CAMERA MODULE AND ELECTRONIC DEVICE

Claims

1. A camera module containing: an image sensor having a first surface, and the first surface is divided into a light-sensitive region and a non-light-sensitive region that is located around the periphery of the light-sensitive region; a printed circuit board containing: a first portion located on the side on which the first surface is located and covering the non-photosensitive region, wherein the first portion is provided with a first light-transmitting opening, the first light-transmitting opening opens the light-sensitive region, and the first portion is electrically connected to the image sensor; and a second portion located on the side that relates to the first portion and that faces away from the first light-transmitting opening, wherein the second portion is located around the periphery of the first portion and is electrically connected to the first portion, and a vertical projection of the second portion onto the plane on which the first surface is located does not overlap with the image sensor; and The lens assembly is located on the side that is on the printed circuit board and that faces away from the image sensor.

2. The camera module according to paragraph 1, additionally comprising: a first support element located between the printed circuit board and the lens assembly, wherein the first support element is configured to be connected to the printed circuit board and the lens assembly, the first support element is provided with a second light-transmitting opening, and the second light-transmitting opening communicates with the first light-transmitting opening.

3. The camera module according to paragraph 2, in which a surface that relates to the first support element and that faces away from the image sensor is provided with a first groove, and a second light-transmitting opening is provided at the bottom of the first groove; wherein the camera module further comprises a filter, wherein the filter is located in the first groove, the filter is connected to the bottom of the first groove, and the filter covers the light-sensitive area.

4. The camera module of claim 2 or 3, wherein the first support member is an injection molded part and the first support member covers the first portion and the second portion.

5. The camera module according to claim 4, wherein the thickness D1 of the first support element that covers the first section satisfies the condition: D1≥0.1 mm.

6. A camera module according to any one of paragraphs 1-5, further comprising: a second support element located on the side that relates to the second portion and that faces away from the lens unit, wherein the second support element is connected to the second portion.

7. The camera module according to claim 6, wherein the surface that relates to the second support element and that faces away from the printed circuit board protrudes above the surface that relates to the image sensor and that faces away from the printed circuit board.

8. The camera module according to claim 6 or 7, wherein the second support element is a metal sheet.

9. The camera module according to item 8, in which in a direction perpendicular to the first surface, the printed circuit board comprises a dielectric layer and a metal pattern layer arranged alternately, wherein the metal pattern layer in the second section comprises a grounding portion; and The metal sheet is electrically connected to the grounding part.

10. The camera module according to clause 9, in which the grounding portion is exposed on the surface which is related to the second section and which faces away from the lens assembly; wherein the camera module further comprises a conductive layer, the conductive layer is located between the grounding portion and the metal sheet, and the conductive layer is electrically connected to the grounding portion and the metal sheet.

11. A camera module according to any one of paragraphs 6-10, in which there is a first gap between the image sensor and the first section; there is a second gap between the image sensor and the second support element; wherein the camera module further comprises a first bonding layer, the first bonding layer fills the second gap and a portion of the first gap, and the first bonding layer is connected to the first portion, the image sensor and the second support element.

12. A camera module according to any one of paragraphs 1-5, in which the second portion is located around the periphery of the image sensor, and the second portion and the first portion surround a second groove configured to accommodate the image sensor; in the direction perpendicular to the first surface, the printed circuit board contains a dielectric layer and a metal pattern layer arranged alternately; the number of dielectric layers in the second section is greater than the number of dielectric layers in the first section, and the number of layers of the metal pattern in the second section is greater than the number of layers of the metal pattern in the first section; and one dielectric layer in the first section and one dielectric layer in the second section are located in the same layer, and one layer of the metallic pattern in the first section and one layer of the metallic pattern in the second section are located in the same layer.

13. The camera module of claim 12, wherein the surface that relates to the second portion and that faces away from the lens assembly protrudes above the surface that relates to the image sensor and that faces away from the printed circuit board.

14. The camera module of claim 12 or 13, wherein the metal pattern layer in the second portion comprises a ground portion, and the ground portion is exposed on a surface that is related to the second portion and that faces away from the lens assembly.

15. A camera module according to any one of paragraphs 12-14, in which there is a first gap between the image sensor and the first section; there is a third gap between the image sensor and the second section; in this case, the camera module further comprises a second bonding layer, the second bonding layer fills the third gap and the portion of the first gap, and the second bonding layer is connected to the first portion, the image sensor and the second portion.

16. A camera module according to any one of paragraphs 1-15, further comprising: a first contact pad located on the first surface and located in a non-photosensitive region, wherein the first contact pad is electrically connected to the image sensor; a second contact pad located on the surface that relates to the first portion and that faces the image sensor, wherein the second contact pad is electrically connected to the printed circuit board; and an electrical connector located between the first contact pad and the second contact pad, wherein one end of the electrical connector is electrically connected to the first contact pad and the other end is electrically connected to the second contact pad.

17. The camera module of claim 16, wherein the electrical connector comprises a solder bump or a gold bump.

18. An electronic device comprising: body; and a camera module according to any one of paragraphs 1-17, wherein the camera module is connected to the housing.