Resin composition and product of the same

MYPI2025003974A0Pending Publication Date: 2026-07-17ELITE ELECTRONIC MATERIAL(ZHONGSHAN)CO LTD
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Patent Information

Authority / Receiving Office
MY · MY
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-06-30
Publication Date
2026-07-17
Patent Text Reader

Abstract

ABSTRACT RESIN COMPOSITION AND PRODUCT OF THE SAME Disclosed is a resin composition, including 100 parts by weight of vinyl-containing polyphenylene ether resin and 10 to 160 parts by weight of a compound of formula (1). Wherein, n is an integer from 3 to 6, X and Y are each independently arylcyclobutenoxy or aryloxy, the number of arylcyclobutenoxy is greater than or equal to 3, and the aryloxy contains or does not contain an alkenyl, an acrylate group or a methacrylate group having 1 to 4 carbon atoms. Further disclosed is a use of the resin composition in preparing a product, and a product of which at least a portion is prepared from the resin composition, wherein the product includes a prepreg, a resin film, a laminate, a printed circuit board, or a cured insulator. (1) (Fig. 4)
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