Solder paste and solder joint

Abstract

A solder paste containing a first metal powder, a second metal powder, and a flux is employed. The first metal powder contains Sn. A second metal powder 20A has a core portion 201 formed of an alloy containing Ni and Fe, and a surface layer 202 that covers the core portion 201 and is formed of a metal containing Ni. An Ni content in the metal forming the surface layer 202 of the second metal powder 20A is 50% by mass or more relative to a total mass of the metal forming the surface layer 202 of the second metal powder 20A. The surface layer 202 of the second metal powder 20A has a thickness of 0.05 μm or more and 0.30 μm or less.