Flux and solder paste
PH12023551323B1Active Publication Date: 2026-08-19SENJU METAL IND CO LTD
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Patent Information
- Application Number
- PH12023551323
- Authority / Receiving Office
- PH · PH
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-05-12
- Publication Date
- 2026-08-19
- Estimated Expiration
- 2043-05-12
Abstract
The present invention employs a flux which contains rosin, a solvent, a thixotropic agent and an activator. The thixotropic agent contains a polyamide (PA2). The PA2 is a condensation product of an aliphatic carboxylic acid, a hydroxy groupcontaining aliphatic carboxylic acid and an aliphatic amine having from 3 to 10 carbon atoms; and the aliphatic carboxylic acid includes an aliphatic dicarboxylic acid having from 11 to 20 carbon atoms. With respect to the endothermic amount calculated from the peak area of the differential scanning calorimetry curve of PA2 as obtained by differential scanning calorimetry measurement, the ratio of the endothermic amount within the range of from 50°C to 190°C to the total endothermic amount within the range of from 50°C to 200°C is 90% or more
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