Ceramic substrate for microwave and terahertz systems and method of producing this substrate

Abstract

The invention relates to a ceramic substrate for microwave and terahertz systems based on copper borate and a method for manufacturing such a substrate. The substrate in question is a shaped body of copper borate CuB2O4 and / or Cu2B2O5. This substrate may contain up to 8% by weight of one of the additives that lower the sintering temperature, preferably CuBi2O4, AlF3-CaB4O7, or Li2WO4. The application also provides a method for manufacturing a ceramic substrate. In the method for manufacturing a ceramic substrate, a mixture of copper oxide, CuO, and boric acid, H3BO3, is first prepared, and the resulting powder containing one of the copper borates, CuB2O4 and / or Cu2B2O5, is then ground in a ball mill for 5-8 hours. To the resulting powder is added 1% by weight of polyvinyl alcohol in the form of a 3% aqueous solution. The obtained granulate is pressed into shapes which are sintered at 860 - 960°C for 2 - 4 hours.