Soft active solder based on Zn alloyed with nanoparticles of ceramic materials and soldering method
SK289478B6Active Publication Date: 2026-10-14SLOVENSKA TECHNICKA UNIVERZITA V BRATISLAVE
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Patent Information
- Application Number
- SK20252
- Authority / Receiving Office
- SK · SK
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-10-14
- Estimated Expiration
- 2045-01-13
Abstract
The soft active lead-free Zn-based solder consists of 3 to 6 wt. % Al, 0.5 to 5 wt. % Ti and 0.5 to 10 wt. % nanoparticles of ceramic material, wherein the ceramic material is selected from the group consisting of Al2O3, AlN, SiC, Si3N4, preferably SiC. This soft active solder connects non-metallic material to non-metallic material, non-metallic material to metallic material directly or sequentially by ultrasound.
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