Method and system for temperature pre- conditioning a mould cavity of a mould for encapsulating electronic components
PH12025552973A1Pending Publication Date: 2026-08-03BESI NETHERLANDS BV
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Patent Information
- Application Number
- PH12025552973
- Authority / Receiving Office
- PH · PH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-12-01
- Publication Date
- 2026-08-03
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