter and on an upper surface of the tray (100), in which the groove profiles (103) face inwardly of the tray (100) for stacking the tray (100) with another identical tray (100) and a protrusion (104) along a lateral axis on opposite side ends of the tray (100) that forms a handle segment, for manipulating the tray (100), wherein the tray (100) is thermoformed using any one or a combination of an antistatic material, a recyclable material, and other sustainable material. (The most illustrative figure: FIG. 1)