AN UNCOOLED INFRARED DETECTOR

Abstract

This invention includes an infrared detector (1) characterized by a mechanical adapter (2) and a housing (3) positioned on the mechanical adapter (2) that is almost partially perpendicular to the electronic board on which the electronic boards are placed and which has at least one side wall surrounding it, a side fin (31) positioned on the side wall of the housing (3) which allows heat to be dissipated from the electronic board, a back cover (4) positioned on the housing (3) and almost partially parallel to the electronic board, and at least one cut-off fin (41) positioned on the back cover (4) which allows heat to be dissipated from the back cover (4), so that the performance of the image is not affected by temperature changes inside or outside the system.

Description

1 TARIFF AN UNCOOLED INFRARED DETECTOR Technical Area This invention allows for image resolution of 5 degrees in response to temperature changes within or outside the system. with an uncooled infrared detector that ensures its performance is not affected It is related. Previous Technique Uncooled infrared detectors, cooled infrared 10 because they are simpler, more compact and less expensive compared to detectors It is preferred in many applications. However, it is used in refrigerated detectors. Low thermal noise and high performance are achieved thanks to cryogenic cooling systems. These sensitivity levels are difficult to achieve with uncooled detectors. Uncooled The basic principle of infrared detectors is that the detector material absorbs the incoming infrared radiation. absorbing radiation and the temperature changes caused by this radiation This is the detection method. These types of detectors are generally bolometer, pyroelectric, and thermoelectric. It is based on principles. However, these technologies work at ambient temperature. Therefore, they are more sensitive to thermal noise, and this situation affects the detectors. It limits its performance. 20 In previous techniques, to improve the performance of uncooled infrared detectors Generally, the material properties of the detector have been improved and the optical systems have been optimized. Improvements have been made to electronic circuit designs. With this... together, thermal insulation minimizes heat transfer from the detector surface to the environment. 25 Structures and precision signal processing methods are also commonly used approaches. However, these solutions are compared with cooled detectors. It generally provides only a limited increase in sensitivity. Uncooled infrared. ambient temperature which causes detectors to operate with low sensitivity The resulting thermal noise reduces image quality and performance. 30 2 In uncooled infrared detectors, in low / high temperature conditions, sudden environmental changes in temperature changes, the internal temperature of the system into which it is integrated changes (temperature changes of the covering flag in front, behind it) temperature changes occurring in components on electronic boards, etc.); Due to changes in detector responsiveness, image performance is 5. It can be negatively affected. In the current state of the art, these drawbacks can be overcome through various methods. Research is being conducted into some of these methods in detector manufacturing. Improvements were made to the detectors' performance, such as NETD and MTF. Improving parameters, software improvements, and the process of inspecting the detector. Creating a mechanical model compatible with the objective, using ASIC-like technologies. There are many things that need to be done in hardware such as digital processing boards by taking advantage of them. By embedding the process within the FPGA, a compact design and better heat control are achieved. The goal is to create modules that provide this. Designed as monolithic / integrated modules, 15 In the current modules, the shutter and detector are left exposed. In the known state of the technology, problems such as glare and other unwanted issues can occur in the image. When situations arise, they are run within intelligent units such as digital processing boards, etc. Image distortion is corrected with software and IOP parameter settings. 20 Studies are being conducted. The effects of thermal changes in the shutter flag are shown in the image. It can be seen. In the current state of the art, customized, cross-functional, as in the relevant model. Optimal heat dissipation using air circulation with a discontinuous heat emitter design. 25 No model providing this has been found, and the module that is the subject of this invention is discrete. In addition to maximized heat dissipation performance, its design also offers a lightweight solution. It can create both the components behind the detector and the device's interface. a structure that will encompass the components in the region, and the heat produced in these regions 30 by turbulent flow that will ensure removal without being transmitted to the detector area 3 with special, cross-fin designs that increase heat dissipation through maximum air circulation It has made a difference. Brief Description of the Invention The aim of this invention is to improve the image quality in response to temperature changes inside or outside the system. an uncooled infrared detector that ensures its performance is not affected to accomplish. Another objective of this invention is to achieve turbulent heat dissipation, either within or outside the system. The goal is to create an uncooled infrared detector that provides airflow. 10 The first step taken to achieve the purpose of this invention, and the steps associated with that step... In the system defined in the requests; in-system or out-of-system temperature changes To ensure image performance is not affected, an infrared detector is the most basic. It includes a mechanical adapter, preferably one with a rectangular structure. 15 A housing is positioned on the mechanical adapter in question. The housing is mounted on... electronic circuit boards are installed and the housing surrounds the electronic circuit board. There is at least one side wall that wraps around at an angle of approximately 90 degrees, and the word The subject is a side fin placed on the side wall. The heat is transmitted through the electronic circuit board. It primarily transfers heat to the fuselage and from the fuselage to the side walls. 20 The heat from the side walls escapes from the environment through the side walls located on top of the side wall. It is thrown onto the body and almost partially parallel to the electronic board. a back positioned in such a way as to cover the electronic circuit board A cover is included. At least one notched fin is positioned on the rear cover. The segmented fin design allows heat transferred from the electronic circuit board to reach the back cover, preventing it from hitting the back cover's 25° By increasing the surface area, it allows ejection from the back cover. Detailed Description of the Invention This invention is realized with an attached infrared detector to achieve its purpose. shown in this figure; 30 4 Figure 1 - Perspective view of the exploded infrared detector, the subject of the invention. It is the appearance. The parts in the figures are individually numbered, and each number corresponds to the following: given below. 5 1. Uncooled infrared detector 2. Mechanical adapter 3. Body 31. Side fin 4. Back cover 10 41. Broken fin 5. Thermal insulator An uncooled infrared detector that allows heat to be dissipated (1), - a mechanical adapter (2), 15 - The electronic adapter is positioned on the mechanical adapter (2). The snow will be placed almost partially perpendicular to the electronic board and a body containing at least one side wall surrounding it (3), - located on the side wall (3) of the said body and at least one side fin (31) that allows heat to be dissipated from the electronic board, 20 - will be almost partially parallel to the body (3) and the electronic board. a rear cover positioned as shown (4), - located on the back cover (4), the heat on the back cover (4) It contains at least one truncated fin (41) which enables its disposal. Image performance during temperature changes inside or outside the system In order not to be affected, an infrared detector (1) is preferably rectangular in its most basic form. It includes a mechanical adapter (2) which has a structure. The mechanical adapter in question A housing (3) is positioned on the adapter (2). Electronics are placed on the housing (3). cards are placed and around the electronic card on the body (3) immediately 30 There is at least one side wall that immediately surrounds it at a 90-degree angle, and the aforementioned A side fin (31) is placed on the side wall. The heat is transmitted to the electronic board, on which It transfers heat primarily to the shell (3) and from the shell (3) to the side walls. Heat from the walls escapes to the outside through the side fins (31) located on the side wall. It is thrown onto the body (3) and almost partially parallel to the electronic board. a rear 5 positioned in such a way as to cover the electronic board The cover (4) is located. At least one truncated fin (41) is on the back cover (4) It is positioned. The truncated fin (41) is on the back cover (4) from the electronic board. the transferred heat is expelled from the rear cover (4) by increasing the surface area of ​​the rear cover (4) It provides. In a preferred application of the invention, the heated body is connected to the electronic board (3) to prevent it from transferring its heat to the mechanical adapter (2) with the mechanical adapter (2) a thermal insulator (5) positioned between the body (2). The inferential infrared detector (1) has a segmented fin (41) located on its rear cover (4) 15 It is positioned as a flat plate perpendicular to the back cover (4). In one application of the invention, there are multiple cut fins on the back cover (4). (41) They are positioned parallel to each other. Multiple By positioning the cut-off fin (41) on the back cover (4), the back cover (4) The heat on it is transferred to the environment by convection. The rear cover (4) surface is 20 multiple placed on it in different locations and intersecting each other thanks to the number of truncated fins (41), small vortices between the truncated fins (41) will create, in other words, turbulent airflow, such as an air It performs the flow. Thanks to the turbulent airflow, the rear cover (4) dissipates heat. Disposal efficiency is increasing. 25

Claims

6 REQUESTS 1. Image changes during temperature variations inside or outside the system. so that its performance is not affected - a mechanical adapter (2) and 5 on mechanical adapter (2) positioned, on which electronic cards are placed the electronic board will be almost partially perpendicular and at least surrounded by a body containing a side wall (3) - located on the side wall (3) of the said body and at least one side fin that allows heat to dissipate from the electronic board 10 (31), - almost partially parallel to the housing (3) and the electronic board a back cover (4) positioned in such a way as to be, back cover (4) positioned on the rear cover (4) to dissipate heat an infrared 15 characterized by at least one truncated fin (41) providing detector (1).

2. Transfer the heat of the heated body (3) from the electronic board to the mechanical adapter (2) between the mechanical adapter (2) and the body (2) to prevent it from moving Claim 1, 20, characterized by a positioned thermal isolator (5). such as an infrared detector (1).

3. Positioned as a flat plate perpendicular to the back cover (4) an infrared as in Claim 1 characterized by a cut-off fin (41) detector (1). 25 4. Multiple objects positioned to intersect each other on the back cover (4) Characterized by numerous truncated fins (41) as in Claim 1 or 3 an infrared detector (1).

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