Soft solder Sn-based alloyed with active metal Cr
SK842026U1Undetermined Publication Date: 2026-07-08SLOVENSKA TECHNICKA UNIVERZITA V BRATISLAVE
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Patent Information
- Authority / Receiving Office
- SK · SK
- Patent Type
- Utility models
- Current Assignee / Owner
- SLOVENSKA TECHNICKA UNIVERZITA V BRATISLAVE
- Filing Date
- 2026-03-19
- Publication Date
- 2026-07-08
Abstract
The soft active lead-free solder contains 0.1 to 6 wt. % Cr, 1.5 to 6 wt. % Ag, with the remainder being Sn. This soft active solder is used to join non-metallic material to non-metallic material, non-metallic material to metallic material, directly or sequentially, by ultrasound.
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