Heat dissipation material attaching apparatus, heat dissipation material feeding method, and heat dissipation material attaching method

Abstract

A heat dissipation material attaching apparatus includes a platform, a first feeding module, a second feeding module, a first deployment module, and a second deployment module. The platform includes a first feeding region and a second feeding region. The first and the second feeding region have respectively a first concave and a second concave recessed into the platform. The first and the second feeding module are disposed detachably in the first or the second concave, and configured to feed the first and the second heat dissipation materials respectively. The first feeding and the second module are different, and sizes of the first and the second heat dissipation materials are different. The first deployment module and the second deployment module are disposed movably on the platform and configured to suck, deliver and attach the first or the second heat dissipation materials from the first and the second feeding region.