Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrate
PH12026550200A1Pending Publication Date: 2026-08-24QUALCOMM INC
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Patent Information
- Application Number
- PH12026550200
- Authority / Receiving Office
- PH · PH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2026-01-23
- Publication Date
- 2026-08-24
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