Flexible printed circuit board
Patent Information
- Application Number
- TH2401001141
- Authority / Receiving Office
- TH · TH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-02-22
- Publication Date
- 2026-09-07
Smart Images
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Abstract
Claims
OCR1. A flexible printed circuit board composed of at least a substrate layer, an adhesive layer, a nickel-containing layer, and a conductor in such a sequence, where the adhesive layer includes fluorinated rubber, and the mass per unit area of nickel in the nickel-containing layer is 100 mg / m² or more.
2. A flexible printed circuit board according to Reputation 1, where the substrate layer includes polyemide.
3. A flexible printed circuit board according to Reputation 1 or 2, where the mass per unit area of nickel in the nickel-containing layer is 125 mg / m² or more and 500 mg / m² or less.
4. Flexible printed circuit boards according to claim 1 or 2, where the conductor includes copper.
5. Methods for the manufacture of flexible printed circuit boards, methods that include: the lamination process of obtaining a laminate that includes at least a substrate layer, an adhesive layer, a nickel-containing layer, and a conductive layer in this sequence; and the circuit patterning process of passing the lamination process to form a circuit pattern, where the adhesive layer includes fluorinated rubber, and the mass per unit area of nickel in the nickel-containing layer is 100 mg / m² or more.6.The method for manufacturing bendable printed circuit boards according to claim 5, whereby the lamination process includes the bonding steps, with adhesive, substrate layer and laminate layer including nickel-containing layer and conductive layer;