Resin components, items made from it, and uses for it.
Patent Information
- Application Number
- TH2501004852
- Authority / Receiving Office
- TH · TH
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-07-22
- Publication Date
- 2026-09-07
Claims
OCR07AP1. Resin composition, characterized as consisting of the following components: 100 parts by weight of thermosetting resin and 100 to 300 parts by weight of inorganic filler; the resin composition has a percentage of volatile organic compounds as measured in reference to IPC-TM-6502.4.24.6 of less than or equal to 2.0%; the resin composition has a shear viscosity change rate as measured in reference to GB / T2794-20227.3 of 9 to 56%; and the cured resin product is obtained by curing the resin composition. The loss factor at a frequency of 10 GHz, as measured in reference to JISC2565, is less than or equal to 0.00802. The resin composition, as specified in claim 1, is characterized as follows: the percentage of volatile organic compounds, as measured in reference to IPC-TM-6502.4.24.6, is less than or equal to 0.5%, and the cured resin product obtained by knotting the resin composition has a loss factor at a frequency of 10 GHz, as measured in reference to JISC2565, of less than or equal to 0.00413.The resin composition under claim 1, which is characterized that, on the basis of total inorganic filler weight being 100% by weight, the inorganic filler comprises 50 to 100% by weight of silica.
4. The resin composition under claim 1, which is characterized that, on the basis of total inorganic filler weight being 100% by weight, the inorganic filler comprises 2 to 17% by weight of porous surface silica.
5. The resin composition under claim 4, which is characterized that the specific surface area of the porous surface silica...
6. The resin composition according to claim 4, which is characterized that the specific surface area of the porous silica is 103 to 200 m² / g.
7. The resin composition according to claim 1, which is characterized that the thermosetting resin is composed of any one of the following types of polyolefins, acrylate ester compounds, maleimide resins, organic silicone resins, polyphenylene ether resins, benzoxazine resins, epoxy resins, active esters, phenolic resins, and cyanate ester resins, or a combination of these. 8.
9. The resin composition under claim 1, which is characterized as a thermosetting resin composed of (A) polyolefin modified with maleic anhydride and (B) (meth) multifunctional acrylate monomer and / or its oligomers; and inorganic filler composed of (C) porous substrate silica and (D) non-porous silica.
10. The composition 11. Resin composition according to claim 9, which is characterized that the weight ratio of (A) polyolefin modified with maleic anhydride:(B)(meth)acrylate multifunctional monomer and / or its oligomer:(C) porous substrate silica:(D) non-porous silica is 100:(30 to 90):(10 to 30):(150 to 350). 12.
13. Items made of resin components under claim 1, which are specified as incorporating at least one type of flame retardant, curing accelerator, polymerization inhibitor, coloring agent, surfactant, and toughening agent, or a combination of these.
14. Items made of resin components under claim 1, which are specified as incorporating prepreg, resin film, laminate, or printed circuit board.
15. Items made of resin components under claim 1, which are specified as incorporating a resin-cured product obtained by curing the resin components.
16. Printed circuit boards manufactured using resin components under claim 1 in the printed circuit board resin filling process, which are specified as incorporating one or more of the following properties: the solder floating crackrate in the area of the printed circuit board resin-cured product as measured by reference to IPC-TM-6502.4.13.
15. The impedance amplitude in the resin-cured product area of the printed circuit board, as measured by the network analyzer, is less than or equal to 10%; and the continuous varnish scraping time is greater than or equal to 15 minutes during the printed circuit board resin filling process.
16. The use of resin components as specified in claim 1 is applied in the printed circuit board resin filling process.
17. The use as specified in claim 16, as defined, is that the printed circuit board resin filling process includes one or more processes of printed circuit board filling, printed circuit board groove filling, or printed circuit board circuit filling. 18.The use under claim 17, which is specified as follows: in the PCB filling process, at least one PCB hole is filled with the cured resin product of the resin component; and / or in the PCB groove filling process, at least one PCB groove is filled with the cured resin product of the resin component; and / or in the PCB circuit filling process, at least one open area of the PCB circuit is covered with the cured resin product of the resin component;