Dicing methods

MYPI2026000098A0Pending Publication Date: 2026-07-16ASMPT SINGAPORE PTE LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
MY · MY
Patent Type
Applications
Current Assignee / Owner
Filing Date
2026-01-06
Publication Date
2026-07-16
Patent Text Reader

Abstract

A method for breaking a substantially planar workpiece having first and second major surfaces, with a metallization layer on the first major surface, comprises the steps of: i) forming a groove in the workpiece extending parallel to the plane, the groove being open at an upper surface of the workpiece, and then subsequently ii) applying a workpiece breaking force to the first major surface of the workpiece to crack the workpiece along a break line coincident with the groove, then iii) applying a metallization breaking force to the second major surface of the workpiece to break the metallization layer along the break line.
Need to check novelty before this filing date? Find Prior Art