Carrier-tape thermal bonding device
PH12025050419A1Pending Publication Date: 2026-09-14TOKYO WELD CO LTD
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Patent Information
- Application Number
- PH12025050419
- Authority / Receiving Office
- PH · PH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2026-09-14
Abstract
To securely thermal bond a top tape to a carrier tape. A carrier-tape thermal bonding device includes a heating device 40, and the heating device 40 includes a pair of heating elements 60, 60 positioned on both sides of a width direction of the cavity 13 of a carrier tape 7. A width W1 of a preheating area 61 of the heating element 60 is greater than a width W2 of a pressurizing area 62.
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