The stencil is a thick, coated solder paste, and the method of manufacturing it.

Abstract

OCR 07AP Various forms of this invention are related to the field of electronics manufacturing. Surface mount technology (SMT), and more specifically concerning the design... A thick solder paste (1) with at least one coating of the substrate (3a, 36) and the hole walls (51). Its inclusion of methods (100) for the production of them is presented in this invention. Coated with a special material aimed at preventing the adhesion of thick solder and enhancing durability. Hydrophobic solder paste (1) coated with solder paste exhibits the flow of the solder paste. Improved, reduced clogging and ensured precise deposition, enhancing the performance of thick solder release. This demonstrates significant progress in the production of electronic components.

Claims

OCR 07AP 1. A thick solder stencil (1) that is coated and consists of: Substrate (3) that specifies a certain number of solder holes (5), Which has the following unique characteristics: At least one of the outer surfaces (3a, 3b) of the substrate (3) is coated with the object. For at least one type of coating; Each hole (51) wall of each hole of a certain number of solder holes (5) was coated with a material for At least one type of coating; Where the materials for such coatings include, but are not limited to, silicone, titanium, and fluorocarbons. Elastomers or similar substances, or any combination thereof.

2. A thick solder stencil (1) coated in accordance with the claim in claim 1, which is the object for Coating deposition by physical vapor deposition (PVD).

3. A thick solder stencil (1) that is coated in accordance with any of the preceding claims. First, where the substrate (3) is treated with isopropyl alcohol before the coating material is deposited. accumulate 4. A thick solder stencil (1) that is coated as requested in any of the preceding claims. Firstly, the water contact angle must be at least 110 degrees.

5. Method (100) for producing a coated thick solder stencil (1) which includes: Steps of: i. Substrate formation (3) that defines a certain number of solder holes (5) (110) ii. Deposition of at least one coating material onto the substrate (3) (130); Which has the following unique characteristics: The materials for such coatings are silicone, titanium, or fluoroelastomers, or their combinations. Any of the aforementioned substances.

6. Method (100) for the production of a coated thick solder stencil (1) in accordance with claim 5. The coating material is applied to the solder holes (3) of the substrate (3) and the outer surfaces (3a, 3b). At least one substrate surface (3) 7. Method (100) for producing a thick solder stencil (1) coated according to claim 5 or 6. where the process of depositing at least one type of coating material onto the substrate (3) (130) which It consists of the following sub-steps: a. Substrate (3) is sputtered with silicone and / or titanium material (131); b. Sputtering or evaporation of fluoroelastomer material onto substrate (3) (133) 8. Method (100) for the production of thick solder slate (1) coated in accordance with claims 5 to One of the 7 items which includes the pre-treatment procedure for cleaning the substrate (3) With isopropyl alcohol (120), where this step is performed before the deposition step for the coating material. At least one type on substrate (3) (130) and methods which are further incorporated with the following steps: This occurs during the pre-treatment procedure for cleaning the substrate (3). Isopropyl alcohol (120) and before the deposition step for at least one type of coating material. On Substrate (3) (130): I. Bringing the substrate (3) into the room (121); II. Bringing the chamber inside into a vacuum (123) and III. Driving or bringing fluids into a chamber (125) where such fluids include but Not limited to argon, oxygen, or a combination of these substances.

9. Method (100) for producing thick solder paste (1) coated according to claims 5 through 8. Any one of the following where the coated solid solder stencil (1) exhibits a water contact angle of not less than 110 degrees and where The process of depositing at least one type of coating material onto the substrate (3) (130) uses the following method. Physical vapor deposition (PVD) 10. Method (100) for producing thick solder stencils (1) coated according to claims 5 through 8. One of the following includes an additional post-cleaning coating step. A thick solder stencil (1) is coated with sopropyl alcohol (150), where this step is performed. Energy from the deposition process for at least one type of material to be transferred to the substrate (3) (130)

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