Bottom tool part of a tool for processing carrier based electronic components, carrier based electronic component processing system and method for positioning carrier based electronic components in a processing tool
Patent Information
- Application Number
- NL2039972
- Authority / Receiving Office
- NL · NL
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-09-21
- Estimated Expiration
- 2045-03-12
Smart Images
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Abstract
Description
The present invention relates to a tool part for processing carrier based electronic components. The invention also relates to a carrier based electronic component processing system, and a method for positioning carrier based electronic components in a processing tool. In the context of this patent a carrier with electronics refers to the carrier may for instance a substrate, a frame board, a BGA board, a lead frame, a wafer or any other electronic components holding structure. The processing of carrier based electronic components, for instance semiconductors like chips, Light Emitting Diodes (LEDs), as well as other electronic components attached onto or integrated in a carrier are normally high precision processes and thus require high accurate positioning of the electronic components to be processed. Examples of such electronic component processing are the partial or full encapsulation of the electronic components to prevent for instance corrosion of the often delicate electronic components and damage due to mechanical impact. Hereby encapsulation refers to creating a protective shell at least partially around carrier based electronic components by moulding a compound on and around the components. Other examples of processing of carrier based electronic components are the forming of the carrier by which the electronic components are carried, and the trimming, cutting and / or sawing of such a carrier (for instance a leadframe) with electronic components. It is important that the electronic components are processed with utmost precision. Especially in the light of the continuous reduction of scale undergone by the electronic components, the requirements set for the precision of the package of electronic components also becoming stricter. The difficulty in meeting these strict requirements lies mainly in being able to arrange packages which only differ from the desired specifications on micron level (pm) in respect of size and form. Incorrect or inaccurate processing may lead to unacceptably deviations from intended dimensions and sizes of the processed electronic components, which subsequently may lead to reduced product quality, reduced yield and / or even complete rejection of processed electronic components. Hence, the goal of the present invention is to enhance the accuracy of the of the prior art equipment and method for processing carrier based electronic components. To realise this goal the present invention provides a bottom tool part of a tool for processing carrier based electronic components, the bottom tool part comprises: a carrier support surface for positioning and holding a carrier with electronic components, which support surface extends in an X- and Y-direction, and at least one centering pin connected to the carrier support surface, which centering pin protrudes substantially perpendicular from the carrier support surface, for positioning a carrier having at least one centering hole, whereby the centering pin is controlled movable in at least one direction parallel to the carrier support surface. The processing process of carrier based electronic components starts with the positioning of the carrier with electronic components on the bottom tool part. For this purpose, the bottom tool part is provided with a carrier support surface whereon the carrier with electronic components is to be positioned and which carrier support surface subsequently holds the carrier with electronic components in its position during for instance closing of the tool and the following processing. The carrier support surface is an in general flat surface (extending in an X- and Y-direction) that may be provided with raised, possibly bevelled, sides. Perpendicular (or substantially perpendicular) from this carrier support surface one or more centering pins protrude which centering pin(s) can interact with one or more centering holes that are provided for this purpose in the carrier of the electronic components. Due to the cooperation of the centering pin(s) and the centering hole(s) an accurate position of the carrier with electronic components on the carrier support surface on the bottom tool part of a tool for processing carrier based electronic components is realised. The insight of the present invention is however that although an accurate positioning may be realised with the cooperation of the centering pin(s) and centering hole(s) small differences (in sub-mm range) in the products (e.g. the quality of induvial carriers) and / or environmental factors (e.g. the temperature of the tool part / carrier support surface and / or centering pin(s), temperature of the carrier) may still lead to an unwanted deviation from ideal positioning of individual carriers on a bottom tool part. The solution according to the present invention is that the centering pin is controlled movable in at least one direction parallel to the carrier support surface. This enables (limited) movement of the carrier with electronic components on the carrier support surface, such that (limited) adaptive corrections of the positioning are possible. This enables anticipation and / or correction of for instance inaccuracies due to thermal deformation and deformations in carrier dimensions. The movement of the at least one centering pin may be controlled by an inline, a feedforward steering process and / or a feedback steering process. Thus, use may be made of information of the individual carrier with electronic components before the carrier is placed on the carrier support surface, real time information on an actual situation of a carrier lying on the carrier support surface and / or information of already encapsulated products that is used for positioning of subsequent carriers to be processed. More precision in the positioning of carriers on the bottom tool part of a tool for moulding carrier based electronic components will lead to more accuracy (e.g. <10 pm) during the processing and will enhance the accuracy of the processed electronic components. A further advantage is that the adjustable centering pin(s) may relatively be integrated in existing bottom tools that are not provided with at least one moveable centering pin. The centering pin may be controlled movable in one trajectory, for instance a linear, curved, or differently formed trajectory, parallel to the carrier support surface is (which is determined in an X- and Y-direction) but even more control in the positioning of the carrier with electronic components on the carrier support surface may be obtained if at least one centering pin is movable in two directions (two- dimensional) parallel to the carrier support surface (thus in both X- and Y- directions). The X-direction and the Y-direction mutually enclose an angle, preferably a perpendicular angle. In a further embodiment the carrier support surface may comprise at least two centering pins each movable in at least one direction parallel to the carrier support surface. Having at least two moveable centering pins makes it possible to also control the rotational position of the carrier with electronic components on the carrier support surface. For instance, a first moveable centering pin may be independently moveable in the X-direction and the Y-direction, and a second moveable centering pin may only be independently moveable parallel to the carrier support surface along a fixed trajectory. Alternatively, the carrier support surface may comprise at least three centering pins protruding from the carrier support surface, whereby the first centering pin is controlled movable in the X- and Y- directions, the second centering pin is movable in the X-direction and a third centering pin is movable in the Y-direction. For all these and other embodiments additionally to at least one moveable centering pin also one or more stationary centering pins may protrude from the carrier support surface. In an embodiment a moveable centering pin may be connected to the carrier support surface via a rotatable disc, at which rotatable disk the first centering pin is eccentrically attached. The axis of rotation of such a rotatable disk is preferably perpendicular to the carrier support surface and the surface of the rotatable disk is preferably flush with the carrier support surface. By rotating the disk, the position of the moveable centering pin is adjustable with a relatively simple mechanical construction. In a further embodiment the rotatable disk connected centering pin may be connected to the carrier support surface via two rotatable discs, wherein a first inner rotatable disk is rotatable in a second outer rotatable disk and the centering pin is eccentrically attached at the first rotatable disk and the first rotatable disk is eccentrically allocated in the second rotatable disk, whereby the axes of rotation of the rotatable disks may be both perpendicular to the carrier support surface. Such construction even provides more freedom of displacement for a moveable centering pin. The surface of both the rotatable disks is preferably flush with the carrier support surface, so that the construction of a single rotatable disk or double rotatable disks is not negatively influencing the positioning of the carrier with electronic components on the carrier support surface. In case double rotatable disk are used these disks are preferably independently rotatable, whereby the directions of rotation of the rotatable discs may be opposite. To prevent pollution of the carrier support surface the at least one rotatable disc may comprise a gasket surrounding the rotatable disc. Hereby the gasket may present between a rotatable disc and the carrier support surface and / or the gasket may be present between an inner rotatable disc and an outer rotatable disc. The rotatable disc may have a diameter in the range 0.1 - 10 mm.) As an alternative for the rotatable disk construction the at least one moveable centering pin may be connected to the carrier support surface via a drive system, for instance a micro-drive system. Such a linear drive system may have one- or two-degrees freedom of movement. The present invention also provides a processing system for processing carrier based electronic components, comprising: a bottom tool part according to the present invention and as disclosed above in combination with a top tool part. These tool parts are displaceable relative to each other between an open position wherein the tool parts are spaced apart and a closed position wherein the tool parts are in contact, in which closed position the carrier is clamped between the tool parts such that the tool parts may enable the processing of the carrier based electronic components. The processing system may comprise at least one handler for controlled movement of a carrier onto and / or from the carrier support surface of the bottom tool part. With such a processing system the advantages as already mentioned above in relation to the bottom tool part according to the present invention are also applicable for a processing system, which above listed advantages are herewith incorporated in relation to the processing system according to the present invention by reference. In a preferred embodiment of the processing system according to the present invention the processing system is a moulding system whereby in the closed position of the tool parts the carrier is clamped between the tool parts such that a mould cavity recessed in a contact side of at least one of the tool parts encloses the electronic components to be encapsulated; and for instance a moulding material feed connecting to the mould cavity for feeding a moulding material to the mould cavity. Especially in moulding systems, like transfer moulding systems and compression moulding systems, the requirements of accuracy in combination with limited space for accurate positioning carrier based electronic components are high and difficulty to fulfill. In such a moulding system the present invention enhances the processing accuracy without the requirement of voluminous positioning means. The same applies to trim and form equipment wherein also strict accuracy requirements are combined with limited available space for positioning means. Additionally the present invention also provides a method for positioning a carrier with electronic components on a bottom tool part according to the present invention, comprising the method steps: A) positioning a carrier with electronic components on the carrier support surface of the bottom tool part according to the present invention such that the at least one moveable centering pin fits into at least one centering hole in the carrier; and B) adjusting the position of the at least one moveable centering pin parallel to the carrier support surface, thereby effecting the position of the carrier with electronic on the carrier support surface of the bottom tool part. Also, in relation to the method according to the present invention is that the advantages as already mentioned above in relation to the bottom tool part according to the present invention are also applicable for this method, which above listed advantages are herewith incorporated in relation to the method for positioning a carrier with electronic components on a bottom tool part according to the present invention by reference. Preferably also a control system is used, for instance a vision system, to check an actual position of a carrier with electronic components on a bottom tool part to, in case of not fully correct positioning, start the positioning method according to the invention until the control system indicates / ascertains an acceptable / good / ideal positioning. Finally the present invention also provides a method for encapsulating electronic components on a carrier, comprising the processing steps of: X) placing a carrier with electronic components in an opened mould wherein a bottom mould part and a upper mould parts are move apart, such that the carrier with electronic components lies on a carrier support surface of the bottom mould part whereby at least one moveable centering pin fits into at least one centering hole in the carrier; Y) adjusting the position of at least one moveable centering pin parallel to the carrier support surface such that the position of the carrier with electronic components on the carriers support surface of the bottom mould part is changed; Z) moving the mould parts toward each other and holding the mould parts in a closed position under the influence of a closing force, whereby at least one mould cavity in the contact surface of at least one of the mould parts encloses the electronic components; U) feeding a encapsulating material into the at least one mould cavity; V) allowing the encapsulating material in the at least one mould cavity to at least partially cure; and W) moving the mould parts apart and taking the carrier With encapsulated electronic components from the mould. The moulding material may be fed to the at least one mould cavity as a liquid moulding material with a plungers system, but also other feeding of moulding material (e.g. like in compression moulding) is possible. Herein the advantages of highly controlled positioning of a carrier with electronic components on a bottom mould part are also contributing to an enhanced quality of the encapsulating of electronic components on a carrier, thus not only to positioning improves also the moulding of the electronic components is positively influenced, which even enhances the advantages. The method steps B) and / or Y) may also comprise the use of location information of the carrier with electronic components generated by at least one separate location information collector like for instance information generated by a vision system with one or more cameras. This provided additional information that will enhance the accuracy of the method and limits the chance of errors occurring. The method step Y) may also comprise detecting the position of the carrier relative to the carrier support surface by detecting and processing the position of at least one fiducial marker on the carrier and at least one fiducial marker on the carrier support surface. Using fiducial markers simplifies the detection of the position of the carrier with electronic components. The invention will be further elucidated based on the non-limitative exemplary embodiments shown in the following figures. Corresponding elements are designated in the figures with corresponding reference numerals. Herein shows: figure 1 schematic perspective view on a bottom mould part of a mould for moulding electronic components according to the present invention; figure 2 a schematic top view on two controlled movable centering pins in a carrier support surface; figure 3A a schematic top view on a single disk rotatable movable centering pin in a carrier support surface; figure 3B a schematic top view of three positions of a double disk rotatable movable centering pin in a carrier support surface; figures 4A and 4B a schematic top view of two positions of a carrier with electronic components with relative movement of the carrier due to rotation of two moveable centering pins; figures 5A and 5B schematic side views on a moulding system for encapsulating electronic components in an open and a closed position; and figure 6 a schematic perspective view on a carrier with electronic components to be used in a processing device according to the present invention. Figure 1 shows a schematic perspective view on a bottom mould part 1 of a mould for moulding electronic components on a carrier according to the present invention with a mould basis provided with two flat carrier support surfaces 3 that extend in an X- and Y-direction. Between the two carrier support surfaces 3 are feed openings 4 provided wherein pellets of encapsulating material (not shown in this figure) may be inserted. By heating these pellets and subsequently pushing the heated encapsulating material into feed runners 5, which are like the support surfaces 3 also recessed in the bottom mould part 1, the liquid encapsulating material is fed towards the carriers with electronic components placed onto the carrier support surfaces 3. Perpendicular from, and connected to, the carrier support surfaces 3 protrude centering pins 6, 7 of which one of the centering pins 6 at each carrier support surface 3 are controlled moveable (as indicated by the arrows R1, R2) parallel to the carrier support surfaces 3 while the other protrude centering pins 7 at each carrier support surface 3 are stationary. Figure 2 shows a schematic top view on two controlled movable centering pins 10, 11 in a common carrier support surface 12. The in this figure upper moveable centering pin 10 is linear moveable parallel to the carrier support surface 12 as illustrated by arrow R1. The second in this figure lower moveable centering pin 11 is in two directions moveable parallel to the carrier support surface 12 as illustrated by arrows R1, R2. Figure 3A a schematic top view on a single disk 20 rotatable movable centering pin 21 in a carrier support surface 22 whereby the centering pin 21 is placed eccentrically on the rotatable disk 20. By rotation of the disk 20 the centring pin 21 will thus move relative to the carrier support surface 22. The rotatable disk 20 is surrounded by a gasket 24, closing the opening between the carrier support surface 22 and the rotatable disc 20.. In figure BB three schematic top views of various positions of an embodiment of a double disk rotatable movable centering pin 30 are shown. An inner disk 31, carrying an eccentrically allocated centering pin 32, is at it turn rotatable eccentrically allocated in an rotatable outer disk 33. By independent rotation of the inner disk 31 and outer disk 33 the position of the centering pin may be varied as shown in the three schematic examples shown. Figures 4A and 4B show schematic top views of two positions of a carrier with electronic components 40, in which carrier 40 an elongated centering opening 41 and a tight fitting opening 42 are provided. The tight fitting opening 42 fits a first moveable centering pin 43, while in the elongated centering opening 41 slideable fits a second moveable centering pin 44. The first moveable centering pin 43 is carried by a rotatable double disk assembly 45 as already illustrated in figure 3B while the second moveable centering pin 44 is carried by a single rotatable disk 46. As the figures 4A and 4B illustrate the position of the carrier 40 may be changed form an initial position as shown in figure 4A to an adapted position as shown in figure 4B. Dependent on the position changes required of the carrier 40 in a specific situation (e.g. dependent on varying dimensions of the carrier 40, temperature and other influences) the position of the centering pins 43, 44 may be varied by rotation of the rotatable double disk assembly 45 and the single rotatable disk 46. For illustrative purpose the position changes of the carrier 40 are exaggerated; in practice the changes will normally be smaller. Figures 5A and 5B show schematic side views on a moulding system 50 for encapsulating electronic components 51 on a carrier 52. The moulding system 50 comprises a bottom mould part 53 with a carrier support surface 54. From the carrier support surface 54 protrudes a centering pin 55 that fits an elongated opening 56 in the carrier 52. The centering pin 55 is moveable parallel to the carrier support surface 54 by a micro-drive 57 that is embedded in the bottom mould part 53 for accurately adjusting the position of the carrier 52 . The moulding system 50 also comprises a top mould part 58, whereby the mould parts 52, 58 are displaceable relative to each other between an open position (figure 5A) wherein the mould parts 52, 58 are spaced apart and a closed position (figure SB) wherein the mould parts 52, 58 are in contact. In the closed position as illustrated in figure 5B the carrier 52 is clamped between the mould parts 52, 58 such that a mould cavity 59 recessed in a contact side of the op mould part 58 encloses the electronic components 51 to be encapsulated. In the top mould part 58 is also recessed a moulding material feed (feed channel) 60 for feeding liquid moulding material (not visible in this figure) to the moulding cavity 59 in the closed position of the mould parts 52, 58. Also shown is a venting opening 61 to allow gasses to leave the moulding cavity 59 during the moulding process. According arrow P1 in figure 5A the mould parts 52, 58 are closed onto each other as is shown in figure 5B. Figure 5B shows the situation when the mould parts 52, 58 are closed but still before moulding material is fed into the moulding cavity 59 according P2 .Also schematically shown is a handler 62 for controlled movement of the carrier 52 onto and / or from the carrier support surface 54 of the bottom mould part 53. Figure 6 shows a perspective views on carrier 70 which is provided from a pattern of electronic components 71 . On the carrier 60 are also carrier related fiducial markers (or references) 72 for accurate monitoring the position of the carrier, e.g. with a, not illustrated here, vision system. The carrier 70 is also provided with an elongated centering opening 73 for slideable fitting a moveable centering pin and a smaller second centering opening 74 for tight fitting a second moveable centering pin.
Claims
1. Bottom tool part of a tool for machining electronic components, the soil tool part includes: - a carrier support surface for positioning and holding a carrier with electronic components, the support surface of which extends in an X- and Y- direction, and - at least one centering pin connected to the carrier support surface, which centering pin projects essentially perpendicularly perpendicularly from the support surface, for positioning of a support provided with at least one centering opening, characterized in that the centering pin is steerably movable in at least one direction parallel to the support surface.
2. Soil tool part within the meaning of claim 1, characterized in that the centering pin steerable movable is parallel to the X and Y directions of the support surface.
3. Soil tool part according to claims 1 or 2, with the characteristic that the support surface comprises at least two centering pins, each movable are parallel to the support surface in at least one direction.
4. Soil tool part within the meaning of claim 3, characterized in that a first movable centering pin is independently movable in the X-direction and the Y-direction and a second movable centering pin are independently movable parallel to the support surface along a fixed trajectory.
5. Soil tool component according to one of the preceding conclusions, with the characteristic that a movable centering pin is connected to the carrier- support surface via a rotatable disc, on which rotatable disc the first The centering pin is mounted eccentrically.
6. Soil tool part within the meaning of claim 5, characterized by the fact that the with The rotatable disc connected centering pin is connected to the carrier support surface via two rotatable discs, where a first inner rotatable disc is rotatable in a second outer rotatable disc and the centering pin eccentrically mounted on the first rotatable disc and the first rotatable The disc is mounted eccentrically in the second rotatable disc.
7. Soil tool part according to claims 5 or 6, with the characteristic that a rotating disc comprises a gasket that surrounds the rotating disc.
8. Soil tool component according to one of the preceding conclusions, with the characteristic that at least one movable centering pin is connected to the carrier support surface via a drive system, for example a micro-drive system.
9. Processing system for electronic components on a carrier, comprising: - a soil tool part pursuant to one of the preceding conclusions and a upper tool part, which tool parts relative to each other be movable between an open position whereby the tool parts are mutually are located at a distance from each other and a closed position where the tool parts make contact, in which closed position the carrier is clamped between the tool parts such that the tool parts the machining of enable the electronic components on the carrier.
10. Processing system pursuant to Claim 9, comprising at least one handling device for the controllable movement of a carrier on and / or off the carrier support surface of the bottom tool part.
11. Processing system within the meaning of claim 9 or 10, where the machining system is a mold system and that in the closed position of the tool parts the carrier is clamped between the tool parts in such a way that a recessed mold cavity in a contact side of at least one of the tool parts enclose the electronic components to be encased.
12. Processing system according to claims 9 or 10, where the processing system is a separation and / or forming system where the carrier of the electronic component is distorted and / or separated.
13. Procedure for positioning a carrier with electronic components on a bottom tool part according to one of claims 1-8, comprising the procedure steps: A) positioning a carrier with electronic components on the carrier support surface of the bottom tool part according to one of the claims 1-8 such that at least one movable centering pin in at least one centering opening fits in the carrier; and B) changing the position of at least one movable centering pin parallel to the support surface.
14. Method according to conclusion 13, comprising the method steps: X) placing a carrier with electronic components where a bottom mold part and a top mold part are separated moved, such that the carrier with electronic components on a carrier- support surface of the bottom mold section lies where at least one movable centering pin fits into at least one centering hole in the carrier; Y) changing the position of ten parallel to the support surface at least one movable centering pin such that the position of the support with electronic components on the carrier support surface of the bottom mold part is altered; Z) moving the mold parts towards each other and in a closed position holding the mold parts under the influence of a closing force, whereby at least a mold cavity in the contact surface of at least one of the mold parts the encloses electronic components; U) the supply of a casing material to at least one mold cavity; V) allowing the casing material to cure at least partially in the ten at least one malholte; and W) moving the mold parts apart and removing the carrier with enveloped electronic components.
15. Method of working according to claim 13 or 14, characterized by the fact that the method steps B) and / or Y) also include the use of position information of the carrier with electronic components generated by at least one separate position information detector.
16. Method according to one of claims 13-15, characterized by the fact that method step B) or step Y) also detecting the position of the carrier at relative to the carrier support surface, encompassed by detecting and processing the position of at least one optical reference on the carrier and at least one 5 optical reference on the carrier support surface.