Foldable electronic device comprising flexible printed circuit board

Abstract

FIELD: portable electronic devices.SUBSTANCE: invention relates to a folding display, in particular to design solutions for folding smartphones, tablets and similar gadgets. Design solutions are claimed, namely a combination of rigid and flexible sections in a flexible printed circuit board, a special design of a hinge cover with differentiated geometry, coordinated movement of a rigid section of a flexible printed circuit board along a given trajectory, the use of support and elastic housings in a hinge unit, geometric compliance of the surfaces of components, the formation of controlled rounded sections on flexible segments, the integration of a flexible printed circuit board into the structure of a hinge unit and the kinematics of the mating surfaces of the housings and the hinge cover, in an electronic device comprising first and second housings, a hinge cover, a hinge structure, and a flexible printed circuit board.EFFECT: stable change in the shape of components in a folding electronic device with a reduced thickness in a compact internal space.14 cl, 16 dwg

Description

AREA OF TECHNOLOGY

[0001] The present disclosure relates to a foldable electronic device, for example, a foldable electronic device including a flexible printed circuit board (FPCB) whose shape changes between an unfolded state and a folded state according to an operation performed by a user.BACKGROUND

[0002] As a foldable electronic device with a flexible display that can be folded and unfolded using a hinge assembly, an electronic device with a reduced thickness and an efficient arrangement of mechanical and / or electronic components in a reduced space is developed. DISCLOSURE OF INVENTIONTECHNICAL PROBLEM

[0003] An exemplary aspect of the present disclosure provides an electronic device that implements, or is configured to implement, stable shape change of components in a reduced space of the electronic device.

[0004] However, the technical aspects are not limited to the above-mentioned aspect, and other technical aspects may also be present. Additional aspects of the present disclosure will be set forth in part in the description that follows, and in part will be obvious from the description or can be learned by practice from the presented embodiments of the present disclosure. SOLUTION TO THE PROBLEM

[0005] According to an exemplary embodiment, the electronic device may include: a first housing, a second housing, a hinge cover located at least between the first housing and the second housing and including a first portion of the cover, a second portion of the cover on a first side of the first portion of the cover, and a third portion of the cover on a second side of the first portion of the cover opposite the first side, a hinge structure located (directly or indirectly) on the hinge cover and configured to rotate the first housing and the second housing between a folded state in which the first housing and the second housing form a first angle and an unfolded state in which the first housing and the second housing form a second angle greater than the first angle, a display including a first region located on and / or for the first housing, a second region located on and / or for the second housing, and a flexible region between the first region and the second region,and a flexible printed circuit board (FPCB) including a rigid portion configured to be placed (directly or indirectly) on a first portion of the lid in a folded state, a first flexible portion connected (directly or indirectly) to the rigid portion and configured to at least partially bend along a second portion of the lid, and a second flexible portion connected (directly or indirectly) to the rigid portion opposite the first flexible portion and configured to at least partially bend along a third portion of the lid, wherein the rigid portion is more rigid than the first flexible portion and the second flexible portion.

[0006] According to an exemplary embodiment, the flexible printed circuit board may include: a rigid portion, a first flexible portion connected to the rigid portion and configured to be at least partially bent, and a second flexible portion connected to the rigid portion opposite the first flexible portion and configured to be at least partially bent.

[0007] According to an exemplary embodiment, the electronic device may include: a first housing, a second housing, a hinge cover located between the first housing and the second housing and including a first portion of the cover, a second portion of the cover on a first side of the first portion of the cover, and a third portion of the cover on a second side of the first portion of the cover opposite the first side, a hinge structure located on the hinge cover and configured to rotate the first housing and the second housing between a folded state in which the first housing and the second housing form a first angle and an unfolded state in which the first housing and the second housing form a second angle greater than the first angle, a display including a first region located on the first housing, a second region located on the second housing, and a flexible region between the first region and the second region, a first bracket located between the first region and the first housing,a second bracket located between the second region and the second body, and a flexible printed circuit board including a rigid section configured to be positioned on the first section of the lid in the folded state, a first flexible section located between the first bracket and the second section of the lid, connected to the rigid section and configured to at least partially bend along the second section of the lid, and a second flexible section located between the second bracket and the third section of the lid, connected to the rigid section opposite the first flexible section and configured to at least partially bend along the third section of the lid. ADVANTAGEOUS EFFECTS OF THE INVENTION,

[0008] According to the exemplary embodiment described herein, stable change in the shape of components can be realized in an electronic device with a reduced thickness and a reduced internal space. Aspects of the electronic device according to the embodiment are not limited to the above descriptions, and other aspects will be apparent to those skilled in the art from the following descriptions. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other aspects, features and advantages of certain exemplary embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0010] Fig. 1 is a block diagram illustrating an exemplary electronic device in a network environment according to an exemplary embodiment;

[0011] Fig. 2A is a view illustrating an exemplary electronic device in an unfolded state according to an exemplary embodiment;

[0012] Fig. 2B is a view illustrating an exemplary electronic device in a folded state according to an exemplary embodiment;

[0013] Fig. 3 is an exploded perspective view of an exemplary electronic device according to an exemplary embodiment;

[0014] Fig. 4A is a sectional view of the electronic device in an unfolded state according to an exemplary embodiment;

[0015] Fig. 4B is a sectional view of the electronic device in an unfolded state according to an exemplary embodiment;

[0016] Fig. 4C is a view illustrating an example of a hinge cover portion and a flexible printed circuit board (FPCB) portion according to an exemplary embodiment;

[0017] Fig. 5A is a sectional view of an exemplary electronic device in an unfolded state according to an exemplary embodiment;

[0018] Fig. 5B is a sectional view of an exemplary electronic device in a folded state according to an exemplary embodiment;

[0019] Fig. 5C is a view illustrating an example of a hinge cover portion and a flexible printed circuit board portion according to an exemplary embodiment;

[0020] Fig. 6 is a view illustrating an example of a hinge cover portion and a flexible printed circuit board portion according to an exemplary embodiment;

[0021] Fig. 7A is a sectional view of an exemplary electronic device in an unfolded state according to an exemplary embodiment;

[0022] Fig. 7B is a sectional view of an exemplary electronic device in a folded state according to an exemplary embodiment;

[0023] Fig. 7C is a view illustrating an example of a hinge cover portion and a flexible printed circuit board portion according to an exemplary embodiment;

[0024] Fig. 8 is a view illustrating an example of a hinge cover portion and a flexible printed circuit board portion according to an exemplary embodiment;

[0025] Fig. 9 is a view illustrating an example of a hinge cover portion and a flexible printed circuit board portion according to an exemplary embodiment; and

[0026] Fig. 10 is a view illustrating an example of a hinge cover portion and a flexible printed circuit board portion according to an exemplary embodiment. MODE OF THE INVENTION

[0027] Referring to Fig. 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (for example, a short-range wireless communication network) or communicate with at least one of the electronic device 104 and the server 108 via the second network 199 (for example, a long-range wireless communication network). According to an embodiment, the electronic device 101 can interact with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 can include a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module 176, an interface 177, a connecting terminal 178, a tactile module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM card) 196, or an antenna module 197.In some example, at least one (for example, connection terminal 178) of the above-mentioned components may be excluded from the electronic device 101, or one or more other components may be added to the electronic device 101. In an embodiment, some components (for example, sensor module 176, camera module 180, or antenna module 197) may be integrated as a single component (for example, as display module 160). Each "module" here may contain circuitry.

[0028] The processor 120 can execute, for example, software (for example, program 140) for controlling at least one other component (for example, a hardware or software component) of the electronic device 101 connected to the processor 120, and can perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculations, the processor 120 can store an instruction or data received from another component (for example, the sensor module 176 or the communication module 190) in the volatile memory 132, process the instruction or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134.According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)), which operates independently or jointly with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or to perform a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as a part thereof. Each "processor" here comprises a processing circuit.

[0029] The auxiliary processor 123 can control at least some functions or states related to at least one (for example, the display device 160, the sensor module 176, or the communication module 190) of the components of the electronic device 101, instead of the main processor 121 when the main processor 121 is in an inactive (for example, sleep) state, or together with the main processor 121 when the main processor 121 is in an active state (for example, executing an application). According to an embodiment, the auxiliary processor 123 (for example, an ISP or CP) can be implemented as part of another component (for example, a camera module 180 or a communication module 190), which is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (for example, an NPU) can include a hardware structure designed to process an artificial intelligence (AI) model.An AI model may be created using machine learning. Such training may be performed, for example, by the electronic device 101 executing the AI ​​model, or by a separate server (e.g., server 108). Learning algorithms may include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The AI ​​model may include multiple layers of an artificial neural network. An artificial neural network may include, but is not limited to, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these.An AI model may alternatively or additionally include a software structure that is distinct from the hardware structure.

[0030] Memory 130 can store various data used by at least one component (for example, processor 120 or sensor module 176) of electronic device 101. Data can include, for example, software (for example, program 140) and input data or output data for the command associated therewith. Memory 130 can include volatile memory 132 or non-volatile memory 134. Non-volatile memory 134 can include internal memory 136 and external memory 138.

[0031] The program 140 may be stored in the memory 130 as software and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0032] The input module 150 may receive a command or data for use by another component (for example, the processor 120) of the electronic device 101 from outside (for example, from a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (for example, a button) or a digital pen (for example, a stylus).

[0033] The audio output module 155 can output an audio signal to the outside of the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing recordings. The receiver can be used to receive an incoming call. According to an embodiment, the receiver can be implemented separately from the speaker or as part of it.

[0034] The display module 160 may visually provide information to the outside (e.g., to the user) of the electronic device 101. The display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to perceive a touch, or a pressure sensor adapted to measure the intensity of the force generated by a touch.

[0035] The audio module 170 can convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can receive sound through the input module 150 or output sound through the audio output module 155 or an external electronic device (for example, the electronic device 102, such as a speaker or headphones) connected directly or wirelessly to the electronic device 101.

[0036] The sensor module 176 can detect the operating state (for example, power or temperature) of the electronic device 101 or the environmental state (for example, the user state) external to the electronic device 101, and generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyroscopic sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared sensor (IR), a biometric sensor, a temperature sensor, a humidity sensor, or a light sensor.

[0037] Interface 177 may support one or more protocols used in electronic device 101 for connecting to an external electronic device (e.g., electronic device 102) directly (e.g., via wired communication) or wirelessly. According to an embodiment, interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0038] The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (for example, the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (for example, a headphone connector).

[0039] Haptic module 179 can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be recognized by the user through their tactile or kinesthetic sensations. According to an embodiment, haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0040] The camera module 180 can capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, ISPs, or flashes.

[0041] The power management module 188 may manage the power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0042] Battery 189 may supply power to at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a primary cell that is not rechargeable, a secondary cell that is rechargeable, or a fuel cell.

[0043] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (e.g., AP), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module).A corresponding one of these communication modules can interact with the external electronic device 104 via the first network 198 (for example, a short-range communication network such as Bluetooth. TM , direct wireless (Wi-Fi) communication or infrared port (IrDA)) or a second network 199 (for example, a long-range communication network, such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet or a computer network (for example, a LAN or a wide area network (WAN)). These various types of communication modules can be implemented as a single component (for example, a single chip) or can be implemented as a plurality of components (for example, a plurality of chips) separate from each other. The wireless communication module 192 can determine and authenticate the electronic device 101 in the communication network, such as the first network 198 or the second network 199, using subscriber information (for example, an international mobile subscriber identity (IMSI)) stored in the SIM 196.

[0044] The wireless communication module 192 can support a 5G network after the 4G network and next-generation communication technologies such as new radio access technology (NR). The NR access technology can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support a high-frequency band (e.g., a millimeter-wave band) to achieve, for example, a high data rate. The wireless communication module 192 can support various technologies for ensuring performance in the high-frequency band, such as, for example, beamforming, massive multiple-input multiple-output (MIMO), full-size MIMO (FD-MIMO), antenna array, analog beamforming, or a large-scale antenna.The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (for example, the electronic device 104), or a network system (for example, the second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate (for example, 20 Gbps or more) for implementing eMBB, loss coverage (for example, 164 dB or less) for implementing mMTC, or a U-plane delay (for example, 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a full roundtrip) for implementing URLLC.

[0045] The antenna module 197 can transmit or receive a signal or power to or from outside (for example, an external electronic device) the electronic device 101. According to an embodiment, the antenna module 197 can include an antenna that includes a radiating element that includes a conductive material or a conductive pattern formed in or on a substrate (for example, a printed circuit board (PCB)). According to an embodiment, the antenna module 197 can include a plurality of antennas (for example, an antenna array). In this case, at least one antenna suitable for the communication scheme used in the communication network, such as the first network 198 or the second network 199, can be selected, for example, by the communication module 190 from a plurality of antennas. The signal or power can be transmitted or received between the communication module 190 and the external electronic device through at least one selected antenna.According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be further formed as part of the antenna module 197.

[0046] According to an embodiment, the antenna module 197 may form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, an RFIC located on a first surface (for example, on a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a designated high-frequency range (for example, a millimeter-wave range), and a plurality of antennas (for example, antenna arrays) located on a second surface (for example, a top or side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals in a designated high-frequency range.

[0047] At least some of the above components may be connected to each other and transmit signals (e.g., commands or data) among themselves via an inter-peripheral communication circuit (e.g., a bus, a general-purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

[0048] According to an embodiment, commands or data can be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 and 104 can be a device of the same or different type as the electronic device 101. According to an embodiment, all or some of the operations that must be performed by the electronic device 101 can be performed on one or more of the external electronic devices 102, 104 and 108. For example, if the electronic device 101 must perform a function or service automatically or in response to a request from a user or another device, then the electronic device 101, instead of or in addition to performing the function or service, can request one or more external electronic devices to perform at least a part of the function or service.One or more external electronic devices receiving the request can perform at least a portion of the function or the requested service, or an additional function or additional service associated with the request, and can transmit the result of the execution to the electronic device 101. The electronic device 101 can provide the result, with or without additional processing of the result, as at least a portion of the response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used, for example. The electronic device 101 can provide services with ultra-low latency, using, for example, distributed computing or mobile edge computing. In an embodiment, the external electronic device 104 can include an Internet of Things (IoT) device. The server 108 can be an intelligent server using machine learning and / or a neural network.According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be used for intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

[0049] According to an embodiment, the electronic device may be one of various types. The electronic device may include, but is not limited to, a portable communication device (e.g., a smartphone, etc.), a computing device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. However, the electronic device is not limited to the above examples.

[0050] It should be understood that the embodiment of the present disclosure and the terms used therein are not intended to limit the technological features set forth herein to a particular embodiment and include various modifications, equivalents, or replacements for the corresponding embodiment. In connection with the description of the drawings, like reference numerals may be used for similar or related components. It should be understood that the singular form of a noun corresponding to a subject matter may include one or more subjects, unless the relevant context clearly indicates otherwise. As used herein, "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "A, B, or C" each may include any of the elements listed together in the corresponding phrase, or all possible combinations thereof.Terms such as "first," "second," or "first," or "second" may be used simply to distinguish a component from other components under consideration and do not limit the components in other respects (e.g., importance or order). It should be understood that if an element (e.g., a first element) is referred to with or without the term "functionally" or "communicatively" as "connected to," "connected to," "connected with," or "connected to" another element (e.g., a second element), this means that the element can be connected to the other element directly (e.g., by wire), wirelessly, or at least through a third element.

[0051] When used in connection with an embodiment of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a separate constituent component or a minimal unit or part thereof, designed to perform one or more functions. For example, according to an embodiment, a module may be implemented as an application-specific integrated circuit (ASIC).

[0052] The embodiment described herein can be implemented as software (e.g., program 140) including one or more instructions stored on a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) can call at least one of the one or more instructions stored on the storage medium and execute it. This makes it possible to control the machine to perform at least one function in accordance with the called at least one instruction. One or more instructions may include code generated by a compiler or code executed by an interpreter. The machine-readable storage medium can be provided in the form of non-transitory storage media.Here, the term "non-volatile" simply means that the storage medium is a tangible device and does not include a signal (such as an electromagnetic wave), but this term does not distinguish between a semi-permanent storage location of data on the storage medium and a temporary storage location of data on the storage medium.

[0053] According to an embodiment, the method according to the embodiment may be included in and provided as a computer program product. The computer program product may be sold as a product between a seller and a buyer (or a purchaser described herein). The computer program product may be distributed in the form of a computer-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)), or distributed (e.g., downloaded or uploaded) online through an application store (e.g., PlayStore TM) or directly between two user devices (e.g., smartphones). When distributed online, at least a portion of the computer software product may be temporarily generated or at least temporarily stored on a machine-readable storage medium, such as the memory of a manufacturer's server, an application storage server, or a relay server.

[0054] According to an embodiment, each component (for example, a module or program) of the above-described components may include one or more objects, and some of the plurality of objects may be separately located in different components. According to an embodiment, one or more of the above-described components or operations may be excluded, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (for example, modules or programs) may be integrated into a single component. In such a case, according to an embodiment, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they were performed by the corresponding one of the plurality of components before integration.According to an embodiment, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or be eliminated, or one or more other operations may be added.

[0055] Each embodiment herein may be used in combination with any other embodiment(s) herein.

[0056] Referring to Fig. 2A and 2B, the foldable electronic device 201 may include a pair of housings 210 and 220 rotatably connected to each other via a hinge structure (for example, the hinge structure 334 in Fig. 3), which can be folded relative to each other, a hinge cover 265 covering the foldable portions of the housings 210 and 220, and a display 261 (for example, a flexible display or a foldable display) located in the space formed by the housings 210 and 220. Here, the surface on which the display 261 is located can be defined as the front surface of the foldable electronic device 201, and the surface opposite to the front surface can be defined as the back surface of the foldable electronic device 201. In addition, the surface surrounding the space between the front surface and the back surface can be defined as the side surface of the foldable electronic device 201.

[0057] In an embodiment, a pair of housings 210 and 220 may include a first housing 210, a second housing 220, a first back cover 240, and a second back cover 250. The pair of housings 210 and 220 of the electronic device 201 are not limited to the shape or combination and / or connection of the components shown in Fig. 2A and 2B, but may be implemented in other shapes or by another combination and / or connection of the components.

[0058] In an embodiment, the first housing 210 and the second housing 220 can be located on both sides relative to the folding axis A and can be located substantially symmetrically relative to the folding axis A. In an embodiment, the angle or distance between the first housing 210 and the second housing 220 can differ depending on whether the electronic device 201 is in an unfolded state, a folded state, or an intermediate state. In an embodiment, the first housing 210 and the second housing 220 can be located substantially symmetrically.

[0059] In an embodiment, the first housing 210 may be connected to a hinge structure (for example, the hinge structure 334 in Fig. 3) in the unfolded state of the electronic device 201. The first housing 210 may include a first surface 211 facing the front surface of the electronic device 201, a second surface 212 facing the opposite side of the first surface 211, and a first side portion / element 213 covering at least a portion of the space between the first surface 211 and the second surface 212.The first side element 213 may include a first side surface 213a located substantially parallel to the folding axis A, a second side surface 213b extending in a direction substantially perpendicular to the folding axis A from one end of the first side surface 213a, and a third side surface 213c extending in a direction substantially perpendicular to the folding axis A from the other end of the first side surface 213a and substantially parallel to the second side surface 213b. The second housing 220 may be connected to a hinge structure (for example, a hinge structure 334 in Fig. 3) in the unfolded state of the electronic device 201.The second body 220 may include a third surface 221 facing the front surface of the electronic device 201, a fourth surface 222 facing the opposite side of the third surface 221, and a second side portion / element 223 covering at least a portion of the space between the third surface 221 and the fourth surface 222. The second side portion / element 223 may include a fourth side surface 223a located substantially parallel to the folding axis A, a fifth side surface 223b extending in a direction substantially perpendicular to the folding axis A from one end of the fourth side surface 223a, and a sixth side surface 223c extending in a direction substantially perpendicular to the folding axis A from the other end of the fourth side surface 223a and substantially parallel to the fifth side surface 223b.The first surface 211 and the third surface 221 may face each other when the electronic device 201 is in the folded state.

[0060] In an embodiment, the electronic device 201 may include at least one audio output module including an audio output circuit (for example, the audio output module 155 of Fig. 1) located on the fifth side surface 223b and / or the sixth side surface 223c of the second housing 220.

[0061] In an embodiment, the electronic device 201 may include a recessed housing portion 202 for accommodating the display 261 by structurally connecting the first housing 210 and the second housing 220. The housing portion 202 may have substantially the same size as the display 261.

[0062] In an embodiment, at least a portion of the first body 210 and the second body 220 may be formed from a metallic or non-metallic material having a predetermined rigidity value suitable for supporting the display 261.

[0063] In an embodiment, the electronic device 201 may include at least one component for performing various functions, which is located so as to be open on the front surface of the electronic device 201. The component may include, for example, at least one of a front camera module including a camera, a receiver, a proximity sensor, a light sensor, an iris recognition sensor, an ultrasonic sensor, or an indicator.

[0064] In an embodiment, the first back cover 240 may be located (directly or indirectly) on the second surface 212 of the first housing 210 and have a substantially rectangular periphery. At least a portion of the periphery of the first back cover 240 may be surrounded by the first housing 210. The second back cover 250 may be located (directly or indirectly) on the fourth surface 222 of the second housing 220 and have a substantially rectangular periphery. At least a portion of the periphery of the second back cover 250 may be surrounded by the second housing 220.

[0065] In an embodiment, the first back cover 240 and the second back cover 250 may have substantially symmetrical shapes relative to the folding axis A. In an embodiment, the first back cover 240 and the second back cover 250 may have different shapes. In another embodiment, the first housing 210 and the first back cover 240 may be formed as a single unit, and the second housing 220 and the second back cover 250 may be formed as a single unit.

[0066] In an embodiment, the first housing 210, the second housing 220, the first back cover 240 and the second back cover 250 may provide a space in which various components (for example, a printed circuit board, an antenna module (including at least one antenna) 197 in Fig. 1, a sensor module 176 (including at least one sensor) in Fig. 1 or a battery 189 in Fig. 1) of the electronic device 201 are arranged by a structure in which the first housing 210, the second housing 220, the first back cover 240 and the second back cover 250 are connected to each other. In an embodiment, at least one component may be visually exposed on the rear surface of the electronic device 201. For example, at least one component may be visually exposed through the first rear region 241 of the first rear cover 240. The component may include, for example, a proximity sensor, a rear camera module including a camera, and / or a flash.

[0067] In an embodiment, the display 261 may be disposed in the housing portion 202 formed by the pair of housings 210 and 220. For example, the display 261 may be configured to occupy substantially most of the front surface of the electronic device 201. The front surface of the electronic device 201 may include an area in which the display 261 is disposed, as well as a partial area (e.g., a peripheral area) of the first housing 210 and a partial area (e.g., a peripheral area) of the second housing 220 that are adjacent to the display 261. The rear surface of the electronic device 201 may include a first back cover 240, a partial area (e.g., a peripheral area) of the first housing 210 adjacent to the first back cover 240, a second back cover 250, and a partial area (e.g., a peripheral area) of the second housing 220 adjacent to the second back cover 250.In an embodiment, the display 261 may be a display in which at least one region can be deformed into a flat surface or a curved surface. In an embodiment, the display 261 may include a flexible region 261c, a first region 261a on a first side (for example, the right side) of the flexible region 261c, and a second region 261b on a second side (for example, the left side) of the flexible region 261c. For example, the first region 261a may be located on the first surface 211 of the first housing 210, and the second region 261b may be located on the third surface 221 of the second housing 220. However, such a division of the regions of the display 261 is provided merely as an example, and the display 261 may be divided into a plurality of regions based on the structure or functions of the display 261. For example, as shown in FIG.2A, the display 261 can be divided into regions based on the folding axis A or the flexible region 261c extending parallel to the Y axis, or the display 261 can be divided into regions based on another flexible region (for example, a flexible region extending parallel to the X axis) or another folding axis (for example, a folding axis parallel to the X axis). Such division of the display 261 into regions is simply a physical division based on a pair of housings 210 and 220 and a hinge structure (for example, a hinge structure 334 in Fig. 3), and the display 261 can display substantially one screen through a pair of housings 210 and 220 and a hinge structure. In an embodiment, the first region 261a and the second region 261b can have substantially symmetrical shapes relative to the flexible region 261c.

[0068] In an embodiment, the hinge cover 265 may be located between the first housing 210 and the second housing 220 and is configured to cover the hinge structure (for example, the hinge structure 334 in Fig. 3). The hinge cover 265 may be hidden by at least a portion of the first housing 210 and the second housing 220 or open outward in accordance with the operating state of the electronic device 201. For example, the hinge cover 265 may be hidden by the first housing 210 and the second housing 220 without being open outward when the electronic device 201 is in the unfolded state, as shown in Fig. 2A, and the hinge cover 265 may be open outward between the first housing 210 and the second housing 220 when the electronic device 201 is in the folded state, as shown in Fig. 2B.In addition, when the electronic device 201 is in an intermediate state in which the first housing 210 and the second housing 220 form an angle with each other, at least a portion of the hinge cover 265 may be outwardly open between the first housing 210 and the second housing 220. In this case, the area of ​​the hinge cover 265 that is outwardly open may be smaller than the area of ​​the hinge cover 265 that is open when the electronic device 201 is in the folded state. In an embodiment, the hinge cover 265 may have a curved surface.

[0069] Regarding the operations of the electronic device 201, when the electronic device 201 is in the unfolded state (for example, the state of the electronic device 201 shown in Fig. 2A), the first housing 210 and the second housing 220 may form a first angle (for example, approximately 180 degrees (°)) with each other, and the first region 261a and the second region 261b of the display 261 may be oriented in substantially the same direction. The flexible region 261c of the display 261 may be located substantially in the same plane as the first region 261a and the second region 261b. In an embodiment, when the electronic device 201 is in the unfolded state, the first housing 210 can rotate by a second angle (for example, approximately 360°) relative to the second housing 220, whereby the first housing 210 and the second housing 220 can be bent in the opposite direction so that the second surface 212 and the fourth surface 222 face each other.When the electronic device 201 is in a folded state (for example, the state of the electronic device 201 shown in Fig. 2B), the first housing 210 and the second housing 220 may face each other. The first housing 210 and the second housing 220 may form an angle of approximately 0° to 10°, and the first region 261a and the second region 261b of the display 261 may face each other. At least a portion of the foldable / flexible region 261c of the display 261 may be deformed into a curved surface. In addition, when the electronic device 201 is in an intermediate state, the first housing 210 and the second housing 220 may form a predetermined angle with each other. In this case, the angle (for example, the third angle, approximately 90°) formed by the first region 261a and the second region 261b of the display 261 may be greater than the angle when the electronic device 201 is in the folded state and less than the angle when the electronic device 201 is in the unfolded state.At least a portion of the flexible region 261c of the display 261 may be deformed into a curved surface. In this case, the curvature of the curved surface of the flexible region 261c may be less than the curvature when the electronic device 201 is in the folded state.

[0070] The embodiment of the electronic device described herein is not limited to the form factor of the electronic device 201 described above with reference to Figs. 2A and 2B, but can also be applied to electronic devices of various form factors.

[0071] Referring to Fig. 3, according to the embodiment, the electronic device 301 may include a display module 360 ​​(for example, a display module 160 including a display shown in Fig. 1), a hinge assembly 330, a substrate 370, and a first housing 310 (for example, a first housing 210 in Figs. 2A and 2B), a second housing 320 (for example, a second housing 220 in Figs. 2A and 2B), a first back cover 340 (for example, a first back cover 240 in Figs. 2A and 2B), and a second back cover 350 (for example, a second back cover 250 in Figs. 2A and 2B).

[0072] The display module 360 ​​may include a display 361 (for example, the display 261 of Fig. 2A and 2B) and at least one layer or plate 362 on which the display 361 is located. In an embodiment, the plate 362 may be located between the display 361 and the hinge assembly 330. The display 361 may be located (directly or indirectly) on at least a portion of one surface (for example, the top surface) of the plate 362. The plate 362 may have a shape corresponding to the display 361.

[0073] The hinge assembly 330 may include a first bracket 331, a second bracket 332, a hinge structure 334 located between the first bracket 331 and the second bracket 332, a hinge cover 365 covering the hinge structure 334 when viewed from the outside, and a printed circuit board (PCB) 333 (for example, a flexible printed circuit board (FPCB)), which intersects the first bracket 331 and the second bracket 332. The printed circuit board 333 can be formed, for example, as a flexible printed circuit board.

[0074] In an embodiment, the hinge assembly 330 may be located between the plate 362 and the substrate 370. For example, the first bracket 331 may be located between the first region 361a of the display 361 and the first substrate 371. The second bracket 332 may be located between the second region 361b of the display 361 and the second substrate 372.

[0075] In an embodiment, at least a portion of the printed circuit board 333 and the hinge structure 334 may be located inside the hinge assembly 330. The printed circuit board 333 may be located in a direction (for example, the X-axis direction) that intersects the first bracket 331 and the second bracket 332. The printed circuit board 333 may be located in a direction (for example, the X-axis direction) perpendicular to the folding axis (for example, the Y-axis or the folding axis A in Fig. 2A) of the flexible region 361c of the electronic device 301.

[0076] The substrate 370 may include a first substrate 371 located (directly or indirectly) on the first bracket 331, and a second substrate 372 located on the second bracket 332. The first substrate 371 and the second substrate 372 may be located in the space formed by the hinge assembly 330, the first housing 310, the second housing 320, the first back cover 340 and the second back cover 350. On the first substrate 371 and the second substrate 372, components may be provided for implementing various functions of the electronic device 301.

[0077] The first housing 310 and the second housing 320 can be assembled together to be connected to both sides of the hinge unit 330 in a state in which the display module 360 ​​is connected to the hinge unit 330. The first housing 310 and the second housing 320 can slide on both sides of the hinge unit 330 to be connected to the hinge unit 330.

[0078] In an embodiment, the first housing 310 may include a first rotation support surface 314, and the second housing 320 may include a second rotation support surface 324 corresponding to the first rotation support surface 314. The first rotation support surface 314 and the second rotation support surface 324 may include curved surfaces corresponding to the curved surfaces included in the hinge cover 365.

[0079] In an embodiment, when the electronic device 301 is in the unfolded state (for example, the state of the electronic device 201 shown in Fig. 2A), the first rotation supporting surface 314 and the second rotation supporting surface 324 may cover the hinge cover 365 such that the hinge cover 365 is not opened through the rear surface of the electronic device 301 or is opened minimally or substantially minimally. When the electronic device 301 is in the folded state (for example, the state of the electronic device 201 shown in Fig. 2B), the first rotation supporting surface 314 and the second rotation supporting surface 324 may rotate along the curved surfaces included in the hinge cover 365 such that the hinge cover 365 is maximally or substantially opened through the rear surface of the electronic device 301.

[0080] Referring to Fig. 4A, 4B and 4C, according to an embodiment, the electronic device 401 (for example, the electronic device 301 of Fig. 3) may include a first housing (for example, the first housing 310), a second housing (for example, the second housing 320), a first bracket 431 (for example, the first bracket 331), a second bracket 432 (for example, the second bracket 332), a flexible printed circuit board 433 (for example, the printed circuit board 333), a first support housing 435, a second support housing 436 and a hinge cover 465 (for example, the hinge cover 365).

[0081] The first support body 435 can support the first bracket 431. The first support body 435 can include a first fixing body 4351 attached to one surface (for example, the upper surface in Fig. 4A) of the first bracket 431, and a first elastic body 4352 located on one surface (for example, P11 and P12) of the first fixing body 4351.

[0082] The first fixing body 4351 may include a first support plane P11, which is substantially flat and at least partially supports the first elastic body 4352, and a second support plane P12, which is inclined to the first support plane P11. For example, when the state of the electronic device 401 changes from the unfolded state (for example, as shown in Fig. 4A) to the folded state (for example, as shown in Fig. 4B), the portion of the first elastic body 4352, which is not supported by the first support plane P11, may contact at least a portion of the flexible printed circuit board 433 (for example, the rigid portion 4331 and / or the first flexible portion 4332 of the flexible printed circuit board 433) and may be at least partially bent to be supported by the second support plane P12.

[0083] The second support body 436 can support the second bracket 432. The second support body 436 can include a second fixing body 4361 attached to one surface (for example, the upper surface in Fig. 4A) of the second bracket 432, and a second elastic body 4362 located on one surface (for example, P21 and P22) of the second fixing body 4361.

[0084] The second fixing body 4361 may include a third support plane P21, which is substantially flat and at least partially supports the second elastic body 4362, and a fourth support plane P22, which is inclined to the third support plane P21. For example, when the state of the electronic device 401 changes from the unfolded state (for example, as shown in Fig. 4A) to the folded state (for example, as shown in Fig. 4B), the portion of the second elastic body 4362, which is not supported by the third support plane P21, may contact at least a portion of the flexible printed circuit board 433 (for example, the rigid portion 4331 and / or the second flexible portion 4333 of the flexible printed circuit board 433) and may be at least partially bent to be supported by the fourth support plane P22.

[0085] The hinge cover 465 may include a first cover portion 4651 (for example, a lower portion) having a first inner surface F1, a second cover portion 4652 (for example, a first wall portion) having a second inner surface F2 on a first side (for example, the right side in Fig. 4A) of the first cover portion 4651, and a third cover portion 4653 (for example, a second wall portion) having a third inner surface F3 on a second side (for example, the left side in Fig. 4A) opposite the first side of the first cover portion 4651.

[0086] In an embodiment, the first section 4651 of the lid may be symmetrical with respect to a virtual reference plane V3 that includes the folding axis A. For example, the reference plane V3 may intersect (for example, be orthogonal to) the first inner surface F1 of the first section 4651 of the lid. The second section 4652 of the lid and the third section 4653 of the lid may be symmetrical with respect to each other with respect to the virtual reference plane V3 that includes the folding axis A. The first inner surface F1 may be a substantially flat surface, and the second inner surface F2 and the third inner surface F3 may be substantially curved surfaces. The first inner surface F1, the second inner surface F2 and the third inner surface F3 may be substantially seamlessly connected to form a single surface.

[0087] The flexible printed circuit board 433 may include a rigid portion 4331, a first flexible portion 4332 connected to a first side (for example, the right side in Fig. 4A) of the rigid portion 4331, and a second flexible portion 4333 connected to a second side (for example, the left side in Fig. 4A) of the rigid portion 4331.

[0088] The rigid portion 4331 may be a portion that is relatively substantially rigid in the flexible printed circuit board 433, and the first flexible portion 4332 and the second flexible portion 4333 may be a portion that is relatively substantially flexible in the flexible printed circuit board 433. For example, the rigid portion 4331 is more rigid than the first flexible portion 4332 and the second flexible portion 4333. The rigidity of the flexible printed circuit board 433 may vary depending on the point at which the rigid portion 4331 and the first flexible portion 4332 are connected, and the rigidity of the flexible printed circuit board 433 may vary depending on the point at which the rigid portion 4331 and the second flexible portion 4333 are connected.

[0089] The first virtual plane V1, including the point at which the rigid portion 4331 and the first flexible portion 4332 are connected, can be defined between the rigid portion 4331 and the first flexible portion 4332. The second virtual plane V2, including the point at which the rigid portion 4331 and the second flexible portion 4333 are connected, can be defined between the rigid portion 4331 and the second flexible portion 4333. The base plane V3, including the folding axis A, can be defined between the first virtual plane V1 and the second virtual plane V2. In an embodiment, the first virtual plane V1 and the second virtual plane V2 may be substantially parallel to each other, and the first virtual plane V1, the second virtual plane V2 and the reference plane V3 may be substantially parallel to each other.

[0090] Although the flexible printed circuit board 433 has been described above as being divided into a rigid portion 4331, a first flexible portion 4332 and a second flexible portion 4333, the rigid portion 4331, the first flexible portion 4332 and the second flexible portion 4333 can be regarded as a single component that is formed as a single whole.

[0091] The rigid portion 4331 may be configured to be placed (directly or indirectly) on the first portion 4651 of the cover in a folded state (for example, a state in which the first housing 310 and the second housing 320 of Fig. 3 form a first angle (for example, from approximately 0 to 10 degrees [°])) of the electronic device 401. The rigid portion 4331 may have a surface F4 that substantially faces the first inner surface F1 of the first portion 4651 of the cover.

[0092] When the state of the electronic device 401 changes from the folded state to the unfolded state (for example, a state in which the first housing 310 and the second housing 320 in Fig. 3 form a second angle (for example, approximately 180°)), the rigid portion 4331 may move in a direction (for example, the +Z direction in Figs. 4A and 4B), receding from the first cover portion 4651. In contrast, when the state of the electronic device 401 changes from the unfolded state to the folded state, the rigid portion 4331 may move in another direction (for example, the -Z direction in Figs. 4A and 4B), approaching the first cover portion 4651.

[0093] The first flexible portion 4332 may be configured to bend along the second inner surface F2 of the second portion 4652 of the cover between the folded state and the unfolded state of the electronic device 401. In the folded state of the electronic device 401, the first flexible portion 4332 may have at least two rounded portions (for example, R11 and R12). For example, the first rounded portion R11 may be formed facing the inner space of the hinge cover 465 along the second inner surface F2, and the second rounded portion R12 may be formed facing the second portion 4652 of the cover along one surface (for example, the upper surface in Fig. 4A) of the first bracket 431. In the folded state of the electronic device 401, an opening force of a predetermined value (for example, approximately 48.4 megapascals (MPa)) may be applied to the first rounded portion R11 and the second rounded portion R12.In the unfolded state of the electronic device 401, the first flexible section 4332 can at least partially contact the first elastic body 4352 and bend, passing along one surface of the first bracket 431.

[0094] The second flexible portion 4333 may be configured to bend along the third inner surface F3 of the third portion 4653 of the cover between the folded state and the unfolded state of the electronic device 401. In the folded state of the electronic device 401, the second flexible portion 4333 may have at least two rounded portions (for example, R21 and R22). For example, the third rounded portion R21 may be formed facing the inner space of the hinge cover 465 along the third inner surface F3, and the fourth rounded portion R22 may be formed facing the third portion 4653 of the cover along one surface (for example, the upper surface in Fig. 4A) of the second bracket 432. In the folded state of the electronic device 401, an opening force of a predetermined value (for example, approximately 48.4 MPa) may be applied to the third rounded portion R21 and the fourth rounded portion R22.In the unfolded state of the electronic device 401, the second flexible section 4333 can at least partially contact the second elastic body 4362 and bend, passing along one surface of the second bracket 432.

[0095] While the electronic device 401 changes its state between the folded state and the unfolded state, the rigid portion 4331 may substantially maintain its outline and / or shape. For example, the rigid portion 4331 may maintain a substantially symmetrical shape relative to the reference plane V3 between the folded state and the unfolded state of the electronic device 401.

[0096] In an embodiment, while the electronic device 401 changes its state between the folded state and the unfolded state, the rigid portion 4331 can move along a predetermined trajectory. For example, the surface F4 of the rigid portion 4331 can be oriented in a substantially constant direction (for example, the + / -Z direction) between the folded state and the unfolded state of the electronic device 401. The rigid portion 4331 can move in the space between the first virtual plane V1 and the second virtual plane V2. The rigid portion 4331 can move along the base plane V3. The normal direction of the surface F4 of the rigid portion 4331 can be substantially orthogonal to the normal direction of the first virtual plane V1, the normal direction of the second virtual plane V2 and / or the normal direction of the third virtual plane V3.

[0097] In an embodiment, the surface F4 of the rigid portion 4331 may have a shape that substantially complements the shape of the first inner surface F1. For example, when the first inner surface F1 has a substantially flat surface, the surface F4 of the rigid portion 4331 may also have a substantially flat surface. In an embodiment, the surface F4 of the rigid portion 4331 may have a shape that at least partially substantially complements the shape of the first inner surface F1.

[0098] Referring to Fig. 5A, 5B and 5C, according to an embodiment, the electronic device 501 (for example, the electronic device 301 in Fig. 3) may include a first housing (for example, the first housing 310), a second housing (for example, the second housing 320), a first bracket 531 (for example, the first bracket 331), a second bracket 532 (for example, the second bracket 332), a flexible printed circuit board 533 (for example, the printed circuit board 333), a first support housing 535 (for example, the first support housing 435 in Fig. 4A and 4B), a second support housing 536 (for example, the second support housing 436 in Fig. 4A and 4B) and a hinge cover 565 (for example, the hinge cover 365 in Fig. 3 or the hinge cover 465 in Fig. 4A-4C).

[0099] The hinge cover 565 may include a first cover portion 5651 (for example, the first cover portion 4651 in Fig. 4A-4C) having a first inner surface F1, a second cover portion 5652 (for example, the second cover portion 4652) having a second inner surface F2, and a third cover portion 5653 (for example, the third cover portion 4653) having a third inner surface F3.

[0100] The first section 5651 of the cover may include a first part 5651a connected to the second section 5652 of the cover and the third section 5653 of the cover, and a second part 5651b connected to the first part 5651a and protruding from the first part 5651a toward the inner space of the hinge cover 565. The first part 5651a may have a pair of first flat surfaces F11 that are substantially flat. The second part 5651b may have a first convex surface F12 that protrudes from the pair of first flat surfaces F11 and is located substantially flat, and a pair of first inclined surfaces F13 between the pair of first flat surfaces F11 and the first convex surface F12. In an embodiment, the pair of first flat surfaces F11, the first convex surface F12 and the pair of first inclined surfaces F13 may be substantially seamlessly connected to form a single surface.

[0101] In an embodiment, a substantially curved surface may be formed between at least one of the first flat surfaces F11 and at least one of the first inclined surfaces F13. In an embodiment, a substantially curved surface may be formed between the first convex surface F12 and at least one of the first inclined surfaces F13.

[0102] In an embodiment, the first inclined surfaces F13 may have substantially the same inclination angle relative to the pair of first flat surfaces F11 and / or the first convex surface F12. In an embodiment, the first inclined surfaces F13 may have different inclination angles. In an embodiment, in the second part 5651b, the pair of first inclined surfaces F13 may be substantially perpendicular to at least one of the first flat surfaces F11 and / or the first convex surface F12.

[0103] In an embodiment, the first portion 5651 of the cover may be symmetrical with respect to a virtual reference plane V3 that includes the folding axis A. For example, the first flat surfaces F11 may be symmetrical with respect to the reference plane V3, and the first convex surface F12 may be symmetrical with respect to the reference plane V3. In an embodiment, the first convex surface F12 may have regions of substantially the same size that are symmetrical with respect to the reference plane V3. In an embodiment, the first inclined surfaces F13 may be symmetrical with respect to the reference plane V3.

[0104] The flexible printed circuit board 533 may include a rigid portion (for example, the rigid portion 4331 of Fig. 4A-4C) having a surface F4 substantially facing the first inner surface F1, a first flexible portion 5332 (for example, the first flexible portion 4332) and a second flexible portion 5333 (for example, the second flexible portion 4333). A first virtual plane V1, including a point at which the rigid portion 5331 and the first flexible portion 5332 are connected, may be defined between the rigid portion 5331 and the first flexible portion 5332. A second virtual plane V2, including a point at which the rigid portion 5331 and the second flexible portion 5333 are connected, may be defined between the rigid portion 5331 and the second flexible portion 5333.

[0105] The surface F4 of the rigid portion 5331 may have a shape complementary to the shape of the first inner surface F1 of the first portion 5651 of the lid, to which the surface F4 essentially faces. In an embodiment, the surface F4 may include a pair of second flat surfaces F41 having a shape complementary to the shape of the pair of first flat surfaces F11 and respectively facing the pair of first flat surfaces F11, and a second curved surface F42 between the pair of second flat surfaces F41, facing the first convex surface F12 and the pair of first inclined surfaces F13.The second curved surface F42 may include a second concave surface F421 facing the first convex surface F12 and having a shape complementary to the shape of the first convex surface F12, and a pair of second inclined surfaces F422, each of which is connected to the second concave surface F421 and a pair of second flat surfaces F41, facing the pair of first inclined surfaces F13, respectively, and having a shape complementary to the shape of the pair of first inclined surfaces F13, respectively.

[0106] Referring to Fig. 6, according to an embodiment, the electronic device 601 (for example, the electronic device 501 of Figs. 5A and 5B) may include a first housing (for example, the first housing 310 of Fig. 3), a second housing (for example, the second housing 320), a first bracket (for example, the first bracket 531 of Figs. 5A and 5B), a second bracket (for example, the second bracket 532), a flexible printed circuit board 633 (for example, the flexible printed circuit board 533), a first support housing (for example, the first support housing 535), a second support housing (for example, the second support housing 536), and a hinge cover 665 (for example, the hinge cover 565). See also the above discussion of Figs. 5A-5C with respect to the elements in Fig. 6.

[0107] The hinge cover 665 may include a first cover portion 6651 (for example, the first cover portion 5651) having a first inner surface F1, a second cover portion 6652 (for example, the second cover portion 5652) having a second inner surface F2, and a third cover portion (for example, the third cover portion 5653) having a third inner surface (for example, the third inner surface F3 in Fig. 5B). The first cover portion 6651 may include a first portion 6651a (for example, the first portion 5651a) and a second portion 6651b (for example, the second portion 5651b). The first portion 6651a may have a pair of first flat surfaces F11, and the second portion 6651b may have a first convex surface F12 and a pair of first inclined surfaces F13.

[0108] The flexible printed circuit board 633 may include a rigid portion 6331 (for example, a rigid portion 5331), a first flexible portion 6332 (for example, a first flexible portion 5332), and a second flexible portion (for example, a second flexible portion 5333).

[0109] In an embodiment, the flexible printed circuit board 633 may include a pair of rigid portions 6331 (or rigid segments) configured to be placed (directly or indirectly) on the first portion 6651 of the cover in the unfolded state (for example, in the state of the electronic device 501 shown in Fig. 5A) of the electronic device 601, and a third flexible portion 6334 between the rigid portions 6331. Any of the rigid portions 6331 may be adjacent to the first flexible portion 6332 and be connected to the first flexible portion 6332, and the other (not shown) of the rigid portions 6331 may be adjacent to the second flexible portion (for example, the second flexible portion 5333) and be connected to the second flexible portion. In the example of Fig. 6, unlike the example of Fig.5A-5C, the portion between the first flexible portion 6332 and the second flexible portion of the flexible printed circuit board 633 cannot be made completely rigid, but the portions respectively adjacent to the first flexible portion 6332 and the second flexible portion can be made rigid.

[0110] The pair of rigid portions 6331 may have a second flat surface F412 facing the first flat surface F11 and having a shape complementary to the shape of the first flat surface F11.

[0111] In an embodiment, the third flexible portion 6334 may include a second flat surface F412 facing the first flat surface F11, a second concave surface F421 facing the first convex surface F12, and a pair of second inclined surfaces F422 facing the pair of first inclined surfaces F13, respectively. In an embodiment, the second concave surface F421 may have a shape complementary to the shape of the first convex surface F12. In an embodiment, the pair of second inclined surfaces F422 may have a shape complementary to the shape of the pair of first inclined surfaces F13.

[0112] Referring to Fig. 7A, 7B and 7C, according to an embodiment, the electronic device 701 (for example, the electronic device 301 in Fig. 3) may include a first housing (for example, the first housing 310), a second housing (for example, the second housing 320), a first bracket 731 (for example, the first bracket 331), a second bracket 732 (for example, the second bracket 332), a flexible printed circuit board 733 (for example, the printed circuit board 333), a first support housing 735 (for example, the first support housing 435 in Fig. 4A and 4B), a second support housing 736 (for example, the second support housing 436 in Fig. 4A and 4B) and a hinge cover 765 (for example, the hinge cover 365 in Fig. 3 or the hinge cover 465 in Fig. 4A-4C).

[0113] The hinge cover 765 may include a first cover portion 7651 (for example, the first cover portion 4651 of Fig. 4A-4C) having a first inner surface F1, a second cover portion 7652 (for example, the second cover portion 4652) having a second inner surface F2, and a third cover portion 7653 (for example, the third cover portion 4653) having a third inner surface F3.

[0114] The first portion 7651 of the lid may include a first part 7651a connected to the second portion 7652 of the lid and the third portion 7653 of the lid, and a second part 7651b connected to the first part 7651a and having a recessed portion R. The first part 7651a may have a pair of first flat surfaces F11, which is substantially flat. The recessed portion R of the second part 7651b may have a first concave surface F12, which is substantially flat, and a pair of first inclined surfaces F13 between the pair of first flat surfaces F11 and the first concave surface F12. In an embodiment, the pair of first flat surfaces F11, the first concave surface F12 and the pair of first inclined surfaces F13 may be substantially seamlessly connected to form a single surface.

[0115] In an embodiment, a substantially curved surface may be formed between at least one of the first flat surfaces F11 and at least one of the first inclined surfaces F13. In an embodiment, a substantially curved surface may be formed between the first concave surface F12 and at least one of the first inclined surfaces F13.

[0116] In an embodiment, the first inclined surfaces F13 may have substantially the same inclination angle relative to the pair of first flat surfaces F11 and / or the first concave surface F12. In an embodiment, the first inclined surfaces F13 may have different inclination angles. In an embodiment, in the second part 7651b, the pair of first inclined surfaces F13 may be substantially perpendicular to at least one of the first flat surfaces F11 and / or the first concave surface F12.

[0117] In an embodiment, the first portion 7651 of the cover may be symmetrical with respect to a virtual reference plane V3, which includes the folding axis A. The first flat surfaces F11 may be symmetrical with respect to the reference plane V3. The first concave surface F12 may be symmetrical with respect to the reference plane V3. In an embodiment, the first concave surface F12 may have regions of substantially the same size, which are made symmetrical with respect to the reference plane V3. In an embodiment, the pair of first inclined surfaces F13 may be symmetrical with respect to the reference plane V3.

[0118] The flexible printed circuit board 733 may include a rigid portion 7331 (for example, a rigid portion 4331) having a surface F4 substantially facing the first inner surface F1, a first flexible portion 7332 (for example, a first flexible portion 4332) and a second flexible portion 7333 (for example, a second flexible portion 4333). The first virtual plane V1, including a point at which the rigid portion 7331 and the first flexible portion 7332 are connected, may be defined between the rigid portion 7331 and the first flexible portion 7332. The second virtual plane V2, including a point at which the rigid portion 7331 and the second flexible portion 7333 are connected, may be defined between the rigid portion 7331 and the second flexible portion 7333.

[0119] In an embodiment, the surface F4 of the rigid portion 7331 may have a shape that is substantially complementary to the shape of the first inner surface F1 of the first portion 7651 of the lid, to which the surface F4 substantially faces. The surface F4 may include a pair of second flat surfaces F41 that have a shape that is complementary to the shape of the pair of first flat surfaces F11 and respectively facing the pair of first flat surfaces F11, and a second curved surface F42 between the first concave surface F12 and the pair of second flat surfaces F41, respectively facing the pair of first inclined surfaces F13.The second curved surface F42 may include a second convex surface F421 facing the first concave surface F12 and having a shape complementary to the shape of the first concave surface F12, and a pair of second inclined surfaces F422, each of which is connected (directly or indirectly) to the second convex surface F421 and a pair of second flat surfaces F41, facing the pair of first inclined surfaces F13, respectively, and having a shape complementary to the shape of the pair of first inclined surfaces F13, respectively.

[0120] Referring to Fig. 8, according to an embodiment, the electronic device 801 (for example, the electronic device 701 in Figs. 7A and 7B) may include a first housing (for example, the first housing 310 in Fig. 3), a second housing (for example, the second housing 320), a first bracket (for example, the first bracket 731 in Figs. 7A and 7B), a second bracket (for example, the second bracket 732), a flexible printed circuit board 833 (for example, the flexible printed circuit board 733), a first support housing (for example, the first support housing 735), a second support housing (for example, the second support housing 736), and a hinge cover 865 (for example, the hinge cover 765). Note also the first virtual plane V1 and the recessed portion R in Fig. 8, discussed above in connection with other drawings.

[0121] The hinge cover 865 may include a first cover portion 8651 (for example, a first cover portion 7651) having a first inner surface F1, a second cover portion 8652 (for example, a second cover portion 7652) having a second inner surface F2, and a third cover portion (for example, a third cover portion 7653) having a third inner surface (for example, a third inner surface F3 in Fig. 7B). The first cover portion 8651 may include a first portion 8651a (for example, a first portion 7651a) and a second portion 8651b (for example, a second portion 7651b). The first portion 8651a may have a pair of first flat surfaces F11, and the second portion 8651b may have a first concave surface F12 and a pair of first inclined surfaces F13.

[0122] The flexible printed circuit board 833 may include a rigid portion 8331 (for example, a rigid portion 7331), a first flexible portion 8332 (for example, a first flexible portion 7332), and a second flexible portion (for example, a second flexible portion 7333).

[0123] In an embodiment, the flexible printed circuit board 833 may include a pair of rigid portions 8331 (or rigid segments) configured to be located (directly or indirectly) on the first portion 8651 of the cover in the unfolded state (for example, in the state of the electronic device 701 shown in Fig. 7A) of the electronic device 801 and a third flexible portion 8334 between the rigid portions 8331. Any of the rigid portions 8331 may be adjacent to the first flexible portion 8332 and be connected (directly or indirectly) to the first flexible portion 8332, and the other (not shown) of the rigid portions 8331 may be adjacent to the second flexible portion (for example, the second flexible portion 5333) and be connected (directly or indirectly) to the second flexible portion. In the example in Fig. 8, in contrast to the example in Fig.7A-7C, the section between the first flexible section 8332 and the second flexible section of the flexible printed circuit board 833 cannot be made completely rigid, but the sections respectively adjacent to the first flexible section 8332 and the second flexible section can be made rigid.

[0124] The pair of rigid portions 8331 may have a second flat surface F411 facing the first flat surface F11 and having a shape complementary to the shape of the first flat surface F11.

[0125] In an embodiment, the third flexible portion 8334 may include a second flat surface F412 facing the first flat surface F11, a second convex surface F421 facing the first concave surface F12, and a pair of second inclined surfaces F422 respectively facing the pair of first inclined surfaces F13. In an embodiment, the second convex surface F421 may have a shape complementary to the shape of the first concave surface F12. In an embodiment, the pair of second inclined surfaces F422 may have a shape complementary to the shape of the pair of first inclined surfaces F13.

[0126] Referring to Fig. 9, according to an embodiment, the electronic device 901 (for example, the electronic device 401 in Figs. 4A-4C) may include a first housing (for example, the first housing 310 in Fig. 3), a second housing (for example, the second housing 320), a first bracket (for example, the first bracket 331), a second bracket (for example, the second bracket 332), a flexible printed circuit board 933 (for example, the printed circuit board 333), a first support housing (for example, the first support housing 435 in Figs. 4A and 4B), a second support housing (for example, the second support housing 436 in Figs. 4A and 4B) and a hinge cover 965 (for example, the hinge cover 465 in Figs. 4A-4C).

[0127] The flexible printed circuit board 933 may include a rigid portion 9331 (for example, a rigid portion 4331), a first flexible portion 9332 (for example, a first flexible portion 4332), and a second flexible portion 9333 (for example, a second flexible portion 4333). In an embodiment, the flexible printed circuit board 933 may include a plurality of stacked metal layers (ML). Each of the metal layers may be a copper-clad layer, one or both surfaces of which are connected by a dielectric.

[0128] The hinge cover 965 may include a first cover portion 9651 (for example, a first cover portion 4651), a second cover portion 9652 (for example, a second cover portion 4652), and a third cover portion 9653 (for example, a third cover portion 4653).

[0129] In an embodiment, the rigid portion 9331 (for example, the rigid portion 5331 of Figs. 5A-5C) may have a shape that at least partially complements the shape of the hinge cover 965 (for example, the hinge cover 565 of Figs. 5A-5C) having a convex design. In an embodiment, the rigid portion 9331 (for example, the rigid portion 7331 of Figs. 7A-7C) may have a shape that at least partially complements the shape of the hinge cover 965 (for example, the hinge cover 765 of Figs. 7A-7C) having a concave design.

[0130] In an embodiment, the prepreg cannot be applied between a pair of adjacent metal layers in the rigid section 9331. The rigid section 9331 can include a plurality of reinforcing sections (for example, bonding layers (BL)) that contact the pair of adjacent metal layers and are configured to reinforce the pair of adjacent metal layers. The reinforcing sections can include, for example, a viscous adhesive. For example, the flexible printed circuit board 933 can be manufactured by applying a viscous adhesive between a pair of adjacent metal layers when producing the flexible printed circuit board 933, or the flexible printed circuit board 933, including the rigid section 9331, can be manufactured as the adhesive hardens by adding the section to which the adhesive is applied to the frame, giving a predetermined shape before the section (for example, the rigid section 9331) hardens.

[0131] Referring to Fig. 10, according to an embodiment, an electronic device 1001 (for example, an electronic device 401 in Figs. 4A-4C) may include a first housing (for example, a first housing 310 in Fig. 3), a second housing (for example, a second housing 320), a first bracket (for example, a first bracket 331), a second bracket (for example, a second bracket 332), a flexible printed circuit board 1033 (for example, a printed circuit board 333), a first support housing (for example, a first support housing 435 in Figs. 4A and 4B), a second support housing (for example, a second support housing 436 in Figs. 4A and 4B), and a hinge cover 1065 (for example, a hinge cover 465 in Figs. 4A-4C).

[0132] The flexible printed circuit board 1033 may include a rigid portion 10331 (for example, a rigid portion 4331), a first flexible portion 10332 (for example, a first flexible portion 4332), and a second flexible portion (for example, a second flexible portion 4333). The flexible printed circuit board 1033 may include a plurality of metal layers (ML) stacked on top of each other in one direction (for example, the + / -Z direction).

[0133] The hinge cover 1065 may include a first cover portion 10651 (for example, a first cover portion 4651), a second cover portion 10652 (for example, a second cover portion 4652), and a third cover portion 10653 (for example, a third cover portion 4653).

[0134] In an embodiment, the rigid portion 10331 may include a plurality of prepreg layers PL1, PL2, and PL3, each of which is located between a pair of adjacent metal layers. When viewed in the laying direction in which the pair of metal layers is laid (for example, in the direction away from the first portion 10651 of the cap or in the +Z direction), the interval length (for example, the length in the X direction) of the first prepreg layer PL1 located between one pair of metal layers may be shorter than the interval length of the second prepreg layer PL2 located between the subsequent pair of metal layers. In an embodiment, when viewed in the laying direction in which the pair of metal layers is laid (for example, in the direction away from the first portion 10651 of the cap or in the +Z direction), the corresponding interval lengths of the prepreg layers PL1, PL2, and PL3 may sequentially increase.Such a sequential increase in the interval length of the prepreg layers PL1, PL2, and PL3 can reduce the stress applied to the flexible printed circuit board 1033 and can form a natural curved shape of the flexible printed circuit board 1033.

[0135] According to an embodiment, the electronic device (e.g. 301 and 401) may include: a first housing (e.g. 310), a second housing (e.g. 320), a hinge cover (e.g. 365 and 465) located between the first housing 310 and the second housing 320 and including a first cover portion (e.g. 4651), a second cover portion (e.g. 4652) on a first side of the first cover portion 4651 and a third cover portion (e.g. 4653) on a second side of the first cover portion 4651 opposite the first side, a hinge structure (e.g. 334) located (directly or indirectly) on the hinge cover 365 / 465 and configured to rotate the first housing 310 and the second housing 320 between a folded state in which the first housing 310 and the second housing 320 form a first angle, and in an unfolded state in which the first housing 310 and the second housing 320 form a second angle larger than the first angle, the display (for example, 361),including a first region (e.g. 361a) located on the first body 310, a second region (e.g. 361b) located on the second body 320, and a flexible region (e.g. 361c) located between the first region 361a and the second region 361b, and a flexible printed circuit board (e.g. 333 and 433) including a rigid portion (e.g. 4331) configured to be placed on the first region 4651 of the lid in a folded state, a first flexible portion (e.g. 4332) connected to the rigid portion 4331 and configured to at least partially bend along the second region 4652 of the lid, and a second flexible portion (e.g. 4333) connected (directly or indirectly) to the rigid portion 4331 opposite the first flexible portion 4332, and configured to at least partially bend along the third section of the lid (e.g. 4653).,

[0136] In an embodiment, the first virtual plane V1 can be defined between the rigid portion 4331 and the first flexible portion 4332, and the second virtual plane V2 can be defined between the rigid portion 4331 and the second flexible portion 4333 (for example, see Fig. 4A). In addition, the rigid portion 4331 can be configured to move in the space between the first virtual plane V1 and the second virtual plane V2 between the unfolded state and the folded state.

[0137] In an embodiment, the first virtual plane V1 and the second virtual plane V2 may be substantially parallel to each other (for example, see Fig. 4A).

[0138] In an embodiment, the flexible region 361c may include a folding axis A, and the base plane V3, including the folding axis A, may be defined between the first virtual plane V1 and the second virtual plane V2. In addition, the rigid portion 4331 may be configured to maintain a substantially symmetrical shape relative to the base plane V3 between the unfolded state and the folded state.

[0139] In an embodiment, the rigid portion 4331 may include a surface F4 having a shape that at least partially complements the shape of the inner surface F1 of the first portion 4651 of the lid.

[0140] In an embodiment, the inner surface F1 of the first portion 4651 of the cover may include a first flat surface, and the rigid portion 4331 may include a second flat surface complementary to the first flat surface.

[0141] In an embodiment, the inner surface F1 of the first portion of the cover (for example, 5651) may further include a first convex surface F12, and the rigid portion (for example, 5331) may further include a second concave surface F421 complementary to the first convex surface F12.

[0142] In the embodiment, the inner surface F1 of the first portion 5651 of the cover may further include a pair of first inclined surfaces F13 between the first flat surface F11 and the first convex surface F12, and the rigid portion 5331 may further include a pair of second inclined surfaces F422, respectively complementing the pair of first inclined surfaces F13.

[0143] In an embodiment, the rigid portion (e.g., 9331) may include a plurality of stacked metal layers (ML) and a plurality of reinforcing portions (or bonding layers (BL)), each of which is located between a pair of adjacent metal layers, contacts the pair of adjacent metal layers, and reinforces the pair of adjacent metal layers.

[0144] In an embodiment, the rigid section (for example, 10331) may include a plurality of stacked metal layers (ML) and a plurality of prepregs PL1, PL2, and PL3, each of which is located between a pair of adjacent metal layers. When viewed in the direction away from the first section of the cover (for example, 10651) and in the stacking direction in which the metal layers are stacked, the length of the first prepreg PL1 among the prepregs PL1, PL2, and PL3 may be shorter than the length of the subsequent second prepreg PL2 of the first prepreg PL1.

[0145] In an embodiment, the inner surface F1 of the first portion of the cover (e.g. 7651) may include a first flat surface F11 and a first concave surface F12, and the rigid portion (e.g. 7331) may include a second convex surface F421 complementary to the first concave surface F12.

[0146] The inner surface F1 of the first portion 7651 of the cover may further include a pair of first inclined surfaces F13 between the first flat surface F11 and the first concave surface F12, and the rigid portion 7331 may further include a pair of second inclined surfaces F422, respectively complementing the pair of first inclined surfaces F13.

[0147] In an embodiment, the rigid portion may include a first rigid segment (e.g., 6331 and 8331) adjacent to a first flexible portion (e.g., 6332 and 8332) and a second rigid segment adjacent to the second flexible portion.

[0148] In an embodiment, the flexible printed circuit board (e.g., 633 and 833) may further include a third flexible portion (e.g., 6334 and 8334) between the first rigid segment (e.g., 6331 and 8331) and the second rigid segment.

[0149] In an embodiment, the flexible printed circuit board (for example, 333 and 433) may include a rigid portion (for example, 4331), a first flexible portion (for example, 4332) connected to the rigid portion 4331 and configured to at least partially bend, and a second flexible portion (for example, 4333) connected to the rigid portion 4331 opposite the first flexible portion 4332 and configured to at least partially bend.

[0150] In an embodiment, the rigid portion (e.g., 9331) may include a plurality of stacked metal layers (ML) and a plurality of reinforcing portions (or bonding layers (BL)), each of which is located between a pair of adjacent metal layers, contacts the pair of adjacent metal layers, and reinforces the pair of adjacent metal layers.

[0151] In an embodiment, the rigid section (for example, 10331) may include a plurality of stacked metal layers (ML) and a plurality of prepregs PL1, PL2, and PL3, each of which is located between a pair of adjacent metal layers. When viewed in the stacking direction in which the metal layers are stacked, the length of the first prepreg PL1 among the prepregs PL1, PL2, and PL3 may be shorter than the length of the subsequent second prepreg (for example, PL2) of the first prepreg (for example, PL1) among the prepregs PL1, PL2, and PL3.

[0152] In an embodiment, the rigid portion may include a first rigid segment (e.g., 6331 and 8331) adjacent to a first flexible portion (e.g., 6332 and 8332) and a second rigid segment adjacent to the second flexible portion.

[0153] In an embodiment, the flexible printed circuit board (e.g., 633 and 833) may further include a third flexible portion (e.g., 6334 and 8334) between the first rigid segment (e.g., 6331 and 8331) and the second rigid segment.

[0154] ​​According to an embodiment, the electronic device (e.g. 301 and 401) may include: a first housing (e.g. 310), a second housing (e.g. 320), a hinge cover (e.g. 365 and 465) located between the first housing 310 and the second housing 320 and including a first cover portion (e.g. 4651), a second cover portion (e.g. 4652) on a first side of the first cover portion 4651 and a third cover portion (e.g. 4653) on a second side of the first cover portion 4651 opposite the first side, a hinge structure (e.g. 334) located on the hinge cover 365 / 465 and configured to rotate the first housing 310 and the second housing 320 between a folded state in which the first housing 310 and the second housing 320 form a first angle, and an unfolded state in which the first the housing 310 and the second housing 320 form a second angle larger than the first angle, the display (for example, 361), including the first region (for example, 361a),located on the first body 310, a second region (for example, 361b) located on the second body 320, and a flexible region (for example, 361c) located between the first region 361a and the second region 361b, and a flexible printed circuit board (for example, 333 and 433) including a first bracket (for example, 331 and 431) located between the first region 361a and the first body 310, a second bracket (for example, 332 and 432) located between the second region 361b and the second body 320, a rigid portion (for example, 4331) configured to be received on the first portion 4651 of the lid in a folded state, a first flexible portion (for example, 4332) located between the first bracket 331 / 431 and the second portion 4652 of the lid, connected to the rigid portion 4331 and configured to bend at least partially along the second portion 4652 of the cover, and a second flexible portion (for example, 4333) located between the second bracket 332 / 432 and the third portion 4653 of the cover,connected to the rigid portion 4331 opposite the first flexible portion 4332 and configured to at least partially bend along the third portion of the cover (for example, 4653).,

[0155] The features and aspects of any embodiment described above may be combined with the features and aspects of any other embodiment without resulting in obvious technical contradictions.

Claims

1. An electronic device (301; 401) comprising: first building (310); second building (320); a hinge cover (365; 465) located between at least the first body (310) and the second body (320) and comprising a first portion (4651) of the cover, a second portion (4652) of the cover on a first side of the first portion (4651) of the cover and a third portion (4653) of the cover on a second side of the first portion (4651) of the cover opposite the first side; a hinge structure (334) located on the hinge cover (365; 465) and configured to rotate the first housing (310) and the second housing (320) between a folded state in which the first housing (310) and the second housing (320) form a first angle, and an unfolded state in which the first housing (310) and the second housing (320) form a second angle greater than the first angle; a display (361) comprising a first region (361a) for a first body (310), a second region (361b) for a second body (320) and a flexible region (361c) between at least the first region (361a) and the second region (361b); and a flexible printed circuit board (FPCB) (333; 433) comprising a rigid portion (4331) configured to be placed on a first portion (4651) of a lid in a folded state, a first flexible portion (4332) connected to the rigid portion (4331) and configured to at least partially bend along a second portion (4652) of the lid, and a second flexible portion (4333) connected to the rigid portion (4331) opposite the first flexible portion (4332) and configured to at least partially bend along a third portion (4653) of the lid, wherein the rigid section (4331) is more rigid than the first flexible section (4332) and the second flexible section (4333), wherein the rigid section (4331) comprises a surface (F4) having a shape that at least partially complements the shape of the inner surface (F1) of the first section (4651) of the lid.

2. The electronic device according to claim 1, wherein the first virtual plane (V1) is defined between the rigid section (4331) and the first flexible section (4332), and the second virtual plane (V2) is defined between the rigid section (4331) and the second flexible section (4332), wherein the rigid section (4331) is configured to move in space between the first virtual plane (V1) and the second virtual plane (V2), between the unfolded state and the folded state.

3. An electronic device according to claim 1 or 2, wherein the first virtual plane (V1) and the second virtual plane (V2) are substantially parallel to each other.

4. An electronic device according to any one of claims 1 to 3, wherein the flexible region (361c) has a folding axis (A), and between the first virtual plane (V1) and the second virtual plane (V2) a base plane (V3) is defined containing the folding axis (A), wherein the rigid section (4331) is configured to maintain essentially symmetry with respect to the base plane (V3) between the unfolded state and the folded state.

5. An electronic device according to any one of claims 1-4, wherein the inner surface (F1) of the first portion (4651) of the cover comprises a first flat surface, and the rigid portion (4331) comprises a second flat surface complementary to the first flat surface.

6. An electronic device according to any one of claims 1-5, wherein the inner surface (F1) of the first portion (5651) of the cover further comprises a first convex surface (F12), and the rigid portion (5331) further comprises a second concave surface (F421) complementary to the first convex surface (F12).

7. An electronic device according to any one of claims 1-6, in which the inner surface (F1) of the first portion (5651) of the cover further comprises a pair of first inclined surfaces (F13) between the first flat surface (F11) and the first convex surface (F12), and the rigid portion (5331) further comprises a pair of second inclined surfaces (F422), respectively complementary to the first inclined surfaces (F13).

8. An electronic device according to any one of paragraphs 1-7, in which the rigid portion (9331) comprises: multiple stacked metal layers (ML); And a plurality of reinforcing sections, each of which is located between a pair of adjacent metal layers among the metal layers, wherein each of the reinforcing sections is configured to connect a pair of adjacent metal layers among the metal layers and to reinforce the pair of adjacent metal layers.

9. An electronic device according to any one of paragraphs 1-8, in which the rigid portion (10331) comprises: multiple stacked metal layers (ML); And a set of prepregs (PL1, PL2, PL3), each of which located between a pair of adjacent metal layers (ML) among metal layers (ML), in this case, if you look in the direction of removal from the first section (10651) of the cover and in the direction of laying in which the metal layers (ML) are laid on top of each other, then the length of the first prepreg (PL1) among the prepregs (PL1, PL2, PL3) is less than the length of the subsequent second prepreg (PL2) for the first prepreg (PL1) among the prepregs (PL1, PL2, PL3).

10. An electronic device according to any one of claims 1-9, wherein the inner surface (F1) of the first portion (7651) of the cover comprises a first flat surface (F11) and a first concave surface (F12), and the rigid portion (7331) comprises a second convex surface (F421) complementary to the first concave surface (F12).

11. An electronic device according to any one of claims 1-10, in which the inner surface (F1) of the first portion (7651) of the cover further comprises a pair of first inclined surfaces (F13) between the first flat surface (F11) and the first concave surface (F12), and the rigid portion (7331) further comprises a pair of second inclined surfaces (F422), respectively complementary to the first inclined surfaces (F13).

12. An electronic device according to any one of paragraphs 1-11, wherein the rigid portion comprises: a first rigid segment (6331; 8331) adjacent to the first flexible portion; and the second rigid segment (6331; 8331) next to the second flexible section.

13. An electronic device according to any one of claims 1-12, in which the flexible printed circuit board (633; 833) further comprises a third flexible section (6334; 8334) between the first rigid segment (6331; 8331) and the second rigid segment (6331; 8331).

14. An electronic device according to any one of paragraphs 1-13, containing: a first bracket (331; 431) located between at least the first region (361a) and the first body (310); a second bracket (332; 432) located between at least the second region and the second body, wherein the first flexible section (4332) is located between at least the first bracket (331; 431) and the second section (4652) of the cover, and wherein the second flexible section (4333) is located between at least the second bracket (332; 432) and the third section (4653) of the cover.

Images