Electronic module with chip and cavity substrate

Abstract

The technical solution relates to an electronic module, which comprises a lower substrate (1) with conductive connections (5) and an electronic component, in particular a chip (4), connected via an anisotropic conductive film (6). The module further comprises an upper substrate (7) with a cavity (2), the cavity being arranged so that when the module is assembled it covers the electronic component. The space between the component and the upper substrate can be filled with an encapsulating material (8). The solution enables a reduction in the dimensions of the module, improved mechanical protection and reduced thermal stress during production. It is particularly suitable for miniaturized electronic systems, contactless modules and compact electronic devices.

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