Active solder based on Zn-Sb for ultrasonic soldering
SK852026U1Undetermined Publication Date: 2026-07-08SLOVENSKA TECHNICKA UNIVERZITA V BRATISLAVE
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Patent Information
- Authority / Receiving Office
- SK · SK
- Patent Type
- Utility models
- Current Assignee / Owner
- SLOVENSKA TECHNICKA UNIVERZITA V BRATISLAVE
- Filing Date
- 2026-03-19
- Publication Date
- 2026-07-08
Abstract
A soft active solder for higher application temperatures based on Zn-Sb contains 0.5 to 4 wt. % Sb, 0.5 to 5 wt. % Ti, with the balance being Zn. The solder alloy may also contain La in the range of 0.5 to 5 wt. %. This soft active solder alloy is used to join non-metallic material to non-metallic material, non-metallic material to metallic material directly or sequentially, by ultrasonic
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