Dicing methods
MYPI2026000098A0Pending Publication Date: 2026-07-16ASMPT SINGAPORE PTE LTD
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Patent Information
- Authority / Receiving Office
- MY · MY
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-01-06
- Publication Date
- 2026-07-16
Abstract
A method for breaking a substantially planar workpiece having first and second major surfaces, with a metallization layer on the first major surface, comprises the steps of: i) forming a groove in the workpiece extending parallel to the plane, the groove being open at an upper surface of the workpiece, and then subsequently ii) applying a workpiece breaking force to the first major surface of the workpiece to crack the workpiece along a break line coincident with the groove, then iii) applying a metallization breaking force to the second major surface of the workpiece to break the metallization layer along the break line.
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