Devices for predicting the absence of machining chips, control devices, and methods for predicting the absence of machining chips.

Abstract

Invention details;

Description

Chip breakability prediction device, control device, and chip breakability prediction method

[0001] The present invention relates to a chip breakability prediction device, a control device, and a chip breakability prediction method.

[0002] Generally, the optimum chip breaker range listed in the tool manufacturer's catalog can be used as a reference for determining whether chips can be broken. However, the optimum range varies greatly depending on the material, and the optimum range often does not match. For this reason, it is common to conduct many experiments by changing the conditions and tools to narrow down the optimum conditions.

[0003] Furthermore, at the research level, there have been efforts to predict whether chips will break using FEM analysis software, as in the following Non-Patent Document 1. This Non-Patent Document 1 states that by analyzing the chip breakage process using a thermo-elastic-plastic finite element method, it was confirmed that the results were consistent with experimental results. However, FEM analysis requires a long analysis time per condition, and is therefore not suitable for predicting whether chips will break for many tools or under a wide range of conditions.

[0004] Furthermore, efforts have been made to theoretically grasp chip breakage (see, for example, Non-Patent Document 2 below). As disclosed in Non-Patent Document 2, the conditions under which chips break can be obtained by using the chip breakage strain determined by the chip material and the tensile strain generated in the chip, which is determined from the chip thickness and the initial curl radius of the chip.

[0005] Non-Patent Document 1 presents a theoretical consideration using a thermo-elastic-plastic finite element method, and Non-Patent Document 2 presents a theoretical understanding of chip breakage. However, these non-patent documents only present general theoretical considerations. Therefore, when setting cutting conditions for specific workpiece materials in the field where cutting work is performed, these theoretical considerations cannot necessarily be used as they are.

[0006] Thermal elastic-plastic finite element simulation of chip breaking process by chip breaker, Shinozuka et al., Journal of the Japan Society of Precision Engineering, Vol. 62, No. 8, pp. 1161-1166, 1996. Research on chip breakers, Nakayama Kazuo, Transactions of the Japan Society of Mechanical Engineers (Part 3), Vol. 27, No. 178, pp. 833-843, June 1961.

[0007] An object of the present invention is to make it possible to easily determine the conditions for cutting when performing cutting.

[0008] A chip breakability prediction device according to one aspect of the present invention comprises a storage unit in which information relating to workpieces and tools used in cutting processing is stored; a reception unit configured to receive information relating to a workpiece to be cut and a tool to be used selected from the workpieces and tools indicated in the information stored in the storage unit, and to receive information indicating a feed rate and depth of cut in the cutting processing; a calculation unit configured to derive information for predicting whether chips can be broken using the information received by the reception unit; and a display unit configured to display the information derived by the calculation unit for predicting whether the chips can be broken.

[0009] A control device according to one aspect of the present invention is provided in a prediction system for predicting the breakability of chips in cutting processing, and is connected to an input / output device so as to be able to communicate with the device. The control device comprises: a storage unit in which information regarding the workpiece and tools to be used in cutting processing is stored; a reception unit configured to receive from the input / output device information regarding the workpiece and tools to be used that are selected by the input / output device from the workpiece and tools indicated in the information stored in the storage unit, and to receive from the input / output device information indicating the feed rate and depth of cut in the cutting processing; a calculation unit configured to derive information for predicting whether or not the chips will be breakable using the information received by the reception unit; and a communication unit configured to communicate with the input / output device so that the information for predicting whether or not the chips will be breakable, derived by the calculation unit, is displayed on a display unit of the input / output device.

[0010] A method for predicting chip breakability according to one aspect of the present invention receives, by a receiving unit, information regarding the workpiece to be cut and the tool to be used, selected from the workpieces and tools in the cutting process indicated in the information stored in a storage unit, and also receives, by the receiving unit, information indicating the feed rate and depth of cut in the cutting process; using the information received by the receiving unit, a calculation unit derives information for predicting whether or not chips will be breakable; and displays, on a display unit, the information derived by the calculation unit.

[0011] A method for predicting chip breakability according to one aspect of the present invention receives, from an input / output device, information relating to a workpiece to be cut and a tool to be used, selected from the workpieces and tools in the cutting process indicated in the information stored in a storage unit, and also receives information indicating the feed rate and depth of cut in the cutting process from the input / output device; a calculation unit derives information for predicting whether chips will be breakable for the workpiece, tool, feed rate, and depth of cut indicated in the received information; and a communication unit communicates with the input / output device so that the information derived by the calculation unit is displayed on a display unit of the input / output device.

[0012] FIG. 1 is a diagram schematically illustrating a chip breakability prediction device according to a first embodiment; FIG. 2 is a diagram illustrating an example of a display screen provided on a display unit of an input / output unit included in the chip breakability prediction device; FIG. 3 is a diagram illustrating a chamfer width b; FIG. 4 is a diagram illustrating a chip thickness h; FIG. 5 is a diagram illustrating a chip flow direction θd; FIG. 6 is a diagram illustrating a chip thickness t when the cutting depth d is greater than the nose radius R; FIG. 7 is a diagram illustrating a chip thickness t when a obtained by equation (6) is negative; and FIG. 8 is a diagram illustrating a chip thickness t when equation (8) is used. ０ ) is a diagram for explaining a method for calculating the rake face and the breaker slope. FIG. 2 is a diagram for explaining a parallel type insert. FIG. 3 is a diagram for explaining a clamp type insert. FIG. 4 is a diagram for explaining a method for calculating the chip breaking strain ε ｃ4 is a diagram for explaining a method for determining chip breakability. FIG. 5 is a diagram for explaining a case where chip thickness h is larger than the distance L from the cutting edge to the apex of the breaker. FIG. 6 is a diagram for explaining a method for predicting chip breakability. FIG. 7 is a diagram for explaining a method for predicting chip breakability. FIG. 8 is a diagram for explaining a method for predicting chip breakability. FIG. 9 is a diagram for explaining a method for predicting chip breakability. FIG. 10 is a diagram for explaining a method for predicting chip breakability. FIG. 11 is a diagram for explaining a method for predicting chip breakability. FIG. 12 is a diagram for explaining a method for predicting chip breakability. FIG. 13 is a diagram for explaining a method for predicting chip breakability. FIG. 14 is a diagram for explaining a method for predicting chip breakability.

[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0014] 1, a chip breakability prediction device 10 according to a first embodiment includes a control unit 12 for performing arithmetic processing, a storage unit 14 for storing processing programs, data, and the like, and an input / output unit 16 used for inputting and outputting information. The control unit 12 has a central processing unit (CPU) and is configured to execute various calculations using this CPU. When performing the calculations, the control unit 12 appropriately uses information input from the input / output unit 16 and information stored in the storage unit 14.

[0015] The storage unit 14 stores information about the workpiece used in cutting (workpiece information 14a) and information about the tool (tool information 14b). The workpiece information 14a includes information about the name of the workpiece, the fracture strain value, the shear angle, etc. The tool information 14b includes information about the name of the holder, the name of the tip, data representing the cross-sectional shape of the tip in a predetermined direction, etc.

[0016] The storage unit 14 may also temporarily store information input through the input / output unit 16 and data and information used in calculations by the calculation unit 12b, which will be described later.

[0017] The input / output unit 16 has a display unit 16a configured to display cutting conditions and calculation results. As shown in Fig. 2, a display screen 20 of the display unit 16a includes an input area 21 and a result output area 22. Information is input into the input area 21 in response to operations on the input unit 16b, such as a keyboard. The input unit 16b may be configured integrally with the display unit 16a.

[0018] The input area 21 includes a workpiece material field 21a, a holder shape field 21b, a tip shape field 21c, a cutting condition field 21d, and a coolant condition field 21e. In the workpiece material field 21a, various workpiece materials are displayed in a pull-down format. The workpiece material to be cut can be selected from this list. The workpiece materials listed in the workpiece material field 21a are obtained from information related to workpiece materials stored in the storage unit 14. Information indicating the workpiece material selected via the input / output unit 16 is input to the reception unit 12a, which will be described later.

[0019] In the holder shape field 21b, various holders are displayed in a pull-down list. The holder to be used can be selected from this list. The side cutting edge angle and cutting edge inclination angle can also be manually input. Information indicating the side cutting edge angle and cutting edge inclination angle is input to the reception unit 12a, which will be described later.

[0020] In the tip shape field 21c, various tips are displayed in a pull-down format. The tip to be used can be selected from this list. The tips listed in the tip shape field 21c are obtained from information indicating the tool stored in the storage unit 14. It is also possible to specify the tip tip radius and tip angle. Information indicating the tip selected in this field 21c and information indicating the tip tip radius and tip angle of the tip specified in this field 21c are input to the reception unit 12a, which will be described later.

[0021] The cutting conditions field 21d includes an input box 21d1 in which the cutting speed, feed rate, and depth of cut can be input, and an adjustment field 21d2 located adjacent to it. The feed rate is the feed rate per rotation, and the depth of cut is the depth of cut in the radial direction.

[0022] Numerical values ​​for the cutting speed, feed rate, and depth of cut are input into input box 21d1. However, for the feed rate and depth of cut, the values ​​input into input box 21d1 can be fine-tuned by moving the sliders displayed in adjustment field 21d2. Note that the cutting speed is not used in calculating the tensile strain generated in the chips, which will be described later. Therefore, the cutting speed input box 21d1 can be omitted. Information regarding the feed rate and depth of cut input into this field 21d is input into the receiving unit 12a, which will be described later.

[0023] In the coolant condition field 21e, whether or not coolant is used is input. Note that this input information does not need to be used to predict chip breakage. Therefore, the coolant condition field 21e can be omitted.

[0024] The result output area 22 includes a contour map field 22a, a separation possibility field 22b, a separation prediction value field 22c, a fracture boundary field 22d, and a tool candidate field 22e. The contour map displayed as an image in the contour map field 22a is a contour map shown in a coordinate system with cutting conditions as its coordinate axes. In the contour map, the distribution of tensile strain occurring in the chip is represented by contour lines, and the fracture boundary 22f of the chip is also shown.

[0025] 2, the horizontal axis represents the feed rate and the vertical axis represents the cutting depth. Alternatively, the horizontal axis may represent the cutting depth and the vertical axis may represent the feed rate.

[0026] In the contour map, the ranges of the feed rate and the depth of cut indicated by the information input in the input area 21 and received by the receiving unit 12a (described later) are set so that they are located at the center of the contour map. The displayed ranges of the feed rate and the depth of cut are determined so as to include at least the range in which the actual adjustment is predicted to occur, and not to display a range that is too large compared to that range. Therefore, the contour map makes it easy to determine the amount of adjustment when adjusting the feed rate or the depth of cut. These display controls are performed by a display control function included in the control unit 12, and the control unit 12 provides control information obtained by the display control function to the input / output unit 16 via the communication unit 12c.

[0027] The contour map displays marks (in FIG. 2, "+" marks) indicating the feed rate and the cutting depth input in the input area 21 and accepted by the accepting unit 12a, which will be described later, and also displays a fracture boundary 22f by a broken line. The fracture boundary 22f indicates the fracture strain ε ｃ The contour map also shows the condition under which the ratio of tensile strain to fracture strain is satisfied. The contour map also shows the contour lines of the ratio of tensile strain to fracture strain. The distribution of tensile strain is displayed so that the magnitude of the ratio is divided into predetermined values ​​by one or more methods selected from color, hue shading, and brightness. Note that a difference value may be used instead of the ratio.

[0028] The breakability column 22b displays a mark indicating whether the chip is predicted to break, whether it is predicted not to break, or an intermediate value based on information derived by the calculation unit 12b (described later). This allows the user to visually grasp whether the chip will break.

[0029] The fracture prediction value field 22c displays the value of the tensile strain ε in the case of the feed rate and the cutting depth input in the input area 21 and received by the receiving unit 12a described later, and the fracture boundary field 22d displays the fracture strain ε ｃ The value is displayed as a number.

[0030] The tool candidate column 22e displays a list of tools that are predicted to break chips based on information derived by the calculation unit 12b, which will be described later. That is, for the workpiece selected in the input area 21, the calculation unit 12b calculates whether or not all tools included in the information stored in the storage unit 14 will break chips. Therefore, all tools are displayed in the tool candidate column 22e so that tools predicted to have a high chip breakability are placed at the top through this calculation. That is, the chip breakability of each tool is displayed in a list. These display controls are also performed by a display control function included in the control unit 12, and the control unit 12 provides control information obtained by the display control function to the input / output unit 16 via the communication unit 12c.

[0031] As shown in FIG. 1 , the functions executed by the control unit 12 include a receiving unit 12a, a calculation unit 12b, and a communication unit 12c. The receiving unit 12a receives information about factors that affect whether chips break, such as cutting conditions. Specifically, information about the workpiece and tool selected in the input area 21 of the input / output unit 16 is input to the receiving unit 12a from the input / output unit 16. Information indicating the feed rate and depth of cut input in the input area 21 of the input / output unit 16 is also input to the receiving unit 12a from the input / output unit 16. That is, the receiving unit 12a receives information about the workpiece to be cut and the tool to be used, selected from the tools indicated in the workpiece and tool information 14b included in the workpiece information 14a stored in the storage unit 14, and also receives information indicating the feed rate and depth of cut input to the input / output unit 16.

[0032] The calculation unit 12b uses the information received by the reception unit 12a to derive information for predicting whether or not the chips can be broken.

[0033] The communication unit 12c communicates with the input / output unit 16 so that information for predicting whether or not the chip can be broken, which is derived by the calculation unit 12b, is displayed in a result output area 22 on a display screen 20 of a display unit 16a included in the input / output unit 16. The information for predicting whether or not the chip can be broken includes information displayed in a contour map column 22a, a mark displayed in a breakability column 22b, a tensile strain value displayed in a break prediction value column 22c, and a fracture strain value displayed in a fracture boundary column 22d.

[0034] Here, the derivation of information for predicting whether or not the chip can be broken and the prediction and determination of whether or not the chip can be broken, which are performed by the calculation unit 12b, will be described in detail.

[0035] Whether or not the chip 30 (FIG. 3) can be broken depends on the tensile strain ε generated in the chip 30 during cutting and the fracture strain ε of the material used in cutting. ｃ The tensile strain ε is compared with the breaking strain ε ｃ It can be predicted by how much larger it is than the

[0036] The tensile strain ε generated in the chip 30 is calculated by the following formula (1): where h is the chip thickness and r ０ is the initial curl radius of the chip. In other words, the tensile strain ε is the initial curl radius r of the chip 30. ０ and the chip thickness h.

[0037]

[0038] The tensile strain ε may be replaced by a corrected tensile strain ε' corrected by the following equations (2) and (3). Here, t is the chip thickness, and b is the chamfer width or cutting edge radius. That is, the tensile strain ε may be corrected to the corrected tensile strain ε' by a relational expression that indicates the ratio of the chip thickness t to the chamfer width or cutting edge radius b. However, since the upper limit of A is 1, if the chip thickness t is larger than the chamfer width or cutting edge radius b, A=1.

[0039]

[0040] Although the square of A is used in equation (2), the first power or the third power of A may be used instead. The chamfer width b is the width of the chamfered flat surface at the edge of the cutting edge, as shown in Figure 3. The cutting edge radius b is the radius of the roundness at the edge of the cutting edge.

[0041] The chip thickness h is determined by the geometric relationship shown in Figure 4, and is calculated by the following formula (4): where t is the chip thickness, Φ is the shear angle, and α is the rake angle.

[0042]

[0043] The chip thickness t can be geometrically calculated from the cutting conditions and the tool attitude. First, as shown in FIG. 6, when the cutting depth d is greater than the nose radius R (see FIG. 5), the chip thickness t can be calculated using Equation (5) with the feed rate f and the side cutting edge angle θ. Furthermore, when the value of a calculated using Equation (6) with the cutting depth d and the nose radius R is negative, the chip thickness t is the same as the cutting depth d, and therefore Equation (7) is used. Note that when the value of a calculated using Equation (6) is negative, this corresponds to the case shown in FIG. 7. In other cases, that is, when the cutting depth d is smaller than the nose radius R and the value of a calculated using Equation (6) is positive, the chip thickness t can be calculated using Equation (8). Note that when Equation (8) is used, this corresponds to the case shown in FIG. 8, where the side cutting edge angle θ is irrelevant and the chip thickness t is determined by the nose radius R, the cutting depth d, and the feed rate f.

[0044]

[0045] The rake angle α is obtained from cross-sectional shape data of the insert in a predetermined direction stored in the storage unit 14. The rake angle α is not constant at every part of the rake face. For this reason, the rake angle α in a cross section along the outflow direction θd of the chip 30 (see FIG. 5) is used as the rake angle α. For this reason, the rake angle α in the cross section along this direction θd is derived by the calculation unit 12b and temporarily stored in the storage unit 14.

[0046] The outflow direction θd of the chips 30 can be calculated using Colwell's approximation formula, assuming that the chips 30 flow in a direction perpendicular to a line connecting both ends of the tip that contact the workpiece (both ends in the circumferential direction of the nose). That is, once the depth of cut d, feed rate f, and nose radius R of the tip are determined, the outflow direction θd of the chips 30 can be calculated from the geometric relationship between these values, as shown in Figure 5.

[0047] The storage unit 14 stores the rake angle α1 in a cross section in a direction θ1 perpendicular to the side cutting edge and the rake angle α2 in a cross section in a direction θ2 along the bisector of the tip angle of the insert. Therefore, the calculation unit 12b uses these rake angles α1 and α2 to determine the rake angle α in the outflow direction θd according to the cutting conditions by interpolation or extrapolation (see FIG. 9). In FIG. 9, θ2 on the horizontal axis corresponds to the direction along the bisector of the tip angle of the insert, and θ1 corresponds to the direction perpendicular to the side cutting edge.

[0048] The breaker shape is also derived in a similar manner. That is, the storage unit 14 stores data indicating the breaker shape in a predetermined direction. These predetermined directions are the direction θ1 perpendicular to the side cutting edge and the direction θ2 along the bisector of the tip angle of the insert. The calculation unit 12b then calculates the breaker shapes β1 and β2 (or the initial chip curl radius r) in the two directions θ1 and θ2 stored in the storage unit 14. ０ ) data, the chip breaker shape β (or chip initial curl radius r ０ ) is calculated by interpolation or extrapolation.

[0049] 10, the rake angles α1 and α2 are determined by the gradient (or the gradient of the flat portion) of the rake face 27 of the insert when it is approximated as a straight line in a cross section in the corresponding direction on the rake face 27, and the distance from the cutting edge position (i.e., the intercept value when the cutting edge position is the origin position). Also, the breaker shapes β1 and β2 are determined by the gradient (or the gradient of the flat portion) of the breaker slope 28 of the insert when it is approximated as a straight line in a cross section in the corresponding direction on the breaker slope 28.

[0050] The shear angle Φ is obtained by performing a cutting test and is stored in the storage unit 14. Examples of the cutting speed, uncut thickness t, and rake angle α used in this cutting test are shown in Table 1. The storage unit 14 also stores information indicating the shear angle Φ, including data on the shear angle Φ obtained from cutting tests performed under other conditions.

[0051]

[0052] In the cutting test, the thickness of the obtained chip 30 is measured. The shear angle Φ is calculated by substituting the measured chip thickness for the chip thickness h in equation (4). Table 2 shows an example of the chip thickness and calculated shear angle obtained in the cutting test of S45C, which is a workpiece material.

[0053]

[0054] Initial curl radius r of chip 30 ０ The calculation method for is different depending on whether the insert is of the parallel type or clamp type shown in Figures 11A and 11B. In the parallel type shown in Figure 11A, the chip breaker slope 28 is small, so the chip 30 comes into contact with the cutting edge 32 on the rake face 27 and the apex 29 of the breaker. Therefore, the initial curl radius r ０ is geometrically calculated as the radius of the arc tangent to the cutting edge 32 and the apex 29 of the breaker. On the other hand, in the clamp type shown in FIG. 11B, the chip 30 contacts the cutting edge 32 on the rake face 27 and the breaker slope 28. Therefore, the initial curl radius r ０ is geometrically calculated as the radius of the arc tangent to the cutting edge 32 and the breaker bevel 28. Note that the shape of the breaker derived by the calculation unit 12b is used to determine whether it is a parallel type or a clamp type.

[0055] The initial curl radius is determined by the rake angle α, and the initial curl radius r in the chip flow direction θd according to the cutting conditions. ０That is, the storage unit 14 stores an initial curl radius r1 (see FIG. 9) in a cross section in a direction θ1 perpendicular to the side cutting edge and an initial curl radius r2 (see FIG. 9) in a cross section in a direction θ2 along the bisector of the tip angle of the insert. Then, the calculation unit 12b uses these initial curl radii r1 and r2 to calculate an initial curl radius r in the outflow direction θd according to the cutting processing conditions. ０ is calculated by interpolation or extrapolation.

[0056] As described above, the tensile strain ε is derived from equation (1). On the other hand, the chip fracture strain ε ｃ The fracture strain ε obtained for each workpiece material by the cutting test is stored in the storage section 14. ｃ That is, the storage unit 14 stores the values ​​of the fracture strain ε obtained by cutting tests performed under different cutting conditions (cutting depth d and feed rate f). ｃ The value is stored in association with the workpiece.

[0057] 12 shows an example of the determination of whether the chip 30 is broken. This example is an example of the results when S45C is used as the workpiece material. If the chip 30 is not broken, it is marked with "X." If the chip 30 is partially broken but continues for 10 or more turns, it is marked with "△." If the chip 30 is broken within 10 turns or less, it is marked with "◯."

[0058] Regarding the tensile strain ε of the chip 30 calculated in each cutting test, when it was determined that the chip 30 was broken (when it was marked as "○"), the value when the tensile strain ε was smallest was defined as the chip fracture strain ε. ｃ The chip breaking strain ε for each work material was ｃ The value of is stored in the storage unit 14 in association with the name of the work material.

[0059] As described above, the tensile strain ε is calculated according to equation (1), and the breaking strain ε ｃ13, when the chip thickness h is greater than the distance L from the cutting edge 32 to the breaker apex 29, that is, when the following equation (9) holds, the calculation unit 12b outputs information indicating that the chip 30 is predicted not to break. In other words, when the tensile strain ε and the fracture strain ε ｃ In the breakability prediction based on a comparison with the formula (9), it is determined that the smaller the distance L from the cutting edge 32 to the apex 29 of the breaker, the easier it is to break the chip. However, in reality, if the breaker is too small, the chip 30 passes through the breaker without being bent by the breaker, as shown in Figure 13, and the chip 30 does not break up. In order to improve the breakability predictability when such a phenomenon occurs, a breakability prediction when formula (9) is valid has also been added.

[0060] Next, a method for predicting the breakability of the chips 30 using the chip breakability prediction device 10 according to the first embodiment will be described with reference to FIG.

[0061] To perform cutting on a workpiece, it is necessary to set cutting conditions. To set the cutting conditions, a chip breakability prediction device 10 is used. Using the chip breakability prediction device 10, a user inputs necessary information into the input / output unit 16, outputs a chip breakability prediction result, and determines cutting conditions based on the prediction result.

[0062] First, the user selects the target workpiece material in the workpiece material field 21a of the input area 21 in the input / output unit 16, and selects the holder and tip to be used in the holder shape field 21b and tip shape field 21c (step ST11). As a result, information on the selected workpiece material and tool is extracted from the information on the workpiece material and tool stored in the storage unit 14 and input to the reception unit 12a. At this time, if the user inputs values ​​for the side cutting edge angle, cutting edge inclination angle, nose radius R, and point angle, this information is also input to the reception unit 12a.

[0063] The user also inputs the cutting speed, feed rate f, and depth of cut d in the cutting conditions column 21d (step ST12). This information is also input to the reception unit 12a. Note that these cutting condition values ​​are provisional, and if it is predicted that the chips 30 will not break, the cutting conditions will be re-entered. The holder and insert may also need to be changed according to the prediction results.

[0064] When the information necessary for cutting is input to the receiving unit 12a, the calculation unit 12b uses the information received by the receiving unit 12a to derive information for predicting whether or not the chip 30 can be broken. Specifically, the calculation unit 12b first calculates the chip thickness t using one of equations (5), (7), and (8) depending on the magnitude relationship between the cutting depth d and the nose radius R (step ST13).

[0065] The calculation unit 12b also calculates the chip flow direction θd using the cutting depth d, feed rate f, and nose radius R of the insert (step ST14). The chip flow direction θd is calculated using, for example, Colwell's approximation formula stored in the storage unit 14. Using this calculated chip flow direction θd, the rake angles α1 and α2, and the initial curl radii r1 and r2 of the chip stored in the storage unit 14, the calculation unit 12b calculates the rake angle α in the direction θd and the initial curl radii r of the chip. ０ is calculated (steps ST15 and ST16).

[0066] Next, the calculation unit 12b calculates the chip thickness h by substituting the chip thickness t obtained in step ST13, the rake angle α obtained in step ST15, and the shear angle Φ stored in the storage unit 14 into equation (4) (step ST17). ０ and the chip thickness h obtained in step ST17 are substituted into equation (1) to derive the tensile strain ε (step ST18).

[0067] At this time, if it is determined that the chamfer width or cutting edge radius b of the selected chip is relatively large compared to the cutting thickness t, the corrected tensile strain ε' calculated by equation (2) is used instead as the tensile strain ε in equation (1) (step ST19).

[0068] The derived value of the tensile strain ε (or the corrected tensile strain ε') is displayed in the fracture prediction value field 22c in the result output area 22 of the input / output unit 16. ｃ The value of is displayed in the fracture boundary column 22d in the result output area 22 of the input / output unit 16 (step ST20).

[0069] Then, the calculation unit 12b calculates the tensile strain ε (or the corrected tensile strain ε′) derived in step ST18 and the fracture strain ε stored in the storage unit 14. ｃ By comparing the results, the degree of breakability of the chips 30 is determined (step ST21).

[0070] The communication unit 12c communicates with the input / output unit 16. As a result, the derived tensile strain ε (or corrected tensile strain ε') and the fracture strain ε ｃ Based on the comparison result, a mark indicating the possibility of separation, such as ○, △, or ×, is displayed in the separation possibility column 22b in the result output area 22 of the input / output unit 16 (step ST22). For example, if the value of the tensile strain ε (or the corrected tensile strain ε') is greater than the fracture strain εc by a predetermined value or more, a mark "○" is displayed. In other words, in this case, the result that the chip is predicted to separate is displayed.

[0071] Furthermore, the calculation unit 12b derives the tensile strain ε (or corrected tensile strain ε') not only for the selected cutting depth d and feed rate f, but also for the cutting depth d and feed rate f within a predetermined range including these values. That is, the calculation unit 12b derives information for predicting whether chips can be broken for each case when the cutting conditions are changed within the range of feed rate and cutting depth displayed on the contour map. Furthermore, the calculation unit 12b derives the fracture strain ε for the cutting depth d and feed rate f within these ranges. ｃ Extract.

[0072] The communication unit 12c then outputs information for creating a contour map of the tensile strain ε (or corrected tensile strain ε') for the predetermined range of cutting depth d and feed rate f. The communication unit 12c also communicates with the input / output unit 16 to output information for displaying an image of the contour map on the display screen 20 of the display unit 16a in the input / output unit 16 (step ST23). The contour map is then displayed on the display screen 20 of the display unit 16a. The image of this contour map shows the breaking strain ε for each cutting depth d and feed rate f. ｃ That is, the communication unit 12c communicates with the input / output unit 16 based on the information derived by the calculation unit 12b. As a result, the display unit 16a of the input / output unit 16 displays the distribution of tensile strain ε generated in the chips using contour lines in a coordinate system whose coordinate axes are the cutting conditions, and also displays an image showing the fracture boundary 22f of the chips.

[0073] Furthermore, the calculation unit 12b calculates the tensile strain ε (or the corrected tensile strain ε') and the fracture strain ε for all the tools included in the tool information 14b stored in the storage unit 14 for the selected workpiece. ｃ This allows a calculation to be made as to whether or not the chips 30 are likely to break for each tool. As a result, all registered tools are listed in the tool candidate column 22e in the order in which they are judged to be likely to break the chips (step ST24).

[0074] If it is determined that the chips 30 will break under the input cutting conditions, the user can simply cut the workpiece under the input cutting conditions. On the other hand, if it is determined that the chips 30 will not break under the input cutting conditions, the user can refer to the displayed contour map and change the cutting conditions to those that are predicted to cause chip breakage. Alternatively, the cutting conditions can be changed and the chip breakability prediction device 10 can be used again to predict chip breakability. Alternatively, the user can change to a tool displayed in the tool candidate list and cut the workpiece.

[0075] Next, we will introduce an example of the results of prediction of chip breakability obtained in a cutting test conducted by changing the depth of cut d and feed rate f. Figure 15 shows a contour map obtained by the chip breakability prediction device 10, with symbols (○△×) indicating the state of chip breakage shown in Figure 12 superimposed. As can be seen, the prediction results roughly match the experimental results. Note that as the depth of cut decreases from about 1.2 mm, the areas judged to be broken become smoothly curved. This is because the chip outflow angle changes suddenly when the depth of cut d is equal to or less than the nose radius R (1.2 mm) of the tool. However, the breaker shape (initial curl radius r) in the chip outflow direction θd ０ ) and rake angle α, it can be seen that the chip breakability can be predicted.

[0076] 16A to 16C show the prediction results when the tensile strain ε is replaced by the corrected tensile strain ε'. When the chamfer width b is relatively large, the prediction results regarding whether or not the specimen can be separated are inaccurate. However, it can be seen that the prediction accuracy is improved by replacing the tensile strain ε with the corrected tensile strain ε'. ２ In the case of the correction value using ３ It can be seen that the prediction accuracy is improved compared to the case of the correction value using

[0077] Figure 17 also shows the prediction results when the tensile strain ε is replaced by the corrected tensile strain ε'. Figure 17 shows a photograph of an actual chip, a contour map based on the tensile strain ε, and a contour map based on the corrected tensile strain ε'. For example, in test example No. 4, in which the chip 30 did not break apart, the prediction of breakability based on the tensile strain ε predicted that the chip would break, while the prediction of breakability based on the corrected tensile strain ε' predicted that the chip would not break. Therefore, it can be seen that the prediction accuracy is improved by replacing the tensile strain ε with the corrected tensile strain ε'.

[0078] 18 shows an example of the results when the calculation unit 12b outputs information indicating that the chip 30 is predicted not to break when the chip thickness h is greater than the distance L from the cutting edge 32 to the apex 29 of the breaker. The upper right part of the figure is an area indicating that the chip will not break. On the other hand, the ○△× symbols obtained from the experimental results are displayed as △ symbols within the area. Therefore, it can be said that it is possible to predict that the chip 30 will become too thick and will not break.

[0079] 19 also shows an example of the results when the chip thickness h is greater than the distance L from the cutting edge 32 to the breaker apex 29. This example shows the results when a different tool was used, and also shows a photograph of the chip. It can be seen that the photograph of the chip matches the predicted results.

[0080] As described above, in the chip breakability prediction device 10 according to this embodiment, the receiving unit 12a receives information regarding the workpiece and the tool, and information indicating the feed rate and the depth of cut. The calculation unit 12b then derives information for predicting whether the chips 30 will break for the workpiece, tool, feed rate f, and depth of cut d indicated in the information received by the receiving unit 12a. This derived information is displayed on the display unit 16a. Therefore, the tester can determine whether the chips 30 will break from the information displayed on the display unit 16a. Even if it is predicted that the chips 30 will not break, information regarding the breakage prediction can be reobtained by changing at least one of the feed rate f and the depth of cut d. Therefore, it is easy to determine the conditions for cutting.

[0081] Furthermore, in this embodiment, when the chamfer width or cutting edge radius b of the tool is relatively large compared to the chip thickness t, the tensile strain ε is replaced with the corrected tensile strain ε'. In other words, the influence of the chamfer width or cutting edge radius b of the tool on the tensile strain ε of the chip 30 is taken into consideration. This further improves the predictability of chip breakage.

[0082] In this embodiment, the result output area 22 of the display unit 16a displays the contour map, the judgment result, the predicted fracture value, and the fracture boundary 22f, but this is not limiting. For example, the display unit 16a may display only the contour map, or may display only the judgment result, or may display only the predicted fracture value and the fracture boundary 22f. Also, the display of tool candidates may be omitted.

[0083] In addition, in this embodiment, a process is performed in which the tensile strain ε is replaced with the corrected tensile strain ε', but if it is known that the cutting thickness t is equal to or less than the chamfer width or the cutting edge radius b, this process may be omitted.

[0084] In this embodiment, the calculation unit 12b calculates the initial curl radius r in the chip outflow direction θd due to cutting. ０ and the rake angle α are calculated, and the calculated initial curl radius r ０ The calculation of the prediction of the separability is performed using the rake angle α and the initial curl radius r in the chip flow direction θd. However, this is not limited to this. ０ In this case, for example, the initial curl radius r in the direction θ1 perpendicular to the side cutting edge may be calculated. ０ and rake angle α may be used, or the initial curl radius r in the direction θ2 along the bisector of the tip angle of the tip ０ and rake angle α may be used.

[0085] Second Embodiment The second embodiment is a control device 41 provided in a prediction system 40 for predicting the breakability of chips in cutting, as shown in Fig. 20. Note that the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0086] The control device 41 is communicably connected to an input / output device 42, for example, via a computer network NW. The control device 41 includes a control unit 12 for performing arithmetic processing, and a storage unit 14 for storing processing programs, data, and the like.

[0087] The input / output device 42 has a display unit 16a having a display screen 20 and an input unit 16b such as a keyboard. The display unit 16a is configured to display cutting conditions and calculation results. The display screen 20 of the display unit 16a includes an input area 21 and a result output area 22, similar to the display screen 20 of the first embodiment (see FIG. 2). The input area 21 displays information input by operating the input unit 16b. This input information is temporarily stored in the storage unit 14 of the control device 41, for example, via the computer network NW. The input unit 16b may be configured integrally with the display unit 16a.

[0088] Information about the workpiece in cutting (workpiece information 14a) and information about the tool (tool information 14b) are stored in the storage unit 14. The storage unit 14 may also temporarily store information transmitted from the input / output device 42 and data and information used in calculations by the calculation unit 12b.

[0089] The functions executed by the control unit 12 include a reception unit 12a, a calculation unit 12b, and a communication unit 12c. The communication unit 12c transmits necessary control information to the input / output device 42 so that the workpiece and tool indicated by the information stored in the storage unit 14 are displayed on the display screen 20 of the input / output device 42.

[0090] When performing calculations, the control unit 12 uses information stored in the storage unit 14 and information output from the input / output device 42 and temporarily stored in the storage unit 14 via the computer network NW.

[0091] The reception unit 12a receives information on factors that affect whether chips break, such as cutting conditions, from the input / output device 42. Specifically, information on a workpiece and a tool that match the workpiece and tool selected in the input area 21 of the input / output device 42 is input from the storage unit 14 to the reception unit 12a. In addition, information indicating the feed rate f and the depth of cut d input in the input area 21 of the input / output device 42 is input to the reception unit 12a from the input / output device 42. In other words, the reception unit 12a receives information on the workpiece and tool to be cut that are selected in the input / output device 42 from the workpiece and tools indicated by the information stored in the storage unit 14, as well as information indicating the feed rate f and the depth of cut d in the cutting.

[0092] The calculation unit 12b uses the information received by the reception unit 12a to derive information for predicting whether or not the chips can be broken.

[0093] The communication unit 12c communicates with the input / output device 42 so that the information for predicting whether or not the chips can be broken, derived by the calculation unit 12b, is displayed in the result output area 22 on the display screen 20 of the display unit 16a of the input / output device 42.

[0094] The control device 41 according to the second embodiment performs steps ST13 to ST19 and ST21 of the control steps shown in Fig. 14. The control device 41 also communicates with the input / output device 42 so that the input / output device 42 performs steps ST20 and ST22 to ST24.

[0095] Although a description of other configurations, actions, and effects will be omitted, the description of the first embodiment can be applied to the second embodiment.

[0096] (Other Embodiments) It should be noted that the embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The present invention is not limited to the above-described embodiments, and various modifications and improvements are possible without departing from the spirit and scope of the present invention.

[0097] Here, the above embodiment will be outlined.

[0098] (1) The chip breakability prediction device according to the embodiment includes a storage unit that stores information about the workpiece and tools used in cutting processing; a reception unit that receives information about the workpiece to be cut and the tools to be used that are selected from the workpiece and tools indicated in the information stored in the storage unit, and is configured to receive information indicating the feed rate and depth of cut in the cutting processing; a calculation unit that uses the information received by the reception unit to derive information for predicting whether the chips will break; and a display unit that displays the information derived by the calculation unit for predicting whether the chips will break.

[0099] In the chip breakability prediction device, a receiving unit receives information regarding the workpiece to be cut and the tool to be used, as well as information indicating the feed rate and depth of cut. Then, a calculation unit derives information for predicting whether chips will break for the workpiece, tool, feed rate, and depth of cut indicated in the information received by the receiving unit. This derived information is displayed on a display unit, making it possible to determine whether chips will break from the information displayed on the display unit. Even if it is predicted that the chips will not break, information regarding breakage prediction can be obtained again by changing at least one of the feed rate and the depth of cut. Therefore, it is easy to determine the conditions for cutting.

[0100] (2) The calculation unit may be configured to calculate the tensile strain generated in the chips due to the cutting process based on the initial curl radius and chip thickness of the chips, and may be configured to correct the tensile strain using the chamfer width or cutting edge roundness radius of the tool indicated by the information received by the reception unit, and the chip thickness obtained from the nose radius of the tool, the side cutting edge angle of the tool, the feed rate, and the cutting depth indicated by the information received by the reception unit.

[0101] In this embodiment, the influence of the tool's chamfer width or cutting edge radius and chip thickness on the tensile strain of the chip is taken into consideration, thereby further improving the predictability of chip breakage.

[0102] In other words, when the chamfer or cutting edge roundness is relatively large compared to the chip thickness determined by the cutting conditions, the chip shape is determined by the chamfer or cutting edge roundness regardless of the chip breaker behind it. Therefore, contrary to the initial assumption (that the initial curl radius of the chip is geometrically determined by the chip breaker), there is a risk that the prediction accuracy of whether the chip will break or not will decrease. In contrast, in this embodiment, tensile strain is corrected, so it is possible to avoid a situation where the prediction accuracy decreases.

[0103] (3) The calculation unit may be configured to acquire an initial curl radius and a rake angle at each cross section from a cross section perpendicular to the side cutting edge of the tool indicated by the information received by the receiving unit and a cross section of the bisector of the point angle of the tool, and may be configured to calculate, by interpolation or extrapolation, an initial curl radius and a rake angle in the chip outflow direction due to the cutting process from the initial curl radius and the rake angle at each of the acquired cross sections.

[0104] In this embodiment, the initial curl radius and rake angle are used taking into account the chip flow direction, so that the predictability of chip breakage can be further improved.

[0105] That is, even when the same tool is used, the chip flow direction changes depending on the cutting conditions and workpiece material. Therefore, the cross section of the tool in the chip flow direction changes, and the chip breaker cross-sectional shape, which affects the chip breakability, also changes. Therefore, in practice, it is necessary to capture the tool shape three-dimensionally. In this case, 3D data storage and data processing for each cutting condition are required, which requires a complex procedure. In contrast, in this embodiment, the initial curl radius and rake angle in the chip flow direction due to cutting are calculated by interpolation or extrapolation from the initial curl radius and rake angle for each acquired cross section. This eliminates the need for complex procedures. Furthermore, the analysis time per condition is not long, as in methods using FEM analysis.

[0106] (4) The display unit may be configured to display, in a coordinate system with the cutting conditions as coordinate axes, the distribution of tensile strain occurring in the chips using contour lines and an image showing the fracture boundary of the chips as the information for predicting the breakability of the chips.

[0107] In this aspect, if the information derived by the calculation unit predicts that the chip will not break, the cutting conditions under which the chip will break can be easily estimated by referring to the image displayed on the display unit.

[0108] (5) The display unit may be configured to display the distribution of tensile strain occurring in the chips using one or more methods selected from color, shades of hue, and brightness.

[0109] In this embodiment, the distribution of tensile strain can be easily identified in the image displayed on the display unit.

[0110] (6) The calculation unit may be configured to compare the distance from the cutting edge of the tool to the apex of the breaker with the chip thickness, and predict that the chip will not break if the chip thickness is greater.

[0111] When the chip thickness is large compared to the breaker shape, the chip rigidity is too high and the chip does not penetrate into the valley of the breaker. This can cause the chip to not take the expected shape along the breaker, which can reduce the accuracy of the prediction of breakability. In contrast, in this mode, breakability is predicted by comparing the distance from the cutting edge of the cutting tool to the apex of the breaker with the chip thickness during cutting. This prevents a reduction in prediction accuracy.

[0112] (7) The calculation unit may be configured to calculate chip breakability for all of the tools indicated by the information stored in the storage unit, and the display unit may be configured to display a list of chip breakability for each tool based on the information derived by the calculation unit.

[0113] In this embodiment, the chip breakability of each tool is displayed on the display unit in a list. Therefore, even if the information derived by the calculation unit predicts that chips will not break, it is possible to determine which tools are likely to be improved based on the list of tool breakability displayed on the display unit. Therefore, improvement in chip breakability is expected.

[0114] (8) The control device according to the embodiment is a control device that is provided in a prediction system for predicting the breakability of chips in cutting processing, and is communicatively connected to an input / output device, and includes: a storage unit that stores information about the workpiece and tools in cutting processing; a reception unit that is configured to receive from the input / output device information about the workpiece and tools to be used that are selected by the input / output device from the workpiece and tools indicated in the information stored in the storage unit, and to receive from the input / output device information indicating the feed rate and depth of cut in the cutting processing; a calculation unit that is configured to use the information received by the reception unit to derive information for predicting whether the chips can be broken; and a communication unit that is configured to communicate with the input / output device so that the information for predicting whether the chips can be broken, derived by the calculation unit, is displayed on a display unit of the input / output device.

[0115] In the control device, the receiving unit receives information regarding the workpiece to be cut and the tool to be used, as well as information indicating the feed rate and depth of cut. The calculation unit then derives information for predicting whether chips will break for the workpiece, tool, feed rate, and depth of cut indicated in the information received by the receiving unit. This derived information is output from the communication unit and input to the input / output device. The information displayed on the display unit of the input / output device makes it possible to determine whether the chips will break. Furthermore, even if it is predicted that the chips will not break, information regarding the breakage prediction can be obtained again by changing at least one of the feed rate and the depth of cut. Therefore, it is easy to determine the conditions for cutting.

[0116] (9) The calculation unit may be configured to calculate the tensile strain generated in the chips due to the cutting process based on the initial curl radius and chip thickness of the chips, and may be configured to correct the tensile strain using the chamfer width or cutting edge roundness radius of the tool indicated by the information received by the reception unit, and the chip thickness obtained from the nose radius of the tool, the side cutting edge angle of the tool, the feed rate, and the cutting depth indicated by the information received by the reception unit.

[0117] (10) The calculation unit may be configured to acquire an initial curl radius and a rake angle at each cross section from a cross section perpendicular to the side cutting edge of the tool indicated by the information received by the receiving unit and a cross section of the bisector of the point angle of the tool, and may be configured to calculate, by interpolation or extrapolation, an initial curl radius and a rake angle in the chip outflow direction due to the cutting process from the initial curl radius and the rake angle at each of the acquired cross sections.

[0118] (11) The communication unit may be configured to communicate with the input / output device so that an image showing the distribution of tensile strain occurring in the chips using contour lines and the fracture boundary of the chips is displayed on the display unit in a coordinate system whose coordinate axes are the cutting processing conditions.

[0119] (12) The communication unit may be configured to communicate with the input / output device so that the distribution of tensile strain occurring in the chips is displayed on the display unit in one or more ways selected from color, shade of hue, and brightness.

[0120] (13) The calculation unit may be configured to compare the distance from the cutting edge of the tool to the apex of the breaker with the chip thickness, and predict that the chip will not break if the chip thickness is greater.

[0121] When the chip thickness is large compared to the breaker shape, the chip rigidity is too high and the chip does not penetrate into the valley of the breaker. This can cause the chip to not take the expected shape along the breaker, which can reduce the accuracy of the prediction of breakability. In contrast, in this mode, breakability is predicted by comparing the distance from the cutting edge of the cutting tool to the apex of the breaker with the chip thickness during cutting, so this can prevent a reduction in prediction accuracy.

[0122] (14) The calculation unit may be configured to calculate chip breakability for all of the tools indicated by the information stored in the storage unit. The communication unit may communicate with the input / output device so that a list of chip breakability for each tool is displayed on the display unit based on the calculation result by the calculation unit.

[0123] (15) In the method for predicting chip breakability according to the embodiment, a receiving unit receives information about a workpiece to be cut and a tool to be used, selected from the workpieces and tools for the cutting process indicated in the information stored in a storage unit, and the receiving unit also receives information indicating the feed rate and depth of cut in the cutting process. Using the information received by the receiving unit, a calculation unit derives information for predicting whether chips can be broken, and the information derived by the calculation unit is displayed on a display unit.

[0124] In the chip breakability prediction method, the receiving unit receives information about the workpiece and the tool, and information indicating the feed rate and the depth of cut, and the calculation unit uses the information received by the receiving unit to derive information for predicting whether the chip will break. This derived information is displayed on the display unit. Therefore, it is possible to determine whether the chip will break from the information displayed on the display unit. Furthermore, even if it is predicted that the chip will not break, information regarding the breakage prediction can be obtained again by changing at least one of the feed rate and the depth of cut. Therefore, it is easy to determine the conditions for cutting.

[0125] (16) In the chip breakability prediction method, the calculation unit may calculate tensile strain generated in the chip due to the cutting process based on the initial curl radius and chip thickness of the chip. In this case, the calculation unit may correct the tensile strain using the chamfer width or cutting edge roundness radius of the tool indicated by the information received by the reception unit, and the chip thickness obtained from the nose radius of the tool, the side cutting edge angle of the tool, the feed rate, and the depth of cut indicated by the information received by the reception unit.

[0126] (17) In the chip breakability prediction method, the calculation unit may obtain an initial curl radius and a rake angle at each cross section from a cross section perpendicular to the side cutting edge of the tool indicated by the information received by the receiving unit and a cross section of the bisector of the point angle of the tool, and the calculation unit may calculate, by interpolation or extrapolation, an initial curl radius and a rake angle in the chip outflow direction due to the cutting process from the initial curl radius and the rake angle at each of the obtained cross sections.

[0127] (18) In the method for predicting chip breakability, the calculation unit may compare the distance from the cutting edge of the cutting tool to the apex of the breaker with the chip thickness, and predict that the chip will not break if the chip thickness is greater.

[0128] When the chip thickness is large compared to the breaker shape, the chip rigidity is too high and the chip does not penetrate into the valley of the breaker. This can cause the chip to not take the expected shape along the breaker, which can reduce the accuracy of the prediction of breakability. In contrast, in this mode, breakability is predicted by comparing the distance from the cutting edge of the cutting tool to the apex of the breaker with the chip thickness during cutting, so this can prevent a reduction in prediction accuracy.

[0129] (19) The chip breakability prediction method according to the embodiment receives, from an input / output device, information on the workpiece to be cut and the tool to be used, selected from the workpiece and the tool in the cutting process indicated in the information stored in the storage unit, and also receives information indicating the feed rate and depth of cut in the cutting process from the input / output device. The calculation unit derives information for predicting whether chips will be breakable for the workpiece, tool, feed rate, and depth of cut indicated in the information received from the input / output device, and communicates with the input / output device via a communication unit so that the information derived by the calculation unit is displayed on the display unit of the input / output device.

[0130] The chip breakability prediction method receives information indicating the workpiece, tool, feed rate, and depth of cut, and derives information for predicting whether chips will break for the workpiece, tool, feed rate, and depth of cut indicated by the information. This derived information is displayed on the display unit of the input / output device through communication with the display unit. This displayed information makes it possible to determine whether chips will break. Furthermore, even if it is predicted that the chips will not break, information regarding breakage prediction can be obtained again by changing at least one of the feed rate and the depth of cut. Therefore, it is easy to determine conditions for cutting.

[0131] As described above, according to the embodiment, when performing cutting, it becomes possible to easily determine the conditions for cutting.

[0132] This application is based on Japanese Patent Application No. 2023-198389 filed with the Japan Patent Office on November 22, 2023, the contents of which are incorporated herein by reference.

Claims

DEPCT691. A material separation prediction device comprising: a storage unit that stores information about the workpiece and cutting tool; an input unit configured to receive information about the workpiece to be fed into the cutting process and the tool to be used, the selected workpiece from the workpieces and tools indicated in the information stored in the storage unit, and to receive information indicating the feed rate and cutting volume; a computing unit configured to obtain information for predicting whether or not the material separates using the information received by the input unit; and an output unit configured to display the information for predicting whether or not the material separates, the information received by the computing unit.The chip separation predictor device under Claim 1, where the computational unit is configured to: calculate the tensile strain generated in the chip by cutting based on the initial roll radius and chip thickness; and correct the tensile strain using the cutting corner width or chamfer radius of the tool blade end indicated by information received by the receiving unit, and the cutting thickness derived from the tool chamfer radius, the tool lateral cutting angle, feed rate, and cutting volume indicated by information received by the receiving unit.The chip separation predictor under Claim 1, where the computation unit is configured to: obtain the initial roll radius and cutting edge angle in each cross-section from the tool cross-section indicated by information received by the receiving unit in the direction perpendicular to the lateral cutting blade and the cross-section of the tool's jaw bisector; and calculate the initial roll radius and cutting edge angle in the chip outflow direction by cutting by intermittent or out-of-intermittent estimation from the initial roll radius and cutting edge angle obtained in each cross-section.

4. The chip separation predictor under Claim 1, where the output unit is configured to display an image showing the distribution of tensile stress generated in the chip by the perimeter and showing the chip separation edges as information for predicting the chip separation ability in a coordinate system where the cutting condition is the coordinate axis. 5.The scrap separation capability prediction device under Claim 4, where the output unit is configured to show the distribution of tensile stress generated in the scrap by one or more methods selected from color, hue intensity, and luminance.

6. The scrap separation capability prediction device under Claim 1, where the computation unit is configured to compare the distance from the tip of the tool's blade to the apex of the separator with the scrap thickness and predict that the scrap will not separate when the scrap thickness is greater than.

7. The scrap separation capability prediction device under Claim 1, where the computation unit is configured to calculate the scrap separation capability for all tools identified by the information stored in the storage unit, and the output unit is configured to display a list of scrap separation capabilities for each tool based on the information obtained by the computation unit.8.The control equipment, integrated into the prediction system for forecasting the chip separation capability during cutting and communicatively connected to the input / output devices, comprises: a storage unit that stores information about the workpiece and cutting tool; a receiving unit configured to receive, from the input / output devices, information about the workpiece to be fed into cutting and the tool to be used, selected by the input / output devices from among the workpieces and tools indicated in the information stored in the storage unit, and to receive, from the input / output devices, information indicating the feed rate and cutting volume; a computing unit configured to receive information for predicting chip separation using the information received by the receiving unit; and a communication unit configured to communicate with the input / output devices in such a way that the information for predicting chip separation received by the computing unit is displayed on the output unit of the input / output device.9The control device under claim 8, where the computing unit is configured to: calculate the tensile strain generated in the chip by cutting based on the initial roll radius and chip thickness; and correct the tensile strain using the cutting corner width or the chamfer radius of the tool's blade tip indicated by information received by the receiving unit, and the cutting thickness derived from the tool's chamfer radius, the tool's lateral cutting angle, the feed rate, and the cutting volume indicated by information received by the receiving unit.

10. The control device under claim 8, where the communication unit is configured to communicate with the input / output device in such a way that an image showing the distribution of the tensile strain generated in the chip by the perimeter and showing the chip's split edge is displayed on the display unit in a coordinate system where the cutting conditions are defined as the coordinate axes.11.

12. The control device under claim 10, where the communication unit is configured to communicate with the input / output devices, in such a way that the distribution of tensile stress generated in the scrap material is displayed on the display unit by one or more methods selected from color, hue intensity, and illumination.

13. The control device under claim 8, where the computing unit is configured to calculate the scrap material separation capacity for all instruments identified by the information stored in the storage unit, and the communication unit is configured to communicate with the input / output devices in such a way that a list of scrap material separation capacities for each instrument is displayed on the display unit based on the results calculated by the computing unit.The method for predicting the separation ability of scrap materials includes: receiving, by the receiving unit, information about the workpiece to be fed into the cutting process and the tool to be used; the workpiece and tool selected from the workpiece and cutting tool identified in the information stored in the storage unit; and receiving, by the receiving unit, information indicating the feed rate and cutting volume; receiving, by the computing unit, information for predicting whether the scrap material is separated, using the information received by the receiving unit; and displaying the information received by the computing unit on the display unit.14The method for predicting the separation ability of the chip under claim 13 includes: calculation, by computational unit, of the tensile strain generated in the chip by cutting based on the initial roll radius and chip thickness; and correction, by computational unit, of the tensile strain using the cutting corner width or chamfer radius of the tool blade end indicated by information received by the receiving unit, and the cutting thickness derived from the tool chamfer radius, the tool side cutting angle, the feed rate, and the cutting volume indicated by information received by the receiving unit.15The method for predicting chip separation capability comprises: receiving, from the input / output device, information about the workpiece to be fed into the cutting area and the tool to be used; the workpiece and tool selected from the workpiece and cutting tool identified in the information stored in the storage unit; and receiving, from the input / output device, information indicating the feed rate and cutting volume; receiving, by the computing unit, information for predicting whether or not the chip is separated in the case of the workpiece, tool, feed rate, and cutting volume indicated by the information received from the input / output device; and communicating, by the communication unit, with the input / output device in such a way that the information received by the computing unit is displayed on the display unit of the input / output device.

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