System for cooling dissipative components

Abstract

The invention relates to a system for cooling dissipative components, such electrical or electronic components, in particular CPUs and / or GPUs, e.g. in one or more servers, e.g. in one or more server racks in a data center, batteries, and fuel cell stacks, which cooling system comprises a thermal loop for transporting heat from at least one of such components to a heat sink, the loop comprising at least two evaporators connected in parallel, a condenser, conduits connecting the evaporators to the condenser, and restrictors provid—ing a pressure drop upstream from the evaporators, the loop containing a heat transfer medium for absorbing in the evaporators heat from the dissipative component or components, transporting the absorbed heat to the condenser, and releasing the absorbed heat to the heat sink. The system comprises at least one further restrictor providing a pressure drop upstream from said parallel restrictors.