Automatic wire threading method and system

MYPI2026000803A0Pending Publication Date: 2026-08-25ASMPT SINGAPORE PTE LTD
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Patent Information

Application Number
MYPI2026000803
Authority / Receiving Office
MY · MY
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-25
Filing Date
2026-02-10
Publication Date
2026-08-25
Patent Text Reader

Abstract

A wire threading method for automatically threading a bonding wire in a wire bonding apparatus includes the following steps: feeding a length of the bonding wire from a wire spool into an air path device; tensioning the bonding wire with an airflow generated in the air path device and simultaneously guiding a wire tail of the bonding wire to an operation location with the air path device; gripping and straightening the wire tail at the operation location with a wire manipulating device; conveying the straightened wire tail to a threading location with the wire manipulating device; and threading the straightened wire tail with a wire threading device through a bonding tool of the wire bonding apparatus. (Fig. 1)
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