Package comprising a substrate with an embedded frame
PH12025553008A1Pending Publication Date: 2026-08-24QUALCOMM INC
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Patent Information
- Application Number
- PH12025553008
- Authority / Receiving Office
- PH · PH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-12-04
- Publication Date
- 2026-08-24
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