Chip inspection and sorting device and method

Abstract

The disclosure relates to the technical field of semiconductor inspection. A chip inspection and sorting device and a method are provided. A loading and unloading gripper mechanism, an inspection mechanism, a transfer mechanism, and a taping mechanism are mounted on the rack. The transfer mechanism comprises first, second, and third conveyance lines and a tray-transfer member; The inspection mechanism comprises first and second inspection devices. The first inspection device serves to inspect side and bottom surfaces of chips, and the second inspection device serves to inspect front surfaces of chips; The taping mechanism comprises a taping member for tape packaging of the chips; The loading and unloading gripper mechanism comprises loading and unloading members. The loading member serves to transfer chips between the first conveyance line and the first inspection device; The unloading member serves to transfer chips between the second and third conveyance lines and the taping member; According to the disclosure, the chips are transferred by the loading and unloading members, thereby avoiding damages to chips caused during manual transfers and improving sorting and inspecting efficiency of the chips. Figure 1.