A method for vertical electrical and mechanical switching of boards and interposers of multi-level hybrid 3D modules during their installation in a vertical stack

Claims

1. A method for vertical electrical and mechanical switching of boards and interposers of multi-level hybrid 3D modules during their installation in a vertical stack, carried out by combining topologically identically located through metallized holes on boards intended for electrical switching of boards and characterized in that, simultaneously with the packing of electronic components onto the board, separately manufactured, identical, stamped, metal, cone-shaped caps filled with a conductive material (paste or glue) are placed into the metallized holes intended for vertical electrical switching, having a height greater than the thickness of the board and protruding with sharp ends from the bottom of the board in such a way that, when combined in a vertical stack, the upper cone-shaped caps enter the paste or glue filling the lower caps, as a result of which the connection of the upper caps with the material filling the lower caps occurs,The operation of connecting and aligning the boards is repeated until the entire stack is assembled, after which the assembly is placed in an oven, where the electronic components are soldered onto the board and the vertically connected caps are soldered together to form reliable electrical and mechanical connections.

2. The method according to paragraph 1, characterized in that the switching boards of one module level are multiplied on the motherboard printed circuit board, the electronic components intended for each switching board are placed and soldered, then the motherboards of all other module levels are manufactured in the same manner, after which the operations of filling the caps with paste, assembling the boards into a stack and soldering the manufactured stack of motherboards in an oven are carried out, after which the stack of motherboards is cut into stacks of switching boards.