The structure of a circuit board and how it's manufactured.
Patent Information
- Authority / Receiving Office
- TH · TH
- Patent Type
- Applications
- Current Assignee / Owner
- ยูนิไมครอน เทคโนโลยี คอร์ป
- Filing Date
- 2024-12-09
- Publication Date
- 2026-07-20
Smart Images
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Abstract
Claims
OCR09WP24 / 02 / 25681. A printed circuit board structure consisting of a base layer, a first circuit layer laid on the base layer, a substrate layer laid on the base layer and situated on one side of the first circuit layer, a deposition layer laid on the first circuit layer and the substrate layer, and a second circuit layer laid on the deposition layer.
2. A printed circuit board structure as proposed in claim 1 where the base layer comprises areas one and two, and the ratio of the area of the first circuit layer situated on area one to the total area of area one is less than the ratio of the area of the first circuit layer situated on area two to the total area of area two, with the substrate layer situated in at least area one.
3. A printed circuit board structure as proposed in claim 2 where the ratio of the area of the first circuit layer situated on area one to the total area of area one is less than 50%.
4. A printed circuit board structure as proposed in claim 1 where the top surface of the first circuit layer and the top surface of the substrate layer share a common plane.5.The printed circuit board structure as claimed in Reputation 1 where the top surface of the deposition layer resting on the substrate layer and the top surface of the deposition layer resting on the first circuit layer share a common plane.
6. The printed circuit board structure as claimed in Reputation 1 where the substrate layer material consists of epoxy, silicon dioxide, bisphenol F, epichlorohydrin, copolymer of such, or a combination of such.
7. The printed circuit board structure as claimed in Reputation 1 where the substrate layer material is the same as the substrate layer material.
8. A printed circuit board structure as proposed in claim 1 where the thickness of the substrate layer is between 0.01 mm and 0.12 mm.
9. A printed circuit board structure as proposed in claim 1 where the substrate layer does not come into direct contact with the primary circuit layer.
10. A printed circuit board structure as proposed in claim 9 where the shortest distance between the substrate layer and the primary circuit layer is greater than 0.03 mm.
11. A printed circuit board structure as proposed in claim 9 where the substrate layer is located between the substrate layer and the primary circuit layer. 12.
11. The fabrication method of the printed circuit board structure as proposed in claim 11, where the base layer and deposition layer completely surround the first circuit layer.
13. The fabrication method of the printed circuit board structure which includes the arrangement of the base layer, the placement of the first circuit layer on the base layer, the placement of the deposition layer on the base layer where the deposition layer is situated on one side of the first circuit layer, the placement of the deposition layer on the first circuit layer and the deposition layer, and the placement of the second circuit layer on the deposition layer.
14. The fabrication method of the printed circuit board structure as proposed in claim 13, where the deposition layer formation process includes the lamination of the deposition layer onto the base layer and the pre-heating and curing processes to form the deposition layer.
15. The fabrication method of the printed circuit board structure as proposed in claim 14, where the deposition does not come into direct contact with the first circuit layer.
16. The fabrication method of the printed circuit board structure as proposed in claim 15, where the shortest distance between the deposition and the first circuit layer is greater than 0.03 mm. 17.
18. The method of fabricating the printed circuit board structure as proposed in claim 17 where the ratio of the area of the first circuit layer located on the first to the total area of the first region is less than 50%.
19. The method of fabricating the printed circuit board structure as proposed in claim 13 where the top surface of the deposition layer located on the deposition layer and the top surface of the deposition layer located on the first circuit layer share a common plane.
20. The method of fabricating the printed circuit board structure as proposed in claim 13 where the deposition layer material consists of epoxy, silicon dioxide, bisphenol F, epichlorohydrin, copolymer of such, or a combination of such;