Electronic device and cooling system

Abstract

An electronic device is configured to accommodate a cooling fluid. The electronic device includes a chassis, at least one server, at least one heat sink and a spray assembly. The chassis is configured to accommodate the cooling fluid. The at least one server is disposed in the chassis. The at least one server includes at least one heat source. The at least one heat sink is connected to the at least one heat source of the at least one server. The spray assembly includes a fluid delivery component. The fluid delivery component is disposed in the chassis, and includes at least one flow pipe and at least one nozzle connected to each other. The at least one nozzle is configured to spray the cooling fluid onto the at least one heat sink. Figure 1