Systems, processes, and guiding devices for the formation of rigid EMI shielding on electronic packaging or parts thereof.
Patent Information
- Application Number
- TH2201003299
- Authority / Receiving Office
- TH · TH
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-05-31
- Filing Date
- 2022-05-31
- Publication Date
- 2026-10-26
Smart Images
Figure 00000001_0000
Claims
1. A guiding device (100) for supporting at least one unified electronic package (300) during the spraying process in which a fixed electromagnetic interference shield is formed on the unified electronic package (300), a guiding device (100) incorporated with a body with a bow-shaped surface (101) on which the unified electronic package (300) is received; where the bow-shaped surface (101) enables a significant continuous contact between the guiding device (100) and the unified electronic package (300).
2. A guiding device (100) according to claim 1 incorporated with an attachment piece to hold the unified electronic package (300) on the bow-shaped surface (101), an attachment piece in which a number of embedded magnets (102) are placed in contact with the guiding device (100).
3. A guiding device (100) according to claim 1 or claim 2 in which the bow-shaped surface (101) is a raised paraboloid. 4.A system for forming a fixed electromagnetic interference shield onto at least one unified electronic package (300) comprising a tray preparation module which prepares the tray (200) by mounting electromagnetic interference tape (202) onto the frame (201) with the electromagnetic interference tape (202) covering the entire area of the frame (201); a pick-and-place module for placing at least one unified electronic package (300) onto the tray (200); a guide device (100) for supporting the tray (200) containing the unified electronic package (300) comprising a device with a curved surface (101); and a sprayer which forms the fixed electromagnetic interference shield onto the unified electronic package (300) by spraying; where the curved surface (101) of the guide device (100) allows for significant continuous contact between the guide device (100) and the unified electronic package (300). 5.The system under claim 4 in which the guiding device (100) is further incorporated with a mounting piece arranged to hold the tray (200) containing the unified electronic packaging (300) on a curved surface (101), a mounting piece incorporating several embedded magnets (102) placed against the body of the guiding device (100).
6. A system under claim 4 or claim 5 in which the system is incorporated with a pre-taped tape mounting module for pre-taping tape layering (301) to cover the exposed contacts of the pre-integrated electronic package.
7. A system under claims 4 through 6 in which a pick-and-place module places the pre-integrated electronic package (300) on a tray (200) with the pre-taped tape (301) of the pre-integrated electronic package (300) in contact with the electromagnetic interference tape (202).
8. A system under claims 4 through 7 in which the system is incorporated with a roller press module that permanently secures the pre-integrated electronic package (300) on a tray (200) by applying pressure in both the X and Y directions. 9.
10. A method for the formation of a fixed electromagnetic interference (EMI) cover on an electronic package that is integrated with at least one (300) of the type specified in claim 4, which includes a tray preparation procedure (200) with the installation of an EMI cover on a frame (201); the arrangement of an electronic package At least one unified electronic package (300) is placed on the tray (200); the tray (200) is supported by the use of a guide device (100) with a curved surface (101); and the formation of a fixed electromagnetic interference shield on at least one unified electronic package (300) on the tray (200) by a spraying process; where the curved surface (101) of the guide device (100) allows for significant continuous contact between the guide device (100) and the unified electronic package (300).11.Method according to claim 10 in which the assembly method is further combined with a procedure for attaching the unified electronic package (300) onto the tray (200) by applying pressure in both the X and y directions using a roller press module.
12. Method according to claim 10 or 11 in which the assembly method is further combined with a procedure for removing the unified electronic package (300) from the tray (200) after the spraying process is completed;