Circuit board structure

Claims

OCR06WT1. Integrated circuit board structure: A substrate with a primary and secondary surfaces opposite to the primary surface; a primary coaxial conduction path and a secondary coaxial conduction path arranged in the substrate where the impedance of the primary coaxial conduction path and the impedance of the secondary coaxial conduction path are less than 50 ohms, respectively; and a number of ground paths forked around the primary coaxial conduction path and the secondary coaxial conduction path, where the primary coaxial conduction path and the secondary coaxial conduction path are configured to transfer signals with frequencies in the range between 50GHz and 68GHz.

2. Circuit board structure according to claim 1 where the substrate incorporates a core structure; and a built-in structure arranged on the core structure where the built-in structure is in close proximity to the primary surface of the substrate relative to the core structure.3.The circuit board structure under Claim 2 where the first coaxial conducting path and the second coaxial conducting path each comprise: the first conducting path that penetrates the core structure; the second conducting path that penetrates the core structure and the constructed structure where the first conducting path forks around the second conducting path and the first and second conducting paths have the same core center; and the insulating fill structure is positioned between the first and second conducting paths.

4. The circuit board structure under Claim 3 where the ratio of the inner diameter of the first conducting path to the outer diameter of the second conducting path is less than 4.

5. The circuit board structure under Claim 3 where the first conducting path is electrically connected to the ground path.

6. The circuit board structure under Claim 2 where the ground path penetrates the constructed structure and the core structure. 7.

8. A circuit board structure under claim 1 in which the distance between the axis center of the first coaxial conducting path and the axis center of the second coaxial conducting path is less than 1.3 mm.

9. A circuit board structure under claim 3 in which the upper circuit layer first is incorporated: a padding layer placed on the constructed structure and electrically connected to the second electrically connected path of the first coaxial conducting path.

10. A circuit board structure under claim 8 in which the upper circuit layer first is incorporated: a padding layer placed on the second electrically connected path of the first coaxial conducting path; a first circuit layer placed on the constructed structure; and a second circuit layer placed on the constructed structure and connected between the padding layer and the first circuit layer in which the width of the second circuit layer is less than the width of the first circuit layer.The circuit board structure according to claim 1 where the shortest distance between the center of the ground path and the axis center of the first coaxial conducting path is distance one; the shortest distance between the center of the ground path and the axis center of the second coaxial conducting path is distance two; the sum of distances one and two is greater than the distance between the axis center of the first coaxial conducting path and the axis center of the second coaxial conducting path;

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