Method of applying tin deposits

Abstract

The method of applying tin deposits to a flat copper wire in the form of a tape (1) covered on the outside and inside with a thin layer of tin is characterized in that a section (8) of tin wire is preheated from the bottom using a soldering tip (4) for 4.5 to 5.5 seconds to a temperature of 145°C to 155°C and simultaneously by means of a blow of air heated to a temperature of 345°C to 355°C supplied to the lower part of the glass tube (7) through a nozzle (9) at a pressure of 0.9 bar to 1.0 bar, melting of the section (8) of tin wire is achieved, which after melting occupies the entire area of ​​a circle with the inner diameter of the tube (7), after which the glass tube (7) is raised above the tape (1) and the obtained tinned area is cooled at a temperature below 100°C to room temperature.