Systems and methods for printing adhesive onto the components of the hard disk drive head-write arm assembly.

Abstract

Invention details A name that reflects an invention. Please specify the name that represents the invention. Branches of science related to invention. Please specify the field of science related to invention. The nature and purpose of the invention. Please specify the characteristics and purpose of the invention. Background in the relevant art or science. Please specify your background in the relevant art or science. Brief description of the painting. Please provide a brief description of the painting. Full disclosure of the invention. Please provide a complete disclosure of the invention. The best way to invent Please specify the best method for invention.

Claims

OCR09WP03 / 08 / 25691. A system for printing conductive and non-conductive adhesives onto one or more suspension components, comprising: a base machine configured to accept at least one suspension component; a printing device including at least one opening, at least one opening configured to be positioned above a location on the suspension component where the adhesive is deposited; an applicator configured to move in a shear direction around the printing device and deposit the adhesive into at least one opening.

2. A system of claim 1, where the base machine is configured to accept more than one panel of suspension components, where each suspension component includes at least one location where the adhesive is deposited.

3. A system of claim 1, where the printing device includes one or more screens or stencils.

4. A system of claim 1, where the adhesives include conductive adhesives.5.

6. System of Patent 1, where the adhesive material includes non-conductive adhesives.

7. System of Patent 1, where the adhesive material is a viscous fluid.

8. System of Patent 1, which includes an additional heat source configured to cure the adhesive deposited into at least one opening.

9. System of Patent 1, which includes an additional UV light source configured to cure the adhesive deposited into at least one opening.

10. System of Patent 1, where at least one opening is sized to accommodate the required volume of adhesive.

11. System of Patent 9, where at least one opening has a diameter ranging from approximately 0.5 mm to 5.0 mm.

12. System of Patent 9, where at least one opening has a diameter ranging from approximately 2.5 mm to 3.0 mm.

13. System of Patent 1, where the adhesive is deposited on the read / write arm component at a location that exerts a structural effect on the read / write arm component.The system of claim 12, in which adhesive deposited on the read / write arm component increases the torsional rigidity of the read / write arm component.

14. The method of depositing adhesive onto the read / write arm component, which includes the following steps: loading one or more read / write arm components onto the base; placing a screen or stencil over one or more read / write arm components, the screen or stencil containing one or more openings formed in it; applying adhesive to the screen or stencil at position one; positioning the sweeper at position one with the adhesive; and moving the sweeper across the screen or stencil to deposit adhesive into one or more openings.

15. The method of claim 14, which includes the following additional steps: partial curing of the adhesive deposited into at least one opening.16.Method of Claim 14, where the packing procedure includes an additional panel which comprises more than one read / write head arm component, and each read / write head arm component in the panel includes at least one position where the adhesive material is deposited.

17. Method of Claim 14, where the first position is the far position, and the sweeper moves across the screen or stencil in the near direction.

18. Method of Claim 14, where the adhesive material includes conductive adhesive.

19. Method of Claim 24 14. The system of claim 14, where the adhesive material includes non-conductive adhesives.

20. The system of claim 14, where the adhesive material is a viscous fluid.

21. The method of claim 14, where one or more openings are sized to accommodate the required volume of adhesive.

22. The system of claim 21, where one or more openings have a diameter ranging from approximately 0.5 mm to 5.0 mm.

23. The method of claim 21, where one or more openings have a diameter ranging from approximately 2.5 mm to 3.0 mm. 24.Method of claim 14, where adhesive deposits are deposited on the read / write head arm component at a location that exerts a structural effect on the read / write head arm component.

25. Method of claim 24, where adhesive deposits on the read / write head arm component increase the torsional rigidity of the read / write head arm component.

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