Flux and solder paste

PH12023551323B1Active Publication Date: 2026-08-19SENJU METAL IND CO LTD
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Patent Information

Application Number
PH12023551323
Authority / Receiving Office
PH · PH
Patent Type
Patents
Current Assignee / Owner
Filing Date
2023-05-12
Publication Date
2026-08-19
Estimated Expiration
2043-05-12
Patent Text Reader

Abstract

The present invention employs a flux which contains rosin, a solvent, a thixotropic agent and an activator. The thixotropic agent contains a polyamide (PA2). The PA2 is a condensation product of an aliphatic carboxylic acid, a hydroxy groupcontaining aliphatic carboxylic acid and an aliphatic amine having from 3 to 10 carbon atoms; and the aliphatic carboxylic acid includes an aliphatic dicarboxylic acid having from 11 to 20 carbon atoms. With respect to the endothermic amount calculated from the peak area of the differential scanning calorimetry curve of PA2 as obtained by differential scanning calorimetry measurement, the ratio of the endothermic amount within the range of from 50°C to 190°C to the total endothermic amount within the range of from 50°C to 200°C is 90% or more
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