Compact housing of a temperature sensor, particularly for space applications

Abstract

The resin-encapsulated temperature sensor housing is characterized by being equipped with an adapter (1) contacted with the largest surface of the temperature sensor wall (4) by thermally conductive paste (3), wherein the adapter (1) and temperature sensor (4) are located within the resin-encapsulated housing (2), while the threaded pin (1a) of the adapter (1) and the connector (5) of the temperature sensor (4) are located outside the housing. The resin is preferably epoxy.