Indium foil processing method and indium foil processing machine

Abstract

An indium foil processing method is disclosed. In this method, a placement head without carrying any indium foils is moved to a top of a laser distance sensor to use the laser distance sensor to perform a first measuring operation to obtain a reference height of the placement head without carrying any indium foils. The placement head is used to perform an indium foil suction operation. After the indium foil suction operation is completed, the placement head is moved to the top of the laser distance sensor and the laser distance sensor is used to perform a second measuring operation to obtain a detecting height of the placement head. A controller is used to determine whether an indium foil number sucked by the placement head during the indium foil suction operation is abnormal based on a difference between the reference height and the detecting height.