Nanocomposite active solder

Abstract

The nanocomposite active solder contains nanoparticles of ceramic materials in an amount of 0.5 to 10 wt. %, the active element in an amount of up to 5 wt. % and the remainder up to 100% is tin, with the active element being titanium or an element from the lanthanide group. Soldering is carried out by heating with a hot plate in combination with ultrasonic activation or with a heated soldering iron with support for heating with a hot plate in combination with ultrasonic activation, with ultrasonic activation having a frequency of 40 – 60 kHz and application temperatures ranging from 230 to 280 °C. The nanocomposite active solder is used for direct soldering of ceramic and other difficult-to-solder materials without the use of a coating and without the use of a flux.