The antenna module and the electronic components assembled within that module.

Abstract

DEPCT69 Electronic devices, based on the different appearances shown in this disclosure, can be assembled together. Consisting of: a frame consisting of a front panel facing one direction, and a back panel... Which faces the second direction opposite to the first direction, and the side pieces that surround it. The empty space between the front and back panels, with at least one section formed from the material. Metal; display visible through one section of the front panel; designated antenna module. The module is positioned within the available space; and the wireless communication circuit is electrically connected to the module. An antenna is used for transmitting and / or receiving signals with frequencies ranging from 20GHz to 100GHz. An antenna module can be assembled with: one surface facing a third direction which forms the shape. An acute angle in the second direction; a second surface facing the fourth direction opposite to the third direction; At least one electrically conductive component is placed on one surface or within a module. An antenna to face a third direction; and at least one second conductive component. The piece that is adjacent to the lateral piece between the first and second surfaces and extends in the fifth direction. Unlike the third and fourth directions, and which face between the side surface and the first part of Other front panel designs are also possible;

Description

Antenna module and electronic device including the same

[0001] Various embodiments of the present invention relate to an antenna module and an electronic device including the antenna module.

[0002] Electronic devices can output stored information in the form of audio or video. As electronic device integration increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions such as gaming, multimedia functions such as music and video playback, communication and security functions for mobile banking, and even functions such as schedule management and electronic wallets are being integrated into a single electronic device.

[0003] In communication devices embedded in electronic devices, efforts are being made to develop next-generation communication systems, such as next-generation (e.g., 5th generation) communication systems or pre-next-generation communication systems, to meet the increasing demand for wireless data traffic following the commercialization of 4G (4th generation) communication systems.

[0004] To achieve high data rates, next-generation communication systems are being implemented in ultra-high frequency bands (tens of GHz bands, for example, bands above 6 GHz and below 300 GHz) such as millimeter waves (mmWave). To mitigate radio wave path loss and increase the transmission distance of radio waves in ultra-high frequency bands, next-generation communication systems are developing technologies such as beamforming, massive multi-input multi-output (massive MIMO), full-dimensional MIMO (FD-MIMO), antenna arrays, analog beamforming, and large-scale antennas.

[0005] The antenna's transmission and / or reception may be implemented by an external housing of the electronic device, a metallic radiator inside the electronic device, or a metal trace on a printed circuit board.

[0006] The structure of the above antenna may be an appropriate method when using a wavelength below a low bandwidth (e.g., below 6 GHz), but it cannot implement efficient transmission and reception when using a wavelength above a high bandwidth (e.g., above 6 GHz) with strong straightness. For example, an antenna structure for using a wavelength above a high bandwidth (e.g., above 6 GHz) must be implemented as an antenna module including a plurality of dipole antennas, patch antennas, or transceiver circuitry, and may be positioned away from elements that interfere with transmission and reception inside an electronic device (e.g., components including metal materials, displays, etc.) in order to enable efficient transmission and reception.

[0007] According to various embodiments of the present disclosure, an antenna module for efficient transmission and reception and an antenna housing structure equipped therewith can be implemented, which is spaced apart from an external housing made of a metal material within an electronic device.

[0008] An electronic device according to various embodiments of the present disclosure may include a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the rear plate, at least a portion of which is formed of a metal material, a display visible through a first portion of the front plate, an antenna module positioned within the space, and a wireless communication circuit electrically connected to the antenna module and configured to transmit and / or receive a signal having a frequency of 20 GHz to 100 GHz. The antenna module may include a first surface facing a third direction forming an acute angle with the second direction, a second surface facing a fourth direction opposite to the third direction, at least one first conductive element disposed on the first surface or within the antenna module so as to face the third direction, and at least one second conductive element extending in a fifth direction between the first surface and the second surface, adjacent to the side member, different from the third direction and the fourth direction, and facing between the first portion of the front plate and the side surface.

[0009] An electronic device according to various embodiments of the present disclosure may include a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the rear plate, at least a portion of which is formed of a metal material, a display visible through a first portion of the front plate and an antenna housing positioned within the space and including an inclined surface facing the rear plate, and an antenna module disposed on the inclined surface of the antenna housing and disposed in a third direction forming an acute angle with the second direction. The antenna module may include an antenna module including a substrate portion including a first layer having a first area, a second layer having a second area smaller than the first area and disposed on top of the first layer, a first conductive element including an array of a plurality of conductive plates disposed on an upper surface or inside of the second layer and formed toward the third direction, a second conductive element disposed inside the first layer, exposed toward the side, and extending toward a direction different from the third direction, and a wireless communication circuit electrically connected to the first conductive element or the second conductive element and configured to transmit and / or receive a signal having a frequency of 6 GHz to 300 GHz.

[0010] An antenna structure according to various embodiments of the present disclosure may include an antenna housing that is provided as an integral body and includes a fixing surface for support and a recess-shaped fixing surface having a designated inclination with respect to the fixing surface, and an antenna module at least partially inserted and fixedly disposed in the fixing surface. The antenna module may include a substrate including a first layer having a first area, a second layer having a second area smaller than the first area and disposed on top of the first layer, a first conductive element disposed on an upper surface or inside of the second layer and formed to face a direction perpendicular to the designated inclination, a second conductive element disposed inside the first layer, exposed toward the side, and extending in a direction perpendicular to a direction in which the first conductive element faces, and a wireless communication circuit electrically connected to the first conductive element or the second conductive element and configured to transmit and / or receive a signal having a designated frequency.

[0011] An electronic device according to various embodiments of the present disclosure can secure a separation distance from elements that interfere with transmission and reception of antenna signals inside the electronic device and provide an antenna module with improved radiation performance.

[0012] Electronic devices according to various embodiments of the present disclosure can implement antennas in a modular structure to address mounting space constraints and facilitate simple assembly and disassembly. Furthermore, for efficient antenna radiation, an antenna housing capable of providing an antenna radiation area in a specified direction while the antenna module is mounted can be implemented.

[0013] An electronic device according to various embodiments of the present disclosure can provide arrangement and configuration of a heat dissipation member for efficiently dissipating heat generated in an antenna module.

[0014] An electronic device according to various embodiments of the present disclosure can provide efficient antenna transmission and reception by controlling the arrangement of a patch antenna or dipole antenna constituting an antenna module.

[0015] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0016] FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0017] FIG. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

[0018] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

[0019] FIG. 5 is a block diagram of an electronic device in a network environment including a plurality of cellular networks, according to various embodiments.

[0020] FIGS. 6A to 6D illustrate one embodiment of the structure of the electronic device illustrated in FIG. 5 according to various embodiments of the present disclosure.

[0021] FIG. 7 illustrates an example of the structure of the third antenna module (446) described with reference to FIG. 5, according to various embodiments of the present disclosure.

[0022] FIG. 8 is a cross-sectional view illustrating a cross-section of an antenna module according to various embodiments of the present disclosure.

[0023] FIG. 9A is a top view of an antenna module positioned within an electronic device according to various embodiments of the present disclosure. FIG. 9B is a side view of an antenna module according to various embodiments of the present disclosure.

[0024] FIG. 10A is a perspective view illustrating an antenna module mounted in an antenna housing according to various embodiments of the present disclosure. FIG. 10B is an exploded perspective view illustrating an antenna module and a heat dissipation member before being mounted in an antenna housing according to various embodiments of the present disclosure.

[0025] FIG. 11 is a cross-sectional view showing the interior of an electronic device in which an antenna module and an antenna housing are arranged according to various embodiments of the present disclosure.

[0026] FIG. 12 is a top view of the interior of an electronic device in which an antenna module and an antenna housing are arranged, according to various embodiments of the present disclosure.

[0027] FIG. 13 is a cross-sectional view showing the interior of an electronic device in which an antenna module and an antenna housing are arranged, according to another embodiment of the present disclosure.

[0028] FIG. 14 is a cross-sectional view showing the interior of an electronic device in which an antenna module and an antenna housing are arranged, according to another embodiment of the present disclosure.

[0029] FIG. 15 is a cross-sectional view showing the interior of an electronic device in which an antenna module and an antenna housing are arranged, according to another embodiment of the present disclosure.

[0030] FIG. 16 is a cross-sectional view showing the interior of an electronic device in which an antenna module and an antenna housing are arranged, according to another embodiment of the present disclosure.

[0031] FIG. 17 is a cross-sectional view showing the interior of an electronic device in which an antenna module and an antenna housing are arranged, according to another embodiment of the present disclosure.

[0032] FIG. 18 is a cross-sectional view showing the interior of an electronic device in which an antenna module and an antenna housing are arranged, according to another embodiment of the present disclosure.

[0033] FIG. 19 is a drawing showing the arrangement configuration of an antenna module inside an electronic device according to various embodiments of the present disclosure.

[0034] According to various embodiments of FIG. 1, there is a block diagram of an electronic device (101) within a network environment (100).

[0035] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input device (150), an audio output device (155), a display device (160), an audio module (170), a sensor module (176), an interface (177), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the display device (160) or the camera module (180)), or may have one or more other components added. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, a sensor module (176) (e.g., a fingerprint sensor, an iris sensor, or an ambient light sensor) may be implemented embedded in a display device (160) (e.g., a display).

[0036] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may load a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) into a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), and a secondary processor (123) (e.g., a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor) that may operate independently or together therewith. Additionally or alternatively, the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part of it.

[0037] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display device (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)).

[0038] The memory (130) can store various data used by at least one component (e.g., a processor (120) or a sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., a program (140)) and input data or output data for commands related thereto. The memory (130) can include a volatile memory (132) or a non-volatile memory (134).

[0039] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0040] The input device (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input device (150) can include, for example, a microphone, a mouse, or a keyboard.

[0041] The audio output device (155) can output audio signals to the outside of the electronic device (101). The audio output device (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback, and the receiver may be used to receive incoming calls. In one embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0042] A display device (160) can visually provide information to an external party (e.g., a user) of an electronic device (101). The display device (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display device (160) may include touch circuitry configured to detect a touch, or a sensor circuit (e.g., a pressure sensor) configured to measure the intensity of a force generated by the touch.

[0043] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through an input device (150), or output sound through an audio output device (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or headphone)) directly or wirelessly connected to the electronic device (101).

[0044] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0045] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) to an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0046] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0048] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0049] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (388) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0050] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to identify and authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include one or more antennas, from which at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and the external electronic device via the at least one selected antenna.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the electronic devices (102, 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, or client-server computing technologies may be utilized, for example.

[0055] Electronic devices according to various embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0056] The various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" each include all possible combinations of the items listed together in that phrase. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0057] The term "module" as used herein may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or portion of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0058] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more commands stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one command among the one or more commands stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one command called. The one or more commands may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0059] According to one embodiment, the method according to various embodiments of the invention in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be downloaded from an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online (e.g., by download or upload). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0060] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single or multiple entities. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0061] FIG. 2 is a front perspective view of an electronic device (101) according to various embodiments of the present disclosure. FIG. 3 is a rear perspective view of an electronic device (101) according to various embodiments of the present disclosure.

[0062] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment may include a housing (310) that includes a first side (or front side) (310A), a second side (or back side) (310B), and a side surface (310C) that surrounds a space between the first side (310A) and the second side (310B). In another embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (310A), the second side (310B), and the side surface (310C) of FIG. 2. According to one embodiment, the first side (310A) may be formed by a front plate (302) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (310B) may be formed by a substantially opaque back plate (311). The rear plate (311) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (310C) may be formed by a side bezel structure (or “side member”) (318) that is coupled to the front plate (302) and the rear plate (311) and comprises a metal and / or polymer. In some embodiments, the rear plate (311) and the side bezel structure (318) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0063] In the illustrated embodiment, the front plate (302) may include two first regions (310D) extending seamlessly from the first surface (310A) toward the rear plate (311) at both ends of a long edge of the front plate (302). In the illustrated embodiment (see FIG. 3), the rear plate (311) may include two second regions (310E) extending seamlessly from the second surface (310B) toward the front plate (302) at both ends of a long edge. In some embodiments, the front plate (302) (or the rear plate (311)) may include only one of the first regions (310D) (or the second regions (310E)). In other embodiments, some of the first regions (310D) or the second regions (310E) may not be included. In the embodiments, when viewed from the side of the electronic device (101), the side bezel structure (318) may have a first thickness (or width) on the side that does not include the first regions (310D) or the second regions (310E), and may have a second thickness that is thinner than the first thickness on the side that includes the first regions (310D) or the second regions (310E).

[0064] According to one embodiment, the electronic device (101) may include at least one of a display (301), an audio module (303, 307, 314), a sensor module (304, 316, 319), a camera module (305, 312, 313), a key input device (317), a light emitting element (306), and a connector hole (308, 309). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the key input device (317) or the light emitting element (306)) or may additionally include other components.

[0065] In one embodiment, the display (301) may be exposed through, for example, a substantial portion of the front plate (302). In some embodiments, at least a portion of the display (301) may be exposed through the front plate (302) forming the first surface (310A) and the first areas (310D) of the side surfaces (310C). In some embodiments, the edges of the display (301) may be formed to be substantially identical to the adjacent outer contour of the front plate (302). In other embodiments (not shown), the gap between the outer contour of the display (301) and the outer contour of the front plate (302) may be formed to be substantially identical to expand the area over which the display (301) is exposed.

[0066] In another embodiment (not shown), a recess or opening may be formed in a portion of the screen display area of ​​the display (301), and at least one of an audio module (314), a sensor module (304), a camera module (305), and a light-emitting element (306) may be included aligned with the recess or opening. In another embodiment (not shown), at least one of an audio module (314), a sensor module (304), a camera module (305), a fingerprint sensor (316), and a light-emitting element (306) may be included on the back surface of the screen display area of ​​the display (301). In another embodiment (not shown), the display (301) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (304, 519) and / or at least a portion of the key input device (317) may be disposed in the first areas (310D) and / or the second areas (310E).

[0067] According to one embodiment, the audio module (303, 307, 314) may include a microphone hole (303) and a speaker hole (307, 314). The microphone hole (303) may have a microphone disposed therein for acquiring external sounds, and in some embodiments, multiple microphones may be disposed so as to detect the direction of sounds. The speaker hole (307, 314) may include an external speaker hole (307) and a receiver hole (314) for calls. In some embodiments, the speaker hole (307, 314) and the microphone hole (303) may be implemented as a single hole, or a speaker may be included without the speaker hole (307, 314) (e.g., a piezo speaker).

[0068] According to one embodiment, the sensor modules (304, 316, 319) may generate electrical signals or data values ​​corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor modules (304, 316, 319) may include, for example, a first sensor module (304) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (310A) of the housing (310), and / or a third sensor module (319) (e.g., an HRM sensor) and / or a fourth sensor module (316) (e.g., a fingerprint sensor) disposed on a second surface (310B) of the housing (310). The fingerprint sensor may be disposed on the first surface (310A) of the housing (310) (e.g., the display (301) as well as the second surface (310B). The electronic device (101) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (304).

[0069] According to one embodiment, the camera modules (305, 312, 313) may include a first camera device (305) disposed on a first side (310A) of the electronic device (101), a second camera device (312) disposed on a second side (310B), and / or a flash (313). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (101).

[0070] In one embodiment, the key input device (317) may be disposed on a side surface (310C) of the housing (310). In another embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (317), and the key input devices (317) that are not included may be implemented in other forms, such as soft keys, on the display (301). In some embodiments, the key input device may include a sensor module (316) disposed on a second surface (310B) of the housing (310).

[0071] In one embodiment, the light-emitting element (306) may be disposed, for example, on the first surface (310A) of the housing (310). The light-emitting element (306) may provide, for example, status information of the electronic device (101) in the form of light. In another embodiment, the light-emitting element (306) may provide, for example, a light source that is linked to the operation of the camera module (305). The light-emitting element (306) may include, for example, an LED, an IR LED, and a xenon lamp.

[0072] The connector holes (308, 309) may include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (309) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0073] FIG. 4 is an exploded perspective view of an electronic device (101) according to various embodiments of the present disclosure.

[0074] Referring to FIG. 4, the electronic device (101) (e.g., the electronic device (101) of FIGS. 1 to 4) may include a side bezel structure (331), a first support member (332) (e.g., a bracket), a front plate (320), a display (330), a printed circuit board (340), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380). In some embodiments, the electronic device (101) may omit at least one of the components (e.g., the first support member (332) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be the same as or similar to at least one of the components of the electronic device (101) of FIG. 4 or FIG. 5, and any redundant description thereof will be omitted below.

[0075] According to one embodiment, the first support member (332) may be disposed inside the electronic device (101) and connected to the side bezel structure (331), or may be formed integrally with the side bezel structure (331). The first support member (332) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (332) may have a display (330) coupled to one surface and a printed circuit board (340) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0076] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0077] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0078] According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (340). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0079] In one embodiment, the antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (331) and / or the first support member (332).

[0080] According to various embodiments of the present disclosure, an electronic device may include a plurality of antenna modules (390). For example, some of the plurality of antenna modules (390) may be implemented to transmit and receive radio waves (tentatively referred to as radio waves of frequency bands A and B) having different characteristics for MIMO implementation. As another example, some of the plurality of antenna modules (390) may be configured to simultaneously transmit and receive radio waves (tentatively referred to as radio waves of frequencies A1 and A2 in frequency band A) having the same characteristics for diversity implementation. As yet another example, other some of the plurality of antenna modules (390) may be configured to simultaneously transmit and receive radio waves (tentatively referred to as radio waves of frequencies B1 and B2 in frequency band B) having the same characteristics for diversity implementation. In one embodiment of the present invention, the electronic device (101) may include two antenna modules, but in another embodiment of the present invention, the electronic device (101) may include four antenna modules, thereby simultaneously implementing MIMO and diversity. In another embodiment, the electronic device (101) may include only one antenna module (390).

[0081] According to one embodiment, when one antenna module is placed at a first position of the printed circuit board (340), considering the transmission and reception characteristics of radio waves, another antenna module may be placed at a second position separated from the first position of the printed circuit board (340). As another example, one antenna module and another antenna module may be placed considering a mutual separation distance according to diversity characteristics.

[0082] According to one embodiment, at least one antenna module (390) may include a wireless communication circuit that processes radio waves transmitted and received in an ultra-high frequency band (e.g., 6 GHz or more and 300 GHz or less). The conductive plate (e.g., the conductive plate(s) (821) of FIG. 7A) of the at least one antenna module (390) may be formed of, for example, a patch-type radiation conductor or a conductive plate having a dipole structure extending in one direction, and a plurality of the conductive plates may be arrayed to form an antenna array. A chip (e.g., an integrated circuit chip) or the like, in which a part of the wireless communication circuit is implemented, may be placed on one side of an area where the conductive plate is placed or on a side facing the opposite direction to a side where the conductive plate is placed, and may be electrically connected to the conductive plate through a wiring formed of a printed circuit pattern.

[0083] FIG. 5 is a block diagram (400) of an electronic device (101) in a network environment including multiple cellular networks according to various embodiments.

[0084] Referring to FIG. 5, the electronic device (101) may include a first communication processor (412), a second communication processor (414), a first radio frequency integrated circuit (RFIC) (422), a second RFIC (424), a third RFIC (426), a fourth RFIC (428), a first radio frequency front end (RFFE) (432), a second RFFE (434), a first antenna module (442), a second antenna module (444), and an antenna (448). The electronic device (101) may further include a processor (120) and a memory (130). The second network (199) may include a first cellular network (492) and a second cellular network (494). In another embodiment, the electronic device (101) may further include at least one of the components described in FIG. 2, and the second network (199) may further include at least one other network. In one embodiment, the first communication processor (412), the second communication processor (414), the first RFIC (422), the second RFIC (424), the fourth RFIC (428), the first RFFE (432), and the second RFFE (434) may form at least a portion of the wireless communication module (192). In another embodiment, the fourth RFIC (428) may be omitted or may be included as a part of the third RFIC (426).

[0085] According to various embodiments, the first communication processor (412) may support establishment of a communication channel in a band to be used for wireless communication with the first cellular network (492), and legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (4G), 3G, 4G, or long term evolution (LTE) network. The second communication processor (414) may support establishment of a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network (494), and 5G network communication through the established communication channel. According to various embodiments, the second cellular network (494) may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor (412) or the second communication processor (414) may establish a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network (494), and support 5G network communication through the established communication channel. According to one embodiment, the first communication processor (412) and the second communication processor (414) may be implemented in a single chip or a single package. According to various embodiments, the first communication processor (412) or the second communication processor (414) may be formed in a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0086] According to one embodiment, the first RFIC (422) may, upon transmission, convert a baseband signal generated by the first communication processor (412) into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network (492) (e.g., a legacy network). Upon reception, the RF signal may be acquired from the first cellular network (492) (e.g., a legacy network) via an antenna (e.g., the first antenna module (442)) and preprocessed via an RFFE (e.g., the first RFFE (432)). The first RFIC (422) may convert the preprocessed RF signal into a baseband signal so that it may be processed by the first communication processor (412).

[0087] According to one embodiment, the second RFIC (424) may, upon transmission, convert a baseband signal generated by the first communication processor (412) or the second communication processor (414) into an RF signal (hereinafter, a 5G Sub6 RF signal) of a Sub6 band (e.g., about 6 GHz or less) used in the second cellular network (494) (e.g., a 5G network). Upon reception, the 5G Sub6 RF signal may be acquired from the second cellular network (494) (e.g., the 5G network) via an antenna (e.g., the second antenna module (444)) and preprocessed via an RFFE (e.g., the second RFFE (434)). The second RFIC (424) may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that the preprocessed 5G Sub6 RF signal may be processed by a corresponding communication processor among the first communication processor (412) or the second communication processor (414).

[0088] According to one embodiment, the third RFIC (426) may convert a baseband signal generated by the second communication processor (414) into an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network (494) (e.g., 5G network). Upon reception, the 5G Above6 RF signal may be acquired from the second cellular network (494) (e.g., 5G network) via an antenna (e.g., antenna (448)) and preprocessed via the third RFFE (436). The third RFIC (426) may convert the preprocessed 5G Above6 RF signal into a baseband signal so that it may be processed by the second communication processor (414). In one embodiment, the third RFFE (436) may be formed as part of the third RFIC (426).

[0089] According to one embodiment, the electronic device (101) may include a fourth RFIC (428), separately from or at least as a part of the third RFIC (426), according to one embodiment. In this case, the fourth RFIC (428) may convert a baseband signal generated by the second communication processor (414) into an RF signal (hereinafter, referred to as an IF signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (426). The third RFIC (426) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second cellular network (494) (e.g., a 5G network) via an antenna (e.g., antenna (448)) and converted into an IF signal by the third RFIC (426). The fourth RFIC (428) can convert the IF signal into a baseband signal for processing by the second communication processor (414).

[0090] According to one embodiment, the first RFIC (422) and the second RFIC (424) may be implemented as a single chip or at least a portion of a single package. According to one embodiment, the first RFFE (432) and the second RFFE (434) may be implemented as a single chip or at least a portion of a single package. According to one embodiment, at least one antenna module of the first antenna module (442) or the second antenna module (444) may be omitted or combined with another antenna module to process RF signals of a corresponding plurality of bands.

[0091] In one embodiment, the third RFIC (426) and the antenna (448) may be disposed on the same substrate to form a third antenna module (446). For example, the wireless communication module (192) or the processor (120) may be disposed on the first substrate (e.g., the main PCB). In this case, the third RFIC (426) may be disposed on a portion (e.g., the bottom surface) of a second substrate (e.g., the sub PCB) separate from the first substrate, and the antenna (448) may be disposed on another portion (e.g., the top surface) of the second substrate, thereby forming the third antenna module (446). By disposing the third RFIC (426) and the antenna (448) on the same substrate, it is possible to reduce the length of the transmission line therebetween. This can reduce, for example, the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communications due to transmission line transmission. As a result, the electronic device (101) can improve the quality or speed of communication with the second cellular network (494) (e.g., the 5G network).

[0092] In one embodiment, the antenna (448) may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC (426) may include a plurality of phase shifters (438) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (436). Upon transmission, each of the plurality of phase shifters (438) may shift the phase of a 5G Above6 RF signal to be transmitted to an external source (e.g., a base station of a 5G network) of the electronic device (101) via its corresponding antenna element. Upon reception, each of the plurality of phase shifters (438) may shift the phase of a 5G Above6 RF signal received from the external source via its corresponding antenna element to the same or substantially the same phase. This enables transmission or reception via beamforming between the electronic device (101) and the external source.

[0093] According to various embodiments, the second cellular network (494) (e.g., a 5G network) may operate independently (e.g., Stand-Alone (SA)) or in connection with (e.g., Non-Stand Alone (NSA)) the first cellular network (492) (e.g., a legacy network). For example, the 5G network may only have an access network (e.g., a 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In such a case, the electronic device (101) may access an external network (e.g., the Internet) under the control of the core network (e.g., evolved packed core (EPC)) of the legacy network after accessing the access network of the 5G network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) may be stored in the memory (430) and accessed by other components (e.g., the processor (120), the first communication processor (412), or the second communication processor (414)).

[0094] FIGS. 6A to 6D illustrate one embodiment of the structure of the electronic device (101) illustrated in FIG. 5 according to various embodiments of the present disclosure.

[0095] Referring to FIGS. 6A to 6D, the electronic device (101) may include a housing (310) including a first plate (520) (e.g., a front plate), a second plate (530) (e.g., a rear plate or rear glass) spaced apart from the first plate (520) and facing in an opposite direction, and a side member (540) surrounding a space between the first plate (520) and the second plate (530).

[0096] In one embodiment, the first plate (520) may include a transparent material including a glass plate. The second plate (530) may include a non-conductive and / or conductive material. And, the side member (540) may include a conductive material and / or a non-conductive material. In some embodiments, at least a portion of the side member (540) may be formed integrally with the second plate (530). In the illustrated embodiment, the side member (540) may include first to third insulating portions (541, 543, and 545) and first to third conductive portions (551, 553, and 555).

[0097] According to one embodiment, the electronic device (101) may include a display, a main printed circuit board (PCB) (571), and / or a mid-plate (not shown) arranged to be visible through the first plate (520) within the space, and may optionally further include various other components.

[0098] According to one embodiment, the electronic device (101) may include a first legacy antenna (551), a second legacy antenna (553), and a third legacy antenna (555) within the space and / or in a portion of the housing (310) (e.g., the side member (540)). The first to third legacy antennas (551 to 555) may be used for, for example, cellular communication (e.g., second generation (2G), 3G, 4G, or LTE), short-range communication (e.g., WiFi, Bluetooth, or NFC), and / or global navigation satellite system (GNSS).

[0099] According to one embodiment, the electronic device (101) may include a first antenna module (561), a second antenna module (563), and a third antenna module (565) for forming a directional beam. The antenna modules (561, 563, and 565) may be used for 5G network communication (e.g., the second cellular network (494) of FIG. 5), mmWave communication, 60 GHz communication, or WiGig communication. The antenna modules (561 to 565) may be arranged within the space so as to be spaced apart from a metal member (e.g., the housing (310), the internal component (573), and / or the first to third legacy antennas (551 to 555)) of the electronic device (101) by a predetermined distance or more.

[0100] In the illustrated embodiment, the first antenna module (561) may be positioned at the upper left (-Y-axis), the second antenna module (563) may be positioned at the upper middle (X-side), and the third antenna module (565) may be positioned at the middle (right (Y-axis). In another embodiment, the electronic device (101) may include additional antenna modules at additional locations (e.g., at the lower middle (-X-axis)) or some of the first to third antenna modules (561 to 565) may be omitted. According to one embodiment, the first to third antenna modules (561 to 565) may be electrically connected to at least one communication processor (e.g., the processor (120) of FIG. 5) on the main PCB (571) using a conductive line (581) (e.g., a coaxial cable or an FPCB).

[0101] Referring to FIG. 6b, which illustrates a cross-section based on the A-A' axis of FIG. 6a, a part of the antenna array of the first antenna module (561) (e.g., a patch antenna array) may be arranged to radiate toward the second plate (530), and another part (e.g., a dipole antenna array) may be arranged to radiate through the first insulating portion (541). Referring to FIG. 6c, which illustrates a cross-section based on the B-B' axis of FIG. 6a, a part of the radiator of the second antenna module (563) (e.g., a patch antenna array) may be arranged to radiate toward the second plate (530), and another part (e.g., a dipole antenna array) may be arranged to radiate through the second insulating portion (543).

[0102] In the illustrated embodiment, the second antenna module (563) may include a plurality of printed circuit boards. For example, a portion of the antenna array (e.g., a patch antenna array) and another portion (e.g., a dipole antenna array) may be located on different printed circuit boards. In one embodiment, the printed circuit boards may be connected via a flexible printed circuit board. The flexible printed circuit board may be arranged around an electrical component (573) (e.g., a receiver, a speaker, a sensor, a camera, an ear jack, or a button).

[0103] Referring to FIG. 6d, which illustrates a cross-section based on the C-C' axis of FIG. 6a, the third antenna module (565) may be arranged toward the side member (540) of the housing (310). A portion of the antenna array of the third antenna module (565) (e.g., a dipole antenna array) may be arranged to radiate toward the second plate (530), and another portion (e.g., a patch antenna array) may be arranged to radiate through the third insulating portion (545).

[0104] FIG. 7 illustrates an example of the structure of the third antenna module (446) described with reference to FIG. 5, according to various embodiments of the present disclosure. (a) of FIG. 7 is a perspective view of the third antenna module (446) as viewed from one side, and (b) of FIG. 7 is a perspective view of the third antenna module (446) as viewed from the other side. (c) of FIG. 7 is a cross-sectional view of the third antenna module (446) taken along line A-A'.

[0105] Referring to FIG. 7, in one embodiment, the third antenna module (446) may include a printed circuit board (610), an antenna array (630), a radio frequency integrate circuit (RFIC) (652), a power manage integrate circuit (PMIC) (654), and a module interface (670). Optionally, the third antenna module (446) may further include a shielding member (690). In other embodiments, at least one of the above-mentioned components may be omitted, or at least two of the above-mentioned components may be formed integrally.

[0106] According to one embodiment, the printed circuit board (610) may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board (610) may provide electrical connections between various electronic components arranged on the printed circuit board (610) and / or externally using wires and conductive vias formed on the conductive layers.

[0107] According to one embodiment, the antenna array (630) (e.g., antenna (448) of FIG. 4) may include a plurality of antenna elements (632, 634, 636, or 638) arranged to form a directional beam. The antenna elements may be formed on a first surface of the printed circuit board (610), as illustrated. According to another embodiment, the antenna array (630) may be formed within the printed circuit board (610). According to embodiments, the antenna array (630) may include a plurality of antenna arrays of the same or different shapes or types (e.g., dipole antenna arrays, and / or patch antenna arrays).

[0108] According to one embodiment, the RFIC (652) (e.g., the third RFIC (426) of FIG. 4) may be disposed on another area of ​​the printed circuit board (610) (e.g., a second side opposite the first side) that is spaced apart from the antenna array. The RFIC is configured to process a signal of a selected frequency band transmitted / received through the antenna array (630). According to one embodiment, the RFIC (652) may, upon transmission, convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band. Upon reception, the RFIC (652) may convert an RF signal received through the antenna array (652) into a baseband signal and transmit the converted signal to the communication processor.

[0109] According to another embodiment, the RFIC (652) may, upon transmission, up-convert an IF signal (e.g., about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (e.g., 428 of FIG. 4) to an RF signal of a selected band. Upon reception, the RFIC (652) may down-convert an RF signal obtained through an antenna array (652) to an IF signal and transmit the down-converted signal to the IFIC.

[0110] According to one embodiment, the PMIC (654) may be placed on another portion of the printed circuit board (610) (e.g., the second surface) that is spaced apart from the antenna array. The PMIC may receive voltage from the main PCB (not shown) to provide power required for various components (e.g., RFIC (652)) on the antenna module.

[0111] In one embodiment, a shielding member (690) may be disposed on a portion of the printed circuit board (610) (e.g., the second surface) to electromagnetically shield at least one of the RFIC (652) or the PMIC (654). In one embodiment, the shielding member (690) may include a shield can.

[0112] Although not shown, in various embodiments, the third antenna module (446) may be electrically connected to another printed circuit board (e.g., a main circuit board) via a module interface. The module interface may include a connecting member, for example, a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB). Through the connecting member, the RFIC (652) and / or PMIC (654) of the antenna module may be electrically connected to the printed circuit board.

[0113] FIG. 8 is a cross-sectional view illustrating a cross-section of an antenna module (800) according to various embodiments of the present disclosure.

[0114] Referring to FIG. 8, the printed circuit board (510) may include an antenna layer (711) and a network layer (713).

[0115] According to various embodiments, the antenna layer (711) may include at least one dielectric layer (737-1), and an antenna element (736) and / or a feed portion (725) formed on or within an outer surface of the dielectric layer (737-1). The feed portion (725) may include a feed point (727) and / or a feed line (729).

[0116] According to various embodiments, the network layer (713) may include at least one dielectric layer (737-2), and at least one ground layer (733), at least one conductive via (735), a transmission line (723), and / or a signal line (729) formed on or within an outer surface of the dielectric layer (737-2).

[0117] According to various embodiments, the third RFIC (426) (e.g., the third RFIC (426) of FIG. 5) may be electrically connected to the network layer (713) via, for example, first and second solder bumps (740-1, 540-2). In other embodiments, various connection structures (e.g., solder or BGA) may be used instead of the connectors. The third RFIC (426) may be electrically connected to the antenna element (736) via the first connector (740-1), the transmission line (723), and the feeder (725). The third RFIC (426) may also be electrically connected to the ground layer (733) via the second connector (740-2) and the conductive via (735). Although not shown, the third RFIC (426) may be electrically connected to the above-mentioned module interface via the signal line (729).

[0118] FIG. 9A is a top view of an antenna module (800) disposed within an electronic device according to various embodiments of the present disclosure. FIG. 9B is a side view of an antenna module (800) according to various embodiments of the present disclosure.

[0119] Referring to FIGS. 9A and 9B, an antenna module (800) may be positioned in an internal space of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 5). The antenna module (800) of FIGS. 9A and 9B may have a configuration that is partially or entirely identical to the antenna module (390) of FIG. 4, at least one of the first, second, and third antenna modules (442, 444, 446) of FIG. 5, and an antenna configuration disposed on a printed circuit board (510) of FIG. 6.

[0120] The above antenna module (800) may include a substrate (810) formed of a plurality of conductive layers, an antenna radiator disposed on one surface or the inner side of the substrate (810), a wireless communication circuit (840) facing the substrate (810) and electrically connected thereto, and a bridge circuit board (850).

[0121] According to various embodiments, the antenna module (800) may include a first surface (801) and a second surface (802) facing in an opposite direction to the first surface (801). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (850) are sequentially stacked based on a plurality of conductive layers constituting the substrate portion (810). When the substrate portion (810) is stacked from a first layer, which is the lowest layer, to an n-th layer, an outer surface of the n-th layer may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0122] According to various embodiments, the conductive layers constituting the substrate portion (810) may form a build-up layer whose area decreases toward the upper layer. For example, the substrate portion (810) may include a first layer (811) forming the lowermost layer and having a first area, and a second layer (812) having a smaller area than the first layer and laminated on the first layer (811).

[0123] According to another embodiment, the substrate portion (810) may include a first layer (811) forming the lowermost layer and having a first area, a third layer (813) having a third area smaller than the first area and laminated on the first layer (811), and a second layer (812) having a second area smaller than the third area and laminated on the third layer (813). However, the number of laminated conductive layers of the substrate portion (810) is not limited to two or three layers, and may be designed to have four or more multiple layers.

[0124] According to various embodiments, the antenna radiator may include at least one first conductive element (820) or at least one second conductive element (830). The first conductive element (820) and the second conductive element (830) may include antenna types having various structures. For example, the first conductive element (820) may be a patch type antenna, and the second conductive element (830) may be a dipole type antenna. As another example, the first conductive element (820) may be a dipole type antenna, and the second conductive element (830) may be a dipole type antenna.

[0125] According to one embodiment, the first conductive element (820) and the second conductive element (830) may be disposed on the substrate portion (810). For example, the first conductive element (820) may be disposed on the second layer (812) of the substrate portion (810) in which three conductive layers are laminated, and the second conductive element (830) may be disposed on the first layer (811). Since the antenna radiator is not disposed on the third layer (813) disposed between the first layer (811) and the second layer (812), a separation distance between the first conductive element (820) and the second conductive element (830) can be secured, and a radiation utilization area of ​​the second conductive element (830) that radiates toward a side area can be provided.

[0126] According to various embodiments, the first conductive element (820) may be disposed on the front surface (e.g., the first surface (801)) of the antenna module (800) or on the inside of the antenna module (800). The first conductive element (820) may include at least one conductive plate(s) (821). The conductive plate(s) (821) may be formed of, for example, a patch-type radiation conductor. When the conductive plate(s) are formed in plurality, the plurality of conductive plates(es) may be arrayed to form a designated pattern to form an antenna array. A chip (e.g., an integrated circuit chip) or the like, in which a portion of the wireless communication circuit (840) is implemented, may be disposed on one side of an area where the conductive plate(s) (821) is disposed or on a surface facing in an opposite direction to the surface where the conductive plate(s) (821) is disposed.

[0127] According to one embodiment, the conductive plate(s) (821) are disposed on one surface of a conductive layer (e.g., the second layer (812)) forming the uppermost layer on the substrate portion (810) and are formed to protrude with a certain thickness, but are not limited thereto, and may be manufactured in the form of a thin plate on the one surface, or may be formed to be disposed within an opened conductive layer so as not to protrude from the outer surface of the substrate portion.

[0128] According to one embodiment, the conductive plate(s) (821) may be electrically connected to a feeding portion (not shown) of a circuit board (e.g., a printed circuit board (340) of FIG. 4) to transmit and receive a high-frequency signal in at least one frequency band. For example, the feeding portion may be electrically connected to the plurality of conductive plate(s) (821) to supply a high-frequency signal (RF signal) by applying a signal current, or may receive another high-frequency signal received through the conductive plate(s) (821).

[0129] The second conductive element (830) may be disposed between the first surface (801) and the second surface (802) of the antenna module (800), and may be disposed to face a different direction from the direction in which the first conductive element (820) faces. The second conductive element (830) may include at least one conductive conductor. The conductive conductor may be formed, for example, of a radiating conductor having a dipole structure extending in one direction. When the radiating conductor is formed in multiple pieces, the multiple radiating conductors may be arranged to form a designated pattern to form an antenna array.

[0130] According to one embodiment, the radiating conductor of the second conductive element (830) is electrically connected to a feeding portion (not shown) of a circuit board (e.g., a printed circuit board (340) of FIG. 4) to transmit and receive high-frequency signals in at least one frequency band.

[0131] According to various embodiments, the wireless communication circuit (840) is electrically connected to the antenna module (800) and can receive a communication signal having a designated frequency through a radio frequency (RF) transceiver or transmit the received communication signal to the wireless transceiver. The wireless communication circuit (840) may include the configuration of the third RFIC (426) of FIG. 5. For example, the wireless communication circuit (840) may perform wireless communication using the first conductive element (820) or the second conductive element (830) under the control of a processor (e.g., the processor (120) of FIG. 5). In another embodiment, the wireless communication circuit (840) may receive a control signal and power from the processor (120) and the power management module (e.g., the power management module (188) of FIG. 1) to process a communication signal received from the outside or a communication signal to be transmitted to the outside. For example, the wireless communication circuit (840) may include a switch circuit that separates transmission and reception signals, various amplifiers or filter circuits for improving the quality of transmission and reception signals, etc.

[0132] According to one embodiment, if a plurality of the conductive plate(s) or radiating conductors form an antenna array, the wireless communication circuit (840) can control the pointing direction of the communication device, for example, the electronic device (101), by including a phase shifter connected to each conductive plate or radiating conductor. For example, if the communication device includes an antenna array, the wireless communication circuit (840) can control the pointing direction of the communication device or the electronic device (for example, the electronic device (101) of FIG. 1) equipped with the communication device by providing phase-shifted feeding to each radiating conductor. Such phase-shifted feeding can be useful for securing an optimal or good communication environment in a communication method with strong linearity, such as millimeter wave communication (for example, wireless communication using a frequency band of 6 GHz or more and 300 GHz or less).

[0133] According to one embodiment, the wireless communication circuit (840) may be stacked and arranged on the rear surface of the substrate (810). A shielding member (not shown) may be arranged around the wireless communication circuit (840) to shield the wireless communication circuit (840). The shielding member may shield EMI and provide a path for heat generated from the wireless communication circuit (840) to be transferred to a bracket (e.g., bracket (332) of FIG. 11) or a heat dissipation member (e.g., heat dissipation member (920, or 730) of FIGS. 10a and 10b). The configuration arranged to surround the wireless communication circuit (840) may be designed in various ways for EMI shielding and / or efficient heat conduction, in addition to the shielding member.

[0134] According to various embodiments, the antenna module (800) may include a bridge circuit board (850) connected to the wireless communication circuit (840). The bridge circuit board (850) includes a first region (850a) and a second region (850b) extending from the first region (850a) through the bridge region, and a substrate portion (810) and a wireless communication circuit (840) may be disposed on the first region (850a). A connector (e.g., a coaxial cable connector or a B-to-B (board to board)) (851) for connecting a signal of the wireless communication circuit (840) to a main circuit board (e.g., a printed circuit board (340) of FIG. 4) may be included on the second region (850b). The substrate portion (810) and the wireless communication circuit (840) arranged in the first region (850a) may be arranged in opposite directions to the connector (851) arranged in the second region (850b).

[0135] According to one embodiment, the bridge circuit board (850) is connected to a main circuit board (e.g., printed circuit board (340) of FIG. 4) on which a wireless communication module (e.g., wireless communication module (192) of FIG. 5) is arranged, for example, by a coaxial cable connector, and the coaxial cable can be used to transmit and receive IF signals or RF signals. As another example, power or other control signals can be transmitted via a B-to-B connector.

[0136] FIG. 10A is a perspective view showing an antenna module (800) mounted in an antenna housing (910) according to various embodiments of the present disclosure. FIG. 10B is an exploded perspective view showing an antenna module (800) and a heat dissipation member (920, or 730) before being mounted in an antenna housing (910) according to various embodiments of the present disclosure.

[0137] Referring to FIGS. 10A and 10B, an antenna module (800) may be positioned in an internal space of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 5), and the antenna module (800) may be modularly mounted within the electronic device (101) and may be mounted within an antenna housing (910) to provide a radiation area in a specified direction.

[0138] According to various embodiments, the electronic device (101) may include an antenna module (800), an antenna housing (910) in which the antenna module (800) is mounted, and a heat dissipation member (920, or 930) disposed between the antenna housing (910) and the antenna module or on one side of the antenna housing (910).

[0139] According to various embodiments, the antenna module (800) may include a substrate portion (810), first and second conductive elements (820, 830), and a wireless communication circuit (840). The configuration of the substrate portion (810), the first and second conductive elements (820, 830), and the wireless communication circuit (840) of the antenna module (800) of FIGS. 10a and 10b may be applied to the configuration of the substrate portion (810), the first and second conductive elements (820, 830), and the wireless communication circuit (840) of the antenna module (800) of FIGS. 9a and 9b.

[0140] According to various embodiments, the antenna housing (910) can be fixed to the inside of the electronic device (101) with the antenna module (800) mounted thereon. The antenna housing (910) can include at least one fixing member (e.g., a hook, a screw, etc.) to be fixed to the inside of the electronic device (101). However, the shape for fixing the antenna housing (910) to the electronic device is not limited, and the antenna housing (910) can be fixed to one surface that comes into contact with the electronic device (101) through an adhesive sheet such as bonding or tape.

[0141] According to one embodiment, the antenna housing (910) may be formed as an integral injection-molded product and may include a fixing surface (911) facing one side of the electronic device (101), a fixing surface (912) on which the antenna module (800) is fixed, or a connecting member (913) for fixing the fixed antenna module (800). The fixing surface (911) may be a surface that comes into contact with the inside of the electronic device (101) and may support the antenna housing (910). The fixing surface (912) may be provided in an inwardly fine groove shape and may have a designated incline. Accordingly, at least a portion of the antenna module (800) may be inserted and placed at the same time with an incline in a designated direction. The connecting member (913) may be provided in a protruding form on both sides of the fixing surface (912) so as to fit and connect both ends of the antenna module (800) placed on the fixing surface. For example, the above-mentioned connecting member (913) is provided in a hook shape and can be connected to both ends of the first layer (811) of the antenna module (800).

[0142] According to one embodiment, an opening (914) may be provided on one side of the mounting surface (912) of the antenna housing (910) to provide a passage through which a bridge circuit board (e.g., a bridge circuit board (850) of FIG. 7B) of the antenna module (800) extends. As another example, the antenna housing (910) may be formed of a heat-dissipating material for self-heat dissipation. For example, the antenna housing (910) may be manufactured by including a material with high thermal conductivity, such as copper (Cu), aluminum (Al), or gold (Au). As another example, the antenna housing (910) may be plated with the metal material with high thermal conductivity, or may be implemented by insert-molding the metal material. However, the structure for heat dissipation of the antenna module (800) is not limited thereto, and the antenna housing (910) may be formed of a printed circuit board, and the printed circuit board may include micro holes that can transmit heat emitted from the antenna module (800).

[0143] According to various embodiments, a heat dissipation member (920, or 930) may be disposed on one side of the antenna housing (910) to guide the diffusion of heat emitted from the antenna module (800). The heat dissipation member (920, or 930) may include a first heat dissipation member (920) and a second heat dissipation member (930).

[0144] According to one embodiment, the first heat dissipation member (920) may be disposed between the antenna housing (910) and the antenna module (800) to dissipate heat generated from the antenna module (800). For example, the first heat dissipation member (920) may be in the shape of a sheet provided in a size corresponding to the mounting surface (912). The sheet-shaped first heat dissipation member (920) may be manufactured by including a material having high thermal conductivity, such as copper (Cu), aluminum (Al), or gold (Au), or may include a heat-conducting PC material or graphite material. As another example, the first heat dissipation member (920) may include a heat-conducting member, such as a thermal interface material tape or a heat pipe.

[0145] According to one embodiment, the first heat dissipation member (920) disposed on the mounting surface (912) may be disposed to face the wireless communication circuit (840), and thus, heat generated from the wireless communication circuit (840) may be quickly conducted to the first heat dissipation member (920) to provide an efficient heat dissipation effect. As another example, the first heat dissipation member (920) may block heat generated from the substrate portion (810) or may block heat generated from the wireless communication circuit (840) from being transferred to a display (e.g., the display (330) of FIG. 4).

[0146] According to one embodiment, the second heat dissipation member (930) may be disposed between the antenna housing (910) and the electronic device (101) to dissipate heat generated from the antenna module (800). For example, the second heat dissipation member (930) may be in the shape of a sheet provided in a size corresponding to the fixing surface (911). The second heat dissipation member (930) in the shape of a sheet may be manufactured by including a material having high thermal conductivity, such as copper (Cu), aluminum (Al), or gold (Au), or may include a heat-conducting PC material or graphite material. As another example, the first heat dissipation member (920) may include a heat-conducting member, such as a tim tape or a heat pipe.

[0147] According to one embodiment, the second heat dissipation member (930) disposed on the fixed surface (911) may be disposed adjacent to the wireless communication circuit (840) and may quickly conduct heat that was not dissipated by the first heat dissipation member (920) to efficiently dissipate heat. As another example, the second heat dissipation member (930) may be disposed adjacent to and facing the display (330) to block heat generated from the substrate (810) or block heat generated from the wireless communication circuit (840) from being transferred to the display (330).

[0148] FIG. 11 is a cross-sectional view showing the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to various embodiments of the present disclosure. FIG. 12 is a top view of the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to various embodiments of the present disclosure.

[0149] In FIG. 11, 'X' of the two-axis orthogonal coordinate system may mean the length direction of the electronic device (101), and 'Z' may mean the thickness direction of the electronic device (101). In addition, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z).

[0150] Referring to FIGS. 11 and 12, the electronic device (101) may include a housing (310), a display (330), an antenna module (800), and an antenna housing (910). The configuration of the housing (310) and the display (330) of FIGS. 11 and 12 may be partially or entirely identical to the configuration of the housing (310) and the display (330) of FIGS. 2 to 4, and the configuration of the antenna module (800) and the antenna housing (910) of FIGS. 11 and 12 may be partially or entirely identical to the configuration of the antenna module (800) and the antenna housing (910) of FIGS. 8 to 9B.

[0151] According to various embodiments, the housing (310) may include a front plate (302) facing in a first direction (+Z), a rear plate (311) facing in a second direction (-Z) opposite to the first direction (+Z), and a side member (333) surrounding a space (S) between the front plate (302) and the rear plate (311), at least a portion of which is formed of a metal material.

[0152] According to one embodiment, the front plate (302) may include a transparent member, and the transparent member may include an active area (P1) (e.g., a first portion) that substantially provides images and / or moving images to a user through a display (330), and an inactive area (P2) extending from the active area (P1) to an edge of the transparent member. At least a portion of the display (330) may be arranged in a flat state under the active area (P1) of the transparent member, and at least a portion of the display (330) may be arranged in a flat or bent state under the inactive area (P2). An opaque, non-conductive material may be applied under the inactive area (P2) so that internal electronic components, signal lines, or circuit lines are not exposed to the outside. At least a portion of the inactive area (P2) may include a radiating area of ​​the antenna module (800). As another example, at least a portion (e.g., an edge area) of the rear plate (311) may include a radiating area of ​​the antenna module (800).

[0153] According to one embodiment, the side member (333) may include a side bezel structure (331) and a bracket (332) extending inwardly from the side bezel structure (331). At least a portion of the side bezel structure (331) may be formed of a metallic material, and the bracket (332) may provide a space (S) in which the antenna housing (910) on which the antenna module (800) is mounted is seated, and may be formed of a non-metallic material. At least a portion of the bracket (332) formed of the non-metallic material may be a radiation area of ​​the antenna module (800).

[0154] According to various embodiments, the display (e.g., an (active) organic light emitting diode) (330) may be exposed through a first portion (e.g., an active region (P1)) of the front plate (302) and may include a display element layer including at least one pixel(s) and a TFT layer connected to the display element layer. According to one embodiment, an optical member and / or a touch sensor panel may be mounted between the front plate (302) and the display element layer or inside the display element layer. For example, the display (330) may be utilized as an output device that outputs a screen and an input device equipped with a touch screen function. If the display (330) has a touch screen function, an indium-tin oxide (ITO) film for detecting a user's contact position, etc. may also correspond to the touch sensor panel. As another example, a dielectric layer (not shown) may be disposed between the display element layer and / or the touch sensor panel, and the display A substrate may be disposed on the back of the element layer. According to one embodiment, a dielectric layer (335) may be disposed between the front plate (302) and the display (330). The dielectric layer (335) may be disposed in contact with the front plate (302) and may include, for example, silicon, air, foam, membrane, optical clear adhesive (OCA), sponge, rubber, ink, or polymer (PC, PET).

[0155] According to various embodiments, an antenna module (800) and an antenna housing (910) may be arranged in the internal space (S) of the bracket (332). The antenna module (800) may include a first surface (801) facing a third direction (T1) forming an acute angle with the second direction (-Z) and a second surface (e.g., the second surface (802) of FIG. 7B) facing a fourth direction (T2) opposite to the third direction (T1). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (850) are sequentially stacked based on a plurality of conductive layers constituting the substrate portion (810). When the above substrate portion (810) is laminated from the first layer (811), which is the lowest layer, to the second layer (812), which is the highest layer, the outer surface of the second layer may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0156] According to one embodiment, the areas of the conductive layers constituting the substrate portion (810) may be different from each other. For example, the first layer (811) may have a first area, and the second layer (812) may have a second area smaller than the first area, and may be disposed on the first layer (811). The central portion of the second layer (812) may be disposed closer to the back plate (311) than the central portion of the first layer (811). As another example, the third layer (813) may have a larger second area and a smaller first area, and may be laminated between the first layer (812) and the second layer (812). The central portion of the third layer (813) may be disposed closer to the back plate (311) than the central portion of the first layer (811).

[0157] According to various embodiments, the antenna module (800) may include the antenna radiator, and the antenna radiator may include at least one first conductive element (820) and at least one second conductive element (830). For example, the at least one first conductive element (820) may be a patch type antenna, and the at least one second conductive element (830) may be a dipole type antenna.

[0158] According to one embodiment, the first conductive element (820) may be arranged to face the third direction (T1) on the first surface (801) of the antenna module (800), or may be arranged to face the third direction (T1) within the antenna module (800). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the rear plate (311). The first radiation area (S1) in which the first conductive element (820) transmits or receives a high-frequency signal may be an area that extends up, down, left, or right to a specified range based on the third direction (T1), and may form a specified first angle (θ1) when viewed in cross section. The first radiation area (S1) may include a portion of a rear plate (311) made of a non-metallic material and an edge area of ​​a bracket (332), and the specified first angle (θ1) may be variable. For example, the wireless communication circuit (840) may include a phase shifter connected to the first conductive element (820) and control the orientation direction of the first conductive element (820).

[0159] According to one embodiment, the second conductive element (830) may be disposed between the first surface (801) and the second surface (802) of the antenna module (800), adjacent to the side member (333) (e.g., the side of the bracket (332)). The second conductive element (830) may be disposed to extend in a fifth direction (T3) that is different from the third direction (T1) and the fourth direction (T2), and that is directed between the active area (P1) (e.g., the first portion) of the front plate (302) and the side member (e.g., the side of the bracket (332)). For example, the fifth direction (T3) may be a direction from an end of the first layer (811) toward the inactive area (P2) of the front plate (302). As another example, the fifth direction (T3) may be substantially perpendicular to the third direction (T1).

[0160] According to one embodiment, the second conductive element (830) can transmit or receive a high-frequency signal through a portion of the front plate (302). The second radiation area (S2) through which the first conductive element (820) transmits or receives a high-frequency signal may be an area extending up, down, left, or right to a designated range with respect to the fifth direction (T3), and may form a designated second angle (θ2) when viewed in cross-section. The second radiation area (S2) may include a portion of the front plate (302) made of a non-metallic material and an edge area of ​​the bracket (332), and the designated second angle (θ2) may be variable. For example, the wireless communication circuit (840) may include a phase shifter connected to the second conductive element (830) and control the orientation direction of the second conductive element (830).

[0161] According to various embodiments, the antenna module (800) may include a bridge circuit board (850) connected to the wireless communication circuit (840). The bridge circuit board (850) includes a connector (e.g., connector (851) of FIG. 9b), and the connector (851) may be electrically connected to a main circuit board of the electronic device (101) (e.g., printed circuit board (340) of FIG. 4).

[0162] According to various embodiments, the antenna housing (910) may be fixed to one side of the bracket (332) of the electronic device (101) with the antenna module (800) mounted thereon. The antenna housing (910) may include at least one fixing member (e.g., a hook, a screw, etc.) to fix it to the inside of the electronic device (101).

[0163] According to one embodiment, the antenna housing (910) may be formed as an integral injection-molded product and may include a fixing surface (911) facing the electronic device and a fixing surface (912) on which the antenna module (800) is fixed. The fixing surface (911) may be provided as a surface that contacts the inside of the electronic device (101) and faces the second direction (-Z). The fixing surface (912) may be provided in an inwardly fine groove shape and may have a designated incline. The designated incline may be formed to correspond to a stacking direction of the substrate portion (810) and a direction in which the first conductive element (820) disposed on one surface of the substrate portion (810) faces. For example, the fixing surface (912) may be disposed to face the third direction (T1).

[0164] According to various embodiments, a heat dissipation member (920, or 730) may be disposed on one side of the antenna housing (910) to guide the diffusion of heat emitted from the antenna module (800). The heat dissipation member (920, or 730) may include a first heat dissipation member (920) disposed between the antenna housing (910) and the antenna module (800), and a second heat dissipation member (930) disposed between the antenna housing (910) and the bracket (332).

[0165] FIG. 13 is a cross-sectional view showing the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to another embodiment of the present disclosure.

[0166] In FIG. 13, 'X' of the two-axis orthogonal coordinate system may mean the length direction of the electronic device (101), and 'Z' may mean the thickness direction of the electronic device (101). In addition, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z), and 'X' may mean the third direction (+X, or -X).

[0167] Referring to FIG. 13, the electronic device (101) may include a housing (310), a display (330), an antenna module (800), and an antenna housing (910). The configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIG. 13 may be applied to the configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIGS. 11 and 12. Hereinafter, the side member (333), the antenna module (800), and the antenna housing (910) of FIG. 13 will be described with a focus on the configuration of the side member (333) of the housing (310) of FIGS. 11 and 12, and the differences in the arrangement configuration between the antenna module (800) and the antenna housing (910). For example, in the embodiment of FIG. 13, the antenna radiation area of ​​the antenna module (800) may be different depending on the material composition of the side member (333).

[0168] According to various embodiments, the housing (310) includes a front plate (302), a rear plate (311), and a side member (333), and the side member (333) may include a side bezel structure (331) and a bracket (332) extending inwardly from the side bezel structure (331). At least a portion of the side bezel structure (331) may be formed of a metal material. According to one embodiment, the side bezel structure (331) may be divided into a first side portion (331a) formed of a metal material and a second side portion (331b) formed of a non-metal material. For example, the first side portion (331a) may extend from the center of the side bezel structure (331) to an area facing the front direction (e.g., the first direction (+Z)), and the second side portion (331b) may extend from the center of the side bezel structure (331) to an area facing the rear direction (e.g., the second direction (-Z)). The bracket (332) provides a space (S) in which the antenna housing (910) on which the antenna module (800) is mounted is mounted, and may be formed of a non-metallic material. At least a portion of the bracket (332) formed of the non-metallic material and the second side portion (331b) of the side bezel structure (331) may be utilized as a radiation area of ​​the antenna module (800).

[0169] According to various embodiments, an antenna module (800) and an antenna housing (910) may be arranged in the internal space (S) of the bracket (332). The antenna module (800) may include a first surface (801) facing a third direction (T1) forming an acute angle with the second direction (-Z) and a second surface (e.g., the second surface (802) of FIG. 9b) facing a fourth direction (T2) opposite to the third direction (T1). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (e.g., the bridge circuit board (850) of FIG. 9b) are sequentially stacked based on a plurality of conductive layers constituting the substrate portion (810). When the above substrate portion (810) is laminated from the first layer (811), which is the lowest layer, to the second layer (812), the outer surface of the second layer may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0170] According to various embodiments, the antenna module (800) may include the antenna radiator, and the antenna radiator may include at least one first conductive element (820) and at least one second conductive element (830). For example, the at least one first conductive element (820) may be a patch type antenna, and the at least one second conductive element (830) may be a dipole type antenna.

[0171] According to one embodiment, the first conductive element (820) may be arranged to face the third direction (T1) on the first surface (801) of the antenna module (800), or may be arranged to face the third direction (T1) within the antenna module (800). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the rear plate (311). The first radiation area (S1) in which the first conductive element (820) transmits or receives a high-frequency signal may be an area that extends up, down, left, or right to a specified range based on the third direction (T1), and may form a specified third angle (θ3) when viewed in cross section. The first radiation area (S1) may include a portion of the rear plate (311) made of a non-metallic material and an edge area of ​​the bracket (332) and the side bezel structure (331). For example, a portion of the first radiation area (S1) may be an area from the first conductive element (820) toward the rear plate (311), and another portion of the first radiation area (S1) may be an area from the first conductive element (820) through the edge area of ​​the bracket (332) toward the second side (331b) of the side bezel structure (331). In one embodiment, the designated third angle (θ3) may be variable. For example, the wireless communication circuit (840) may include a phase shifter connected to the first conductive element (820) and may control the orientation direction of the first conductive element (820). As another example, the acute angle formed by the second direction (-Z) and the third direction (T1) of FIG. 10 may be greater than the acute angle formed by the second direction (-Z) and the third direction (T1) of FIG. 9.

[0172] According to one embodiment, the second conductive element (830) may be disposed between the first surface (801) and the second surface (802) of the antenna module (800), adjacent to the side member (333) (e.g., the side of the bracket (332)). The second conductive element (830) may be disposed to extend in a fifth direction (T3) that is different from the third direction (T1) and the fourth direction (T2), and that is directed between the active area (P1) (e.g., the first portion) of the front plate (302) and the side member (e.g., the side of the bracket (332)). For example, the fifth direction (T3) may be a direction from an end of the first layer (811) toward the inactive area (P2) of the front plate (302). As another example, the fifth direction (T3) may be substantially perpendicular to the third direction (T1).

[0173] According to one embodiment, the second conductive element (830) can transmit or receive a high-frequency signal through a portion of the front plate (302). The second radiation area (S2) through which the first conductive element (820) transmits or receives a high-frequency signal may be an area extending up, down, left, or right to a designated range with respect to the fifth direction (T3), and may form a designated second angle (θ2) when viewed in cross-section. The second radiation area (S2) may include a portion of the front plate (302) made of a non-metallic material and an edge area of ​​the bracket (332), and the designated second angle (θ2) may be variable.

[0174] According to various embodiments, the antenna housing (910) may be fixed to one side of the bracket (332) of the electronic device (101) with the antenna module (800) mounted thereon. The antenna housing (910) may include at least one fixing member (e.g., a hook, a screw, etc.) to be fixed to the inside of the electronic device (101). According to one embodiment, the antenna housing (910) may be formed as an integral injection-molded product and may include a fixing surface (911) facing the electronic device and a mounting surface (912) on which the antenna module (800) is mounted. The fixing surface (911) may be provided as a surface that contacts the inside of the electronic device (101) and as one side facing the second direction (-Z). The mounting surface (912) may be provided in an inwardly fine groove shape and may have a designated slope. The above-mentioned specified slope may be formed to correspond to the stacking direction of the substrate portion (810) and the direction in which the first conductive element (820) disposed on one surface of the substrate portion (810) faces. For example, the mounting surface (912) may be disposed to face the third direction (T1).

[0175] FIG. 14 is a cross-sectional view showing the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to another embodiment of the present disclosure.

[0176] In FIG. 14, 'X' of the two-axis orthogonal coordinate system may mean the length direction of the electronic device (101), and 'Z' may mean the thickness direction of the electronic device (101). In addition, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z).

[0177] Referring to FIG. 14, the electronic device (101) may include a housing (310), a display (330), an antenna module (800), and an antenna housing (910). The configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIG. 14 may be applied to the configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIGS. 11 and 12. Hereinafter, the side member (333), the antenna module (800), and the antenna housing (910) of FIG. 14 will be described with a focus on the configuration of the side member (333) of the housing (310) of FIGS. 11 and 12, and the differences in the arrangement configuration between the antenna module (800) and the antenna housing (910). For example, in the embodiment of FIG. 14, the antenna radiation area of ​​the antenna module (800) may be different depending on the material composition of the side member (333).

[0178] According to various embodiments, the housing (310) includes a front plate (302), a rear plate (311), and a side member (333), and the side member (333) may include a side bezel structure (331) and a bracket (332) extending inwardly from the side bezel structure (331). At least a portion of the side bezel structure (331) may be formed of a metal material. According to one embodiment, the side bezel structure (331) may be divided into a first side portion (331aa, 331ab) formed of a metal material and a second side portion (331b) formed of a non-metal material. For example, the second side portion (331b) may be formed at a center portion of the side bezel structure (331), and the first side portions (331aa, 331ab) may be formed to extend to both sides of the second side portion (331b). The first-first side portion (331aa) may be formed to extend from one end of the second side portion (331b) to an area facing the front direction (e.g., the first direction (+Z)), and the first-second side portion (331ab) may be formed to extend from the other end of the second side portion (331b) to an area facing the rear direction (e.g., the second direction (-Z)). The bracket (332) provides a space in which the antenna housing (910) on which the antenna module (800) is mounted is mounted, and may be formed of a non-metallic material. At least a portion of the bracket (332) formed of the non-metallic material and the second side portion (331b) of the side bezel structure (331) may be utilized as a radiation area of ​​the antenna module (800).

[0179] According to various embodiments, an antenna module (800) and an antenna housing (910) may be arranged in the internal space (S) of the bracket (332). The antenna module (800) may include a first surface (801) facing a third direction (T1) forming an acute angle with the second direction (-Z) and a second surface (802) facing a fourth direction (T2) opposite to the third direction (T1). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (850) are sequentially stacked based on a plurality of conductive layers constituting the substrate portion (810). When the above substrate portion (810) is laminated from the first layer (811), which is the lowest layer, to the second layer (812), which is the highest layer, the outer surface of the second layer may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0180] According to various embodiments, the antenna module (800) may include the antenna radiator, and the antenna radiator may include at least one first conductive element (820) and at least one second conductive element (830). For example, the at least one first conductive element (820) may be a dipole type antenna, and the at least one second conductive element (830) may be a dipole type antenna.

[0181] According to one embodiment, the first conductive element (820) may be disposed on the first surface (e.g., the second layer (812)) of the antenna module (800) to extend in a fifth direction (T3) that is different from the third direction (T1) and the fourth direction (T2) and toward the second side (331b) of the side member (333). For example, the fifth direction (T3) may be substantially perpendicular to the third direction (T1). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the side member (333). The first radiation area (S1) in which the first conductive element (820) transmits or receives a high-frequency signal may be an area that extends up, down, left, or right to a designated range with respect to the fifth direction (T3), and may form a designated fourth angle (θ4) when viewed in cross-section. The first radiation area (S1) may include an edge area of ​​a side bezel structure (331) made of a non-metallic material. For example, the first radiation area (S1) may be an area extending from the first conductive element (820) through the edge area of ​​the bracket (332) toward the second side (331b) of the side bezel structure (331). According to one embodiment, the designated fourth angle (θ4) may be variable. For example, the wireless communication circuit (840) includes a phase shifter connected to the first conductive element (820) and can control the orientation direction of the first conductive element (820).

[0182] According to one embodiment, the second conductive element (830) may be disposed between the first side (801) and the second side (802) of the antenna module (800), adjacent to the side member (333) (e.g., the side of the bracket (332)). The second conductive element (830) may be disposed to extend in a fifth direction (T3) that is different from the third direction (T1) and the fourth direction (T2) and that is directed between the active area (P1) (e.g., the first portion) of the front plate (302) and the side member (e.g., the side of the bracket (332)). The arrangement of the second conductive element (830) may be substantially parallel to the arrangement of the first conductive element (820). For example, the fifth direction (T3) may be a direction from the end of the first layer (811) toward the inactive area (P2) of the front plate (302). As another example, the fifth direction (T3) may be substantially perpendicular to the third direction (T1).

[0183] According to one embodiment, the second conductive element (830) can transmit or receive a high-frequency signal through a portion of the front plate (302). The second radiation area (S2) through which the first conductive element (820) transmits or receives a high-frequency signal may be an area extending up, down, left, or right to a designated range with respect to the fifth direction (T3), and may form a designated second angle (θ2) when viewed in cross-section. The second radiation area (S2) may include a portion of the front plate (302) made of a non-metallic material and an edge area of ​​the bracket (332), and the designated second angle (θ2) may be variable.

[0184] FIG. 15 is a cross-sectional view showing the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to another embodiment of the present disclosure.

[0185] In FIG. 15, 'X' of the two-axis orthogonal coordinate system may mean the length direction of the electronic device (101), and 'Z' may mean the thickness direction of the electronic device (101). In addition, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z).

[0186] Referring to FIG. 15, the electronic device (101) may include a housing (310), a display (330), an antenna module (800), and an antenna housing (910). The configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIG. 15 may be applied to the configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIGS. 11 and 12. Hereinafter, the side member (333), the antenna module (800), and the antenna housing (910) of FIG. 15 will be described with a focus on the configuration of the side member (333) of the housing (310) of FIGS. 11 and 12, and the differences in the arrangement configuration between the antenna module (800) and the antenna housing (910). For example, in the embodiment of FIG. 15, the antenna radiation area of ​​the antenna module (800) may be different depending on the material composition of the side member (333) and the structure of the antenna module (800).

[0187] According to various embodiments, the housing (310) includes a front plate (302), a rear plate (311), and a side member (333), and the side member (333) may include a side bezel structure (331) and a bracket (332) extending inwardly from the side bezel structure (331). At least a portion of the side bezel structure (331) may be formed of a metal material. According to one embodiment, the side bezel structure (331) may be divided into a first side portion (331a) formed of a metal material and a second side portion (331b) formed of a non-metal material. For example, the first side portion (331a) may extend from the center of the side bezel structure (331) to an area facing the front direction (e.g., the first direction (+Z)), and the second side portion (331b) may extend from the center of the side bezel structure (331) to an area facing the rear direction (e.g., the second direction (-Z)). The bracket (332) provides a space in which the antenna housing (910) on which the antenna module (800) is mounted is mounted, and may be formed of a non-metallic material. At least a portion of the bracket (332) formed of the non-metallic material and the second side portion (331b) of the side bezel structure (331) may be utilized as a radiation area of ​​the antenna module (800).

[0188] According to various embodiments, an antenna module (800) and an antenna housing (910) may be arranged in the internal space of the bracket (332). The antenna module (800) may include a first surface (801) facing a third direction (T1) forming an acute angle with the second direction (-Z) and a second surface (e.g., the second surface (802) of FIG. 7B) facing a fourth direction (T2) forming an acute angle with the first direction (+Z). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (850) are sequentially stacked based on a plurality of conductive layers constituting the substrate portion (810). When the above substrate portion (810) is laminated from the first layer (811), which is the lowest layer, to the third layer (813) and the second layer (812), the outer surface of the second layer (812) may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0189] According to various embodiments, the third layer (813) is disposed between the first layer (811) and the second layer (812) and may include a designated inclined surface. For example, the third layer (813) includes a first surface (813a) facing the front and a second surface (813b) facing the rear, and the first surface (813a) and the second surface (813b) may be parallel or may not face each other. The first surface (813a) is disposed in contact with the second layer (812), and the second surface (813b) is disposed in contact with the first layer (811), so that the surfaces facing the first layer (811) and the second layer (812) may be different from each other. Accordingly, the first conductive element (820) arranged on the first layer (811) is formed to face a different direction compared to the first conductive element (820) of FIG. 9, so that the radiation areas of the electromagnetic waves may be different from each other.

[0190] According to various embodiments, the antenna module (800) may include the antenna radiator, and the antenna radiator may include at least one first conductive element (820) and at least one second conductive element (830). For example, the at least one first conductive element (820) may be a patch type antenna, and the at least one second conductive element (830) may be a dipole type antenna.

[0191] According to one embodiment, the first conductive element (820) may be arranged to face the third direction (T1) on the first surface (801) of the antenna module (800), or may be arranged to face the third direction (T1) within the antenna module (800). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the rear plate (311). The first radiation area (S1) in which the first conductive element (820) transmits or receives a high-frequency signal may be an area that extends up, down, left, or right to a specified range based on the third direction (T1), and may form a specified fifth angle (θ5) when viewed in cross section. The first radiation area (S1) may include a portion of the rear plate (311) made of a non-metallic material and an edge area of ​​the bracket (332) and the side bezel structure (331). For example, a portion of the first radiation area (S1) may be an area from the first conductive element (820) toward the rear plate (311), and another portion of the first radiation area (S1) may be an area from the first conductive element (820) through the edge area of ​​the bracket (332) toward the second side (331b) of the side bezel structure (331). In one embodiment, the specified fifth angle (θ5) may be variable. For example, the wireless communication circuit (840) may include a phase shifter connected to the first conductive element (820) and may control the orientation direction of the first conductive element (820). As another example, the acute angle formed by the second direction (-Z) and the third direction (T1) of FIG. 13 may be greater than the acute angle formed by the second direction (-Z) and the third direction (T1) of FIG. 9.

[0192] According to one embodiment, the second conductive element (830) may be disposed between the first surface (801) and the second surface (802) of the antenna module (800), adjacent to the side member (e.g., the side of the bracket (332)). The second conductive element (830) may be disposed to extend in a fifth direction (T3) that is different from the third direction (T1) and the fourth direction (T2) and that is directed between the active area (P1) (e.g., the first portion) of the front plate (302) and the side member (e.g., the side of the bracket (332)). For example, the fifth direction (T3) may be a direction from an end of the first layer (811) toward the inactive area (P2) of the front plate (302). As another example, the fifth direction (T3) may be substantially perpendicular to the third direction (T1).

[0193] According to one embodiment, the second conductive element (830) can transmit or receive a high-frequency signal through a portion of the front plate (302). The second radiation area (S2) through which the first conductive element (820) transmits or receives a high-frequency signal may be an area extending up, down, left, or right to a designated range with respect to the fifth direction (T3), and may form a designated second angle (θ2) when viewed in cross-section. The second radiation area (S2) may include a portion of the front plate (302) made of a non-metallic material and an edge area of ​​the bracket (332), and the designated second angle (θ2) may be variable.

[0194] FIG. 16 is a cross-sectional view showing the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to another embodiment of the present disclosure.

[0195] In FIG. 16, 'X' of the two-axis orthogonal coordinate system may mean the length direction of the electronic device (101), and 'Z' may mean the thickness direction of the electronic device (101). In addition, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z), and 'X' may mean the third direction (+X, or -X).

[0196] Referring to FIG. 16, the electronic device (101) may include a housing (310), a display (330), an antenna module (800), and an antenna housing (910). The configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIG. 16 may be applied to the configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIGS. 11 and 12. Hereinafter, the conductive elements of the antenna module (800) of FIG. 16 will be described with a focus on the arrangement configuration and differences of the conductive elements of the antenna module (800) of FIGS. 11 and 12. For example, the embodiment of FIG. 16 may exhibit various radiation areas depending on the configuration of the conductive elements.

[0197] According to various embodiments, an antenna module (800) and an antenna housing (910) may be arranged in the internal space (S) of the bracket (332). The antenna module (800) may include a first surface (801) facing a third direction (T1) forming an acute angle with the second direction (-Z) and a second surface (e.g., the second surface (802) of FIG. 11B) facing a fourth direction (T2) opposite to the third direction (T1). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (e.g., the bridge circuit board (850) of FIG. 11B) are sequentially stacked based on a plurality of conductive layers constituting the substrate portion (810). When the above substrate portion (810) is laminated from the first layer (811), which is the lowest layer, to the second layer (812), the outer surface of the second layer may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0198] According to various embodiments, the antenna module (800) may include the antenna radiator, and the antenna radiator may include at least one first conductive element (820), at least one second conductive element (830), and at least one third conductive element (870a, 870b, 870c). For example, the at least one first conductive element (820) may be a patch type antenna, and the at least one second conductive element (830) and the third conductive element (870a, 870b, 870c) may be dipole type antennas.

[0199] According to one embodiment, the first conductive element (820) may be arranged on the first surface (801) of the antenna module (800) so as to face the third direction (T1). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the rear plate (311). The first radiation area (S1) in which the first conductive element (820) transmits or receives a high-frequency signal may be an area that extends up, down, left, or right to a specified range based on the third direction (T1).

[0200] According to one embodiment, the second conductive element (830) may be disposed between the first surface (801) and the second surface (802) of the antenna module (800), adjacent to the side member (333) (e.g., the side of the bracket (332)). The second conductive element (830) may be disposed to extend in a fifth direction (T3) that is different from the third direction (T1) and the fourth direction (T2) and that faces between the active area (P1) (e.g., the first portion) of the front plate (302) and the side member (e.g., the side of the bracket (332)). The second radiation area (S2) in which the second conductive element (830) transmits or receives a high-frequency signal may be an area that extends to a specified range in the upward, downward, left, and right directions based on the fifth direction (T3).

[0201] According to one embodiment, the third conductive elements (870a, 870b, 870c) may be arranged on each side of the third layer (813) and the second layer (812) from the first layer (811), which is the lowest layer. The third conductive elements (870a, 870b, 870c) may be arranged to extend in a direction opposite to the fifth direction (T3). The third radiation area (S3) in which the third conductive elements (870a, 870b, 870c) transmit or receive a high-frequency signal may be an area extended to a specified range in a direction opposite to the fifth direction (T3). However, the structure of the third conductive element (870a, 870b, 870c) is not limited thereto, and may be placed only in some layers, or, if the antenna module (800) is composed of three or more layers, may be placed in each layer or some layers.

[0202] FIG. 17 is a cross-sectional view showing the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to another embodiment of the present disclosure.

[0203] In FIG. 17, 'X' of the two-axis orthogonal coordinate system may mean the length direction of the electronic device (101), and 'Z' may mean the thickness direction of the electronic device (101). In addition, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z), and 'X' may mean the third direction (+X, or -X).

[0204] Referring to FIG. 17, the electronic device (101) may include a housing (310), a display (330), an antenna module (800), and an antenna housing (910). The configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIG. 16 may be applied to the configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIG. 14. Hereinafter, the conductive elements of the antenna module (800) of FIG. 17 will be described with a focus on the arrangement configuration and differences of the conductive elements of the antenna module (800) of FIG. 14. For example, the embodiment of FIG. 17 may exhibit various radiation areas depending on the configuration of the conductive elements.

[0205] According to various embodiments, an antenna module (800) and an antenna housing (910) may be arranged in the internal space (S) of the bracket (332). The antenna module (800) may include a first surface (801) facing a third direction (T1) forming an acute angle with the second direction (-Z) and a second surface (e.g., the second surface (802) of FIG. 11B) facing a fourth direction (T2) opposite to the third direction (T1). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (e.g., the bridge circuit board (850) of FIG. 11B) are sequentially stacked based on a plurality of conductive layers constituting the substrate portion (810). When the above substrate portion (810) is laminated from the first layer (811), which is the lowest layer, to the second layer (812), the outer surface of the second layer may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0206] According to various embodiments, the antenna module (800) may include the antenna radiator, which may include at least one first conductive element (820), at least one second conductive element (830), at least one third conductive element (870a, 870b, 870c), and a fourth conductive element (880). For example, the at least one first conductive element (820) may be a dipole type antenna, and the at least one second conductive element (830) may be a dipole type antenna. As another example, the third conductive element (870a, 870b, 870c) may be a dipole type antenna, and the fourth conductive element (880) may be a patch type antenna.

[0207] According to one embodiment, the first conductive element (820) may be disposed on the first surface (e.g., the second layer (812)) of the antenna module (800) in a direction different from the third direction (T1) and the fourth direction (T2) and extending in a direction toward the second side (331b) of the side member (333). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the side member (333).

[0208] According to one embodiment, the second conductive element (830) may be disposed between the first surface (801) and the second surface (802) of the antenna module (800), adjacent to the side member (333) (e.g., the side of the bracket (332)). The direction in which the second conductive element (830) faces may be parallel to the direction in which the first conductive element (820) faces. According to one embodiment, the second conductive element (830) may transmit or receive a high-frequency signal through a portion of the front plate (302).

[0209] According to one embodiment, the third conductive elements (870a, 870b, 870c) may be arranged on each side of the third layer (813) and the second layer (812) from the first layer (811), which is the lowest layer. The third conductive elements (870a, 870b, 870c) may be arranged to extend in a direction opposite to the direction in which the first conductive element (820) or the second conductive element (830) faces. The third radiation area (S3) in which the third conductive elements (870a, 870b, 870c) transmit or receive a high-frequency signal may be an area extended to a specified range toward the rear plate. However, the structure of the third conductive element (870a, 870b, 870c) is not limited thereto, and may be placed only in some layers, or, if the antenna module (800) is composed of three or more layers, may be placed in each layer or some layers.

[0210] According to one embodiment, the fourth conductive element (880) may be arranged on the first surface (801) of the antenna module (800) so as to face the third direction (T1). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the rear plate (311). The first radiation area (S1) in which the first conductive element (820) transmits or receives a high-frequency signal may be an area that extends to a specified range in the upward, downward, left, and right directions based on the third direction (T1).

[0211] FIG. 18 is a cross-sectional view showing the interior of an electronic device in which an antenna module (800) and an antenna housing (910) are arranged according to another embodiment of the present disclosure.

[0212] In FIG. 18, 'Y' of the two-axis orthogonal coordinate system may mean the width direction of the electronic device (101), and 'Z' may mean the thickness direction of the electronic device (101). In addition, in one embodiment of the present invention, 'Z' may mean the first direction (+Z) and the second direction (-Z).

[0213] Referring to FIG. 18, the electronic device (101) may include a housing (310), a display (330), an antenna module (800), and an antenna housing (910). The configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIG. 18 may be applied to the configuration of the housing (310), the display (330), the antenna module (800), and the antenna housing (910) of FIGS. 11 and 12. Hereinafter, the side member (333), the antenna module (800), and the antenna housing (910) of FIG. 18 will be described with a focus on the configuration of the side member (333) of the housing (310) of FIGS. 11 and 12, and the arrangement configuration and differences between the antenna module (800) and the antenna housing (910). For example, in the embodiment of FIG. 18, the antenna radiation area of ​​the antenna module (800) may be different depending on the area where the antenna housing (910) and the antenna module (800) are placed and the structure of the antenna housing (910).

[0214] According to various embodiments, the housing (310) includes a front plate (302), a rear plate (311), and a side member (333), and the side member (333) may include a side bezel structure (331) and a bracket (332) extending inwardly from the side bezel structure (331). At least a portion of the side bezel structure (331) may be formed of a metal material. As illustrated, since the width direction (+Y, -Y direction) of the housing is implemented as a curved shape along the edge, unlike the length direction, the area formed by the metal side bezel structure (331) of the side member (333) may be relatively small. Accordingly, the antenna module (800) may be advantageously mounted horizontally without tilting. According to various embodiments, the antenna module (800) and the antenna housing (910) may be arranged in the internal space of the bracket (332). The antenna module (800) may include a first surface (801) facing the second direction (-Z) and a second surface (802) facing the first direction (+Z) opposite to the second direction (-Z). For example, the antenna module (800) may include a structure in which a wireless communication circuit (840) and a bridge circuit board (850) are sequentially laminated based on a plurality of conductive layers constituting the substrate (810). When the substrate (810) is laminated from the first layer (811) as the lowest layer to the second layer (812) as the uppermost layer, the outer surface of the second layer (812) may be the first surface (801), and one surface of the bridge circuit board (850) may be the second surface (802).

[0215] According to various embodiments, the antenna module (800) may include the antenna radiator, and the antenna radiator may include at least one first conductive element (820) and at least one second conductive element (830). For example, the at least one first conductive element (820) may be a patch type antenna, and the at least one second conductive element (830) may be a dipole type antenna.

[0216] According to one embodiment, the first conductive element (820) may be arranged on the first surface (801) of the antenna module (800) so as to face the second direction (-Z), or may be arranged within the antenna module (800) so as to face the second direction (-Z). The first conductive element (820) may transmit or receive a high-frequency signal through a portion of the rear plate (311). The first radiation area (S1) in which the first conductive element (820) transmits or receives a high-frequency signal may be an area that extends up, down, left, or right to a specified range based on the second direction (-Z).

[0217] According to one embodiment, the second conductive element (830) may be disposed between the first surface (801) and the second surface (802) of the antenna module (800), adjacent to the side member (e.g., the side of the bracket (332)). The second conductive element (830) may be disposed to extend in a direction different from the first direction (+Z) and the second direction (-Z), and parallel to a direction toward a portion of the rear plate (333) and the side member (333) (e.g., the side of the bracket (332)). As another example, the direction in which the second conductive element (830) extends may be substantially perpendicular to the first direction (+Z) or the second direction (-Z). The second conductive element (830) may be capable of transmitting or receiving a high-frequency signal. The second radiation area (S2) in which the second conductive element (830) transmits or receives a high-frequency signal may be an area that extends up, down, left, or right to a specified range based on a direction perpendicular to the second direction (-Z) (e.g., +Y direction).

[0218] According to various embodiments, the antenna housing (910) may be fixed to one side of the bracket (332) of the electronic device (101) with the antenna module (800) mounted thereon. The antenna housing (910) may include at least one fixing member (e.g., a hook, a screw, etc.) to be fixed to the inside of the electronic device (101). According to one embodiment, the antenna housing (910) may be formed as an integral injection-molded product and may include a fixing surface (911) facing the electronic device and a mounting surface (912) on which the antenna module (800) is mounted. The fixing surface (911) may be provided as a surface that contacts the inside of the electronic device (101) and as one side facing the first direction (+Z). The mounting surface (912) may be provided as a groove shape that is finely grooved inward and as one side facing the second direction (-Z).

[0219] FIG. 19 is a drawing showing the arrangement configuration of an antenna module inside an electronic device according to various embodiments of the present disclosure.

[0220] Referring to FIG. 15, the electronic device (101) may include a housing (310), an antenna module (800), and an antenna housing (910). The configuration of the housing (310) of FIG. 15 may be partially or entirely identical to the configuration of the housing (310) of FIGS. 1 to 4, and the configuration of the antenna module (800) and the antenna housing (910) of FIG. 15 may be partially or entirely identical to the configuration of the antenna module (800) and the antenna housing (910) of FIGS. 6 to 7b.

[0221] According to various embodiments, the housing (e.g., the housing (310) of FIG. 2) includes a front plate (e.g., the front plate (302) of FIG. 2), a rear plate (e.g., the rear plate (311) of FIG. 3) and a side member (333), wherein the side member (333) may include a side bezel structure (331) and a bracket (332) extending inwardly from the side bezel structure (331). At least a portion of the side bezel structure (331) may be formed of a metallic material, and the bracket (332) may be formed of a non-metallic material.

[0222] According to various embodiments, an antenna module (800) mounted within an antenna housing may be disposed in at least one area of ​​the bracket (332). The antenna module (800) may include a rear-facing patch antenna and / or a side-facing dipole antenna. A plurality of antenna modules (800) may be disposed along the edge of the bracket (332). For example, three antenna modules (800) may be provided, and a first antenna module (800a) may be disposed along an upper edge area of ​​the bracket (332), adjacent to a camera or receiver. A second antenna module (800b) may be provided with the same structure and shape as the first antenna module (800a), or may be provided with a different shape corresponding to the shape of the side member (333). The second antenna module (800b) may be disposed along a left edge area of ​​the bracket (332). The second antenna module (800b) may be arranged in the upper or lower region of the battery (350). The third antenna module (800c) may be provided with the same structure and shape as the first antenna module (800a), or may be provided with a different shape corresponding to the shape of the side member (333). The third antenna module (800c) may be arranged along the right edge region of the bracket (332). The third antenna module (800c) may be arranged in the upper or lower region of the key button (317) mounted on the side. However, the number and arrangement of the antenna modules are not limited to those illustrated, and two or fewer or four or more may be arranged along the edge region of the bracket (332), and the design may be changed in various positions in consideration of the relationship with the internal components arranged in the bracket (332) and the mounting space.

[0223] An electronic device according to various embodiments of the present invention (e.g., an electronic device (101) of FIGS. 1 to 5) comprises a housing (e.g., a housing (310) of FIG. 2) including a front plate (e.g., a front plate (302) of FIG. 2) facing a first direction (e.g., a first direction (+Z) of FIG. 9), a rear plate (e.g., a rear plate (311) of FIG. 3) facing a second direction opposite to the first direction (e.g., a second direction (-Z) of FIG. 9), and a side member (e.g., a side member (333) of FIG. 9) surrounding a space (e.g., a space (S) of FIG. 9) between the front plate and the rear plate, at least a portion of which is formed of a metal material), a display (e.g., a display (330) of FIG. 4) shown through a first portion of the front plate (e.g., an active area (P1) of FIG. 9), and an antenna module (e.g., an antenna of FIG. 9) positioned within the space. The module (800)) may include a wireless communication circuit (e.g., a wireless communication circuit (840) of FIG. 9) electrically connected to the antenna module and configured to transmit and / or receive a signal having a frequency of 20 GHz to 100 GHz.The antenna module has a first surface (e.g., a first surface (801) of FIG. 9) facing in a third direction (e.g., a third direction (T1) of FIG. 9) forming an acute angle with the second direction, a second surface (e.g., a second surface (802) of FIG. 9) facing in a fourth direction (e.g., a fourth direction (T2) of FIG. 9) opposite to the third direction, at least one first conductive element (e.g., a first conductive element (820) of FIG. 9) disposed on the first surface or within the antenna module to face the third direction, and at least one second conductive element (e.g., a fifth direction (T3) of FIG. 9) extending between the first surface and the second surface, adjacent to the side member, in a fifth direction different from the third direction and the fourth direction and facing between the first part of the front plate and the side surface. It may include a second challenging element (830) of 9.

[0224] According to various embodiments, the first conductive element may comprise a conductive plate.

[0225] According to various embodiments, the second conductive element may form a dipole antenna.

[0226] According to various embodiments, the fifth direction may be substantially perpendicular to the third direction.

[0227] According to various embodiments, the antenna module may include a first layer having a first area (e.g., the first layer (811) of FIG. 9), a second layer having a second area smaller than the first area and disposed on top of the first layer (e.g., the second layer (812) of FIG. 9). A central portion of the second layer may be disposed closer to the back plate than a central portion of the first layer.

[0228] According to various embodiments, at least one conductive element may be disposed on one surface or within the first layer, and at least one second conductive element may be disposed on one surface or within the second layer.

[0229] According to various embodiments, the antenna module may include a third layer (e.g., the third layer (813) of FIG. 9) laminated between the first layer and the second layer, the third layer having a third area that is smaller than the first area and larger than the second area. A central portion of the second layer may be arranged closer to the back plate than a central portion of the third layer.

[0230] According to various embodiments, the antenna module may further include a bridge circuit board (e.g., bridge circuit board (850) of FIG. 7b) including a first region (e.g., first region (850a) of FIG. 7b) in which the first conductive element and the second conductive element are arranged, and a second region (e.g., second region (850b) of FIG. 7b) in which a connector (e.g., connector (851) of FIG. 7b) is arranged.

[0231] According to various embodiments, the electronic device may further include an antenna housing (e.g., antenna housing (910) of FIG. 9) that mounts the antenna module and fixes it within the space of the electronic device.

[0232] According to various embodiments, the antenna housing may include a fixing surface (e.g., fixing surface (911) of FIG. 10b) facing the front plate or the rear plate, a fixing surface (e.g., fixing surface (912) of FIG. 10b) on which an antenna module is mounted and having a designated incline, a coupling member (e.g., coupling member (913) of FIG. 10b) for fixing the antenna module mounted on the mounting surface, and a fixing member for fixing the antenna housing on the space of the electronic device.

[0233] According to various embodiments, the antenna housing may be manufactured from a metal material to dissipate heat generated from the antenna module, or may be provided by insert injection molding a metal material.

[0234] According to various embodiments, the electronic device may further include a heat dissipation member (e.g., a heat dissipation member (920, or 730) of FIG. 10B) attached to at least a portion of the antenna housing and configured to dissipate heat generated from the antenna module. The heat dissipation member may include a first heat dissipation member (e.g., a first heat dissipation member (920) of FIG. 10B) disposed between the antenna housing and the antenna module, and a second heat dissipation member (e.g., a second heat dissipation member (930) of FIG. 10B) disposed between the antenna housing and the display.

[0235] According to various embodiments, the first conductive element transmits or receives a high-frequency signal through a first radiating area, and the first radiating area (e.g., the first radiating area (S1) of FIG. 9) may include a portion of a back plate or a portion of a side member made of a non-metallic material.

[0236] According to various embodiments, the second conductive element transmits or receives a high-frequency signal through a second radiating area (e.g., the second radiating area (S2) of FIG. 9), and the second radiating area may include a portion of a front plate or a portion of a side member made of a non-metallic material.

[0237] According to various embodiments, the electronic device can transmit and / or receive a signal having a designated frequency band ranging from 6 GHz to 300 GHz via the first conductive element or the second conductive element.

[0238] An electronic device according to various embodiments of the present disclosure may include a housing including a front plate facing a first direction, a rear plate facing a second direction opposite to the first direction, and a side member surrounding a space between the front plate and the rear plate, at least a portion of which is formed of a metal material, a display visible through a first portion of the front plate and an antenna housing positioned within the space and including an inclined surface facing the rear plate, and an antenna module disposed on the inclined surface of the antenna housing and disposed in a third direction forming an acute angle with the second direction. The antenna module may include an antenna module including a substrate portion including a first layer having a first area, a second layer having a second area smaller than the first area and disposed on top of the first layer, a first conductive element including an array of a plurality of conductive plates disposed on an upper surface or inside of the second layer and formed toward the third direction, a second conductive element disposed inside the first layer, exposed toward the side, and extending toward a direction different from the third direction, and a wireless communication circuit electrically connected to the first conductive element or the second conductive element and configured to transmit and / or receive a signal having a frequency of 6 GHz to 300 GHz.

[0239] According to various embodiments, the antenna housing may further include a heat dissipation member attached to at least a portion of the antenna housing and configured to dissipate heat generated from the antenna module. The heat dissipation member may include a first heat dissipation member disposed between the antenna housing and the antenna module, and a second heat dissipation member disposed between the antenna housing and the display.

[0240] According to various embodiments, the antenna module includes a third layer laminated between the first layer and the second layer, the third layer having a third area smaller than the first area and larger than the second area, and a central portion of the second layer may be arranged closer to the back plate than a central portion of the third layer.

[0241] According to various embodiments, the third layer includes a designated slope, and a direction in which one side of the second layer disposed on the designated slope faces can form an acute angle with a direction in which one side of the first layer faces.

[0242] An antenna structure according to various embodiments of the present disclosure may include an antenna housing that is provided as an integral body and includes a fixing surface for support and a recess-shaped fixing surface having a designated inclination with respect to the fixing surface, and an antenna module at least partially inserted and fixedly disposed in the fixing surface. The antenna module may include a substrate including a first layer having a first area, a second layer having a second area smaller than the first area and disposed on top of the first layer, a first conductive element disposed on an upper surface or inside of the second layer and formed to face a direction perpendicular to the designated inclination, a second conductive element disposed inside the first layer, exposed toward the side, and extending in a direction perpendicular to a direction in which the first conductive element faces, and a wireless communication circuit electrically connected to the first conductive element or the second conductive element and configured to transmit and / or receive a signal having a designated frequency.

[0243] The electronic devices of the various embodiments of the present invention described above are not limited to the above-described embodiments and drawings, and it will be apparent to a person having ordinary skill in the art to which the present invention pertains that various substitutions, modifications, and changes are possible within the technical scope of the present invention.

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