Flux and solder paste
PH12023551324B1Active Publication Date: 2026-08-19SENJU METAL IND CO LTD
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Patent Information
- Application Number
- PH12023551324
- Authority / Receiving Office
- PH · PH
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2023-05-12
- Publication Date
- 2026-08-19
- Estimated Expiration
- 2043-05-12
Abstract
The present invention uses a flux containing a rosin, a solvent, a thixo agent, and an activator. The thixo agent contains a polyamide and a compound represented by general formula (1). The polyamide is a condensate between an amine and at least one selected from aliphatic carboxylic acids and hydroxy group-containing aliphatic carboxylic acids, and has an endothermic peak at a temperature of 120-200°C. In the general formula, R11 represents a hydrocarbon group having 11-30 carbon atoms. R0a represents a hydrogen atom or a hydrocarbon group having 12-31 carbon atoms. R0b represents an n-valent hydrocarbon group having 4-12 carbon atoms. R21 represents an alkylene group having 2-6 carbon atoms. R0c represents a single bond or an alkylene group having 2-6 carbon atoms. n represents 1 or 2. When n represents 1, m represents an integer of 1-3. When n represents 2, m represents 1.
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