อุปกรณ์เดินสายลวด

Abstract

DEPCT67 การจัดเตรียมส่วนนำทางสายลวดแบบดูดด้วยสุญญากาศที่ใช้สำหรับการสอดสายลวด หรือลวดเคลือบไปในรูที่จัดให้มีในซับสเทรทอย่างถูกต้อง อุปกรณ์เดินสายลวด100ตามลักษณะหนึ่งของการประดิษฐ์นี้ซึ่งเดินสายลวดไปในรู17 ที่จัดให้มีในซับสเทรท16และจุดเชื่อมต่อบนซับสเทรทที่จัดแยกจากรูโดยระยะห่างที่ได้รับการ กำหนดไว้ล่วงหน้า,โดยใช้สายลวด11หรือลวดเคลือบ,รวมถึง:แคพิลลารี21ซึ่งป้อนสายลวด หรือลวดเคลือบออก;ส่วนนำทางสายลวด12ซึ่งรวมถึงช่องทางการดูด13aถึง13cสำหรับการดูด สายลวดหรือลวดเคลือบ;ฮอร์น22ซึ่งจับยึดแคพิลลารีและส่วนนำทางสายลวด;และกลไกการ เคลื่อนที่ส่วนนำทางสายลวดซึ่งเคลื่อนส่วนนำทางสายลวดในทิศทางที่จะนำช่องทางกการดูด เข้าใกล้กับสายลวดหรือลวดเคลือบที่ป้อนออกจากแคพิลลารีและในทิศทางที่จะเลื่อนเปลี่ยนตำแหน่ง ช่องทางการดูดออกจากสายลวดหรือลวดเคลือบ;

Description

wiring device

[0001] The present invention relates to a wiring device.

[0002] The substrate has two or more rows of holes, and a wire or covered wire unwound from the tip of a capillary held by an ultrasonic horn is passed through one of the holes. The wire or covered wire is then drawn under the substrate. The capillary is raised while unwound, the substrate is moved horizontally, and the capillary is lowered, thereby joining the other end of the wire or covered wire to the substrate. The wire or covered wire is then cut, the capillary is raised, the substrate is moved horizontally to position the capillary above one of the holes, the capillary is lowered, and the wire or covered wire unwound from the tip of the capillary is passed through the hole. The wire or covered wire is then drawn under the substrate. The same process is repeated to join the other end of the wire or covered wire to the substrate. By repeating this process, the wire or covered wire is passed through each of the two or more rows of holes, and the other end of each wire or covered wire is joined to the substrate. Wiring is assembled in this manner.

[0003] As described above, the other end of the wire or coated wire is joined to a substrate. However, as shown in FIG. 9, there is a substrate in which a substrate base (a base having a certain thickness) 18 is placed on substrate 16 at a predetermined distance from two or more rows of holes 17 formed in substrate 16, and an electrode (not shown) provided on substrate base 18 corresponds to the other end of the wire or coated wire.

[0004] In the case of such a substrate 16, the ultrasonic horn 22 and the substrate base 18 interfere with each other as shown in Fig. 9, so the tip of the capillary 21 and the substrate 16 cannot be brought close enough to each other, and the wire 11 or covered wire fed out from the tip of the capillary 21 is inserted into one of the holes 17. Therefore, if there is resistance between the hole 17 in the substrate 16 and the wire 11 or covered wire when inserting the wire 11 or covered wire, the wire 11 or covered wire may be bent when inserted into the hole 17 (see Fig. 9).

[0005] Furthermore, as shown in FIG. 10, when inserting the wire 11 or covered wire, the tip of the wire 11 or covered wire may vibrate due to vibrations of the device or the flow of air in the surrounding area, and the wire 11 or covered wire may not enter the hole 17.

[0006] It is necessary to prevent the wire 11 or the coated wire from failing to be inserted into the hole 17 as described above.

[0007] An object of one aspect of the present invention is to provide a wiring device that can accurately insert a wire or a covered wire into a hole provided in a substrate.

[0008] Various aspects of the present invention will be described below: [1] A wiring device for wiring a wire or a covered wire between a hole formed in a substrate and a connection point on the substrate located a predetermined distance from the hole, the wiring device comprising: a capillary for paying out the wire or the covered wire, a wire guide having a suction port for suctioning the wire or the covered wire, a horn for holding the capillary and the wire guide, and a wire guide mover for moving the wire guide in a direction to bring the suction port closer to or away from the wire or the covered wire paid out from the capillary.

[0009] [2] The wiring device described in [1] above, characterized in that the wire guide has a groove, the suction port is provided on the inner surface of the groove, and the cross section of the inner surface of the groove has a V-shape or a U-shape.

[0010] [3] A wiring device as described in [1] or [2] above, comprising: a lifting mechanism that raises and lowers the capillary and the wire guide held by the horn; and a control unit, wherein the control unit controls the wire or the covered wire unwound from the capillary to be adsorbed by the adsorption port of the wire guide, and the lifting mechanism to lower the capillary and the wire guide, thereby inserting the wire or the covered wire into the hole.

[0011] [4] The wiring device described in [3] above, characterized in that after the wire or the covered wire is inserted into the hole, the control unit releases the suction of the wire or the covered wire from the suction port, causes the lifting mechanism to raise the capillary and the wire guide, and causes the wire guide moving mechanism to move the wire guide in a direction that moves the wire or the covered wire away from the suction port.

[0012] [5] The wiring device according to [1] or [2] above, further comprising: an XY stage on which the substrate is placed; an X-axis movement mechanism for moving the XY stage in the X direction; and a Y-axis movement mechanism for moving the XY stage in the Y direction; wherein the connection point is an electrode, and the wire or the coated wire fed out from the capillary is bonded to the electrode.

[0013] [6] The wiring device described in [3] above, characterized in that the lifting mechanism has a slide member that can be raised and lowered, the horn is attached to the slide member via a connecting member, and the wire guide moving mechanism is attached to the slide member.

[0014] [7] The wiring device described in [1] or [2] above, characterized in that the wire guide moving mechanism is a mechanism that moves the wire guide within a plane that includes the axis of the wire or the covered wire adsorbed by the adsorption port and the axis of the horn.

[0015] [8] The wiring device described in [1] or [2] above, characterized in that the wire guide moving mechanism has a rotating shaft attached to the wire guide and a rotating mechanism that rotates the rotating shaft.

[0016] According to various aspects of the present invention, it is possible to provide a wiring device that can accurately insert a wire or a covered wire into a hole provided in a substrate.

[0017] 1 is a cross-sectional view illustrating a wiring device equipped with a vacuum suction wire guide according to one embodiment of the present invention. It is a perspective view schematically illustrating the entire wiring device shown in FIG. 1. It is a perspective view of the entire wiring device shown in FIG. 1 viewed from a different direction from FIG. 2, and a perspective view of an enlarged portion of the vacuum suction wire guide. (A) to (D) are cross-sectional views illustrating a method for wiring a wire 11 or a covered wire. (A) to (D) are cross-sectional views illustrating a method for wiring a wire 11 or a covered wire. It is a perspective view illustrating a state in which a wire or a covered wire is routed between each of a plurality of holes in a substrate and each of a plurality of connection points provided on a substrate base disposed on the substrate. It is a perspective view illustrating a state in which a wire or a covered wire is routed between each of a plurality of holes in a substrate and each of a plurality of connection points provided on a substrate base disposed on the substrate. (A) is a top view illustrating a substrate 16, a substrate base 18, and a substrate 39 excluding the wiring device shown in FIGS. 6 and 7, and (B) is a cross-sectional view of (A). It is a cross-sectional view illustrating an example in which a wire or a covered wire is not inserted into a hole provided in a substrate. 10A and 10B are cross-sectional views showing an example in which a wire or a coated wire fails to be inserted into a hole provided in a substrate.

[0018] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following description, and it will be readily understood by those skilled in the art that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.

[0019] Fig. 1 is a cross-sectional view illustrating a wiring device equipped with a vacuum suction wire guide according to one embodiment of the present invention. Fig. 2 is a perspective view schematically illustrating the entire wiring device shown in Fig. 1. Fig. 3 is a perspective view of the entire wiring device shown in Fig. 1 viewed from a different direction than Fig. 2 and an enlarged perspective view of a portion of the vacuum suction wire guide.

[0020] <Vacuum suction wire guide 10> First, the vacuum suction wire guide 10 will be described. As shown in FIG. 1, the vacuum suction wire guide 10 guides a wire 11 (which may be a covered wire). As shown in FIG. 3, the vacuum suction wire guide 10 includes a wire guide 12 having a groove 12a, and a first suction port 13a, a second suction port 13b, and a third suction port 13c formed on the inner surface 12b of the groove 12a. The first to third suction ports 13a to 13c are used to vacuum-suck the wire 11 or the covered wire. The cross section of the groove is preferably V-shaped or U-shaped. In this case, the first to third suction ports 13a to 13c are preferably formed at the bottom of the groove 12a.

[0021] 1, the first to third suction ports 13a to 13c are connected to an exhaust path 14, which is provided inside the wire guide 12. The exhaust path 14 is connected to a vacuum exhaust mechanism 15. That is, the first to third suction ports 13a to 13c are connected to the vacuum exhaust mechanism 15 via the exhaust path 14, and the wire 11 or covered wire is sucked into the first to third suction ports 13a to 13c by evacuating the exhaust path 14 using the vacuum exhaust mechanism 15. The vacuum exhaust mechanism 15 is configured, for example, by a vacuum pump or the like.

[0022] According to the vacuum suction wire guide 10 of this embodiment, the first suction port 13a, the second suction port 13b, and the third suction port 13c are provided on the inner surface 12b of the groove 12a, and the wire 11 or covered wire is suctioned by the first to third suction ports 13a to 13c. This allows the wire 11 or covered wire to be reliably fixed with high positional accuracy. Furthermore, by making the cross-sectional shape of the groove 12a V-shaped or U-shaped and providing the first to third suction ports 13a to 13c at the bottom of the groove 12a, the wire 11 can be fixed to the bottom of the groove 12a with even higher positional accuracy.

[0023] 1, the wiring device 100 is a device that uses wires 11 or coated wires to connect a hole 17 formed in a substrate 16 to a connection point 19 (see FIGS. 5C and 5D) on the substrate 16 that is a predetermined distance away from the hole 17. More specifically, the connection point 19 is provided on a substrate base 18 that is disposed on the substrate 16.

[0024] 1 to 3, the wiring device 100 includes the vacuum suction wire guide 10 described above. The wiring device 100 also includes a capillary 21 that pays out the wire 11 or covered wire, and the capillary 21 is held by an ultrasonic horn 22. The wiring device 100 also includes a wire guide movement mechanism 30 (see FIGS. 2 and 3) that moves the wire guide 12 in a direction 61 that brings the first to third suction ports 13a to 13c toward and a direction 62 that moves the first to third suction ports 13a to 13c away from the wire 11 or covered wire paid out from the capillary 21 (see FIGS. 4A and 5B). The wiring device 100 also includes an elevation mechanism (Z-axis movement mechanism) 40 that raises and lowers the capillary 21 and the wire guide 12 held by the ultrasonic horn 22.

[0025] 1 , the wiring device 100 has an XY stage 26 on which the substrate 16 is placed. It also has an X-axis movement mechanism 29 that moves the XY stage 26 in an X direction 27. The wiring device 100 also has a Y-axis movement mechanism 33 that moves the XY stage 26 in a Y direction 28.

[0026] As shown in Fig. 2, the wiring device 100 has a control unit 50. This control unit 50 controls the on / off of the vacuum exhaust mechanism 15 shown in Fig. 1, the capillary 21, the ultrasonic horn 22, the wire guide moving mechanism 30 shown in Fig. 2, the Z-axis moving mechanism 40, the X-axis moving mechanism 29 and the Y-axis moving mechanism 33 shown in Fig. 1.

[0027] 1 and 3, the wire guide movement mechanism 30 is a mechanism that moves the wire guide 12 within a plane 70 where a plane parallel to the longitudinal direction of the wire 11 or covered wire vacuum-sucked by the first to third suction ports 13a to 13c overlaps with a plane parallel to the longitudinal direction of the ultrasonic horn 22 (see FIGS. 5(A) and 5(B)). In other words, the wire guide movement mechanism 30 is a mechanism that moves the wire guide 12 within the plane 70 that includes the axis of the wire 11 or covered wire vacuum-sucked by the first to third suction ports 13a to 13c and the axis of the ultrasonic horn 22.

[0028] 2 and 3, the Z-axis movement mechanism 40 has a slide member 41 that can move up and down. The wire guide movement mechanism 30 is attached to this slide member 41.

[0029] More specifically, the wire guide moving mechanism 30 has a rotation mechanism 32, which may be, for example, a motor or a rotary actuator. The rotation mechanism 32 rotates a rotation shaft 31, which is attached to the wire guide 12. The ultrasonic horn 22 and the rotation mechanism 32 are attached to a slide member 41 via a connecting member 42. As a result, by raising and lowering the slide member 41 as shown by arrow 43, it is possible to raise and lower the ultrasonic horn 22 to which the capillary 21 is attached and the wire guide 12. The slide member 41 and the connecting member 42 may be integrally formed.

[0030] The control unit 50 shown in Figure 2 above may control the wire 11 or coated wire unwound from the capillary 21 to be vacuum-sucked into the first to third suction ports 13a to 13c of the wire guide 12, and the capillary 21 and the wire guide 12 to be lowered by the Z-axis movement mechanism 40, thereby inserting the wire 11 or coated wire into the hole 17.

[0031] In addition, after the wire 11 or coated wire is inserted into the hole 17, the control unit 50 may control the wire 11 or coated wire to be released from the vacuum suction ports 13a to 13c, the Z-axis movement mechanism 40 to raise the capillary 21 and the wire guide 12, and the wire guide movement mechanism 30 to move the wire guide 12 in a direction 62 that moves the wire 11 or coated wire away from the first to third suction ports 13a to 13c.

[0032] <Wiring Method of Wire 11 or Covered Wire> FIGS. 4A to 4D and 5A to 5D are cross-sectional views for explaining a wiring method of the wire 11 or covered wire.

[0033] First, as shown in FIG. 4A, the wire guide 12 is moved as indicated by the arrow 61 to move the first to third suction ports 13a to 13c of the wire guide 12 to positions where the wire 11 or the coated wire is fixed.

[0034] Next, as shown in FIG. 4(B), the wire 11 or the coated wire is unwound from the capillary 21, and then the vacuum exhaust mechanism 15 shown in FIG. 1 connected to the exhaust path 14 of the wire guide 12 is turned on, thereby vacuum-absorbing and fixing the wire 11 or the coated wire to the first to third suction ports 13a to 13c.

[0035] Next, as shown in FIG. 4(C), with the wire 11 or coated wire fixed to the wire guide 12, the wire guide 12, the capillary 21, and the ultrasonic horn 22 are lowered by the Z-axis movement mechanism 40 shown in FIGS. 2 and 3, so that the tip of the wire 11 or coated wire is inserted into the hole 17 in the substrate 16, and the wire or coated wire is pulled under the substrate 16.

[0036] Next, as shown in FIG. 4(D), the vacuum exhaust mechanism 15 shown in FIG. 1 connected to the exhaust path 14 is turned off, thereby releasing the vacuum suction of the wire 11 or the coated wire from the first to third suction ports 13a to 13c of the wire guide 12, and the wire guide 12 is temporarily retracted.

[0037] Next, as shown in FIG. 5A, while the wire 11 or coated wire is being unwound from the capillary 21, the wire guide 12, the capillary 21, and the ultrasonic horn 22 are raised in the direction of the arrow 25 by the Z-axis movement mechanism 40 shown in FIGS.

[0038] 5(B), the wire guide 12 is moved in a direction 62 that moves the first to third suction ports 13a to 13c away from the wire 11 or the coated wire, thereby retracting the wire guide 12. More specifically, the rotation mechanism 32 of the wire guide movement mechanism 30 shown in FIGS. 2 and 3 rotates the rotation shaft 31, thereby retracting the wire guide 12.

[0039] Next, as shown in FIG. 5C , the substrate 16 is moved in the X direction 27. Specifically, the XY stage 26 on which the substrate 16 is placed is moved in the X direction 27 by the X-axis movement mechanism 29 shown in FIG. 1 , thereby moving the substrate 16 in the X direction 27. At this time, since the wire guide 12 has been retracted in the step shown in FIG. 5B , the wire guide 12 does not interfere with the substrate base 18. Thereafter, the wire guide 12, capillary 21, and ultrasonic horn 22 are lowered as shown by arrow 36, and the wire 11 or covered wire is laid at the tip of the capillary 21 to a connection point 19 provided on the substrate base 18. Note that if the connection point 19 is, for example, an electrode 37 shown in FIG. 6 , the wire 11 or covered wire may be bonded to the electrode 37.

[0040] Next, as shown in FIG. 5D, the wire 11 or coated wire is cut, and the wire guide 12, capillary 21, and ultrasonic horn 22 are raised in the direction of arrow 38 by the Z-axis movement mechanism 40 shown in FIGS.

[0041] The operations of the wiring device shown in FIGS. 4A to 5D are controlled by the control unit 50 shown in FIG.

[0042] Furthermore, by repeating the steps shown in FIGS. 4A to 5D, wires 11 or coated wires can be wired between each of the multiple rows of holes 17 in the substrate 16 shown in FIGS. 6, 7, and 8 and each of the multiple connection points 19 provided on the substrate base 18 located on the substrate 16 a predetermined distance from the multiple holes 17. In the embodiment shown in FIG. 5D, the connection points 19 are provided directly on the substrate base 18, but this is not limited thereto and the connection points 19 may be as shown in FIGS. 6 to 8. That is, the connection points 19 may be connection points on a substrate 39 located on the substrate base 18. These connection points may be electrodes. FIG. 8A is a top view showing the substrate 16, substrate base 18, and substrate 39 excluding the wiring device shown in FIGS. 6 and 7, and FIG. 8B is a cross-sectional view of FIG. 8A.

[0043] According to this embodiment, the wire 11 or covered wire unwound from the capillary 21 is fixed by vacuum suction using the wire guide 12, and the capillary 21 is then lowered to insert the wire 11 or covered wire into the hole 17 in the substrate 16 while the wire guide 12 guides the wire 11 or covered wire. This prevents the wire 11 or covered wire from being bent when inserted into the hole 17, and also prevents the tip of the wire 11 or covered wire from shaking during insertion, causing the wire 11 or covered wire to fail to enter the hole 17. This makes it possible to insert the wire 11 or covered wire into the hole 17 in the substrate 16 with high accuracy and stability.

[0044] DESCRIPTION OF SYMBOLS 10... Vacuum suction wire guide 11... Wire 12... Wire guide 12a... Groove 12b... Inner surface 13a... First suction port 13b... Second suction port 13c... Third suction port 14... Exhaust path 15... Vacuum exhaust mechanism 16... Substrate 17... Hole 18... Substrate base 19... Connection point 21... Capillary 22... Ultrasonic horn 26... XY stage 27... X direction 28... Y direction 29... X-axis movement mechanism 30... Wire guide movement mechanism 31... Rotation axis 32... Rotation mechanism (motor) 33... Y-axis movement mechanism 40... Lifting mechanism (Z-axis movement mechanism) 41... Slide member 42... Connection member 50... Control unit 100... Wiring device

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