A submodule used in modular multi-level converters.

Abstract

The invention relates to a modular multi-level converter integrated submodule that overcomes the need for different infrastructure requirements when transitioning between half-bridge and full-bridge configurations, using single-star bridge cells, single-triangle bridge cells, double-star chopper cells, and double-star bridge cells.

Description

1 TARIFF USED ​​IN MODULAR MULTI-LEVEL CONVERTERS. THE EXISTING SUBMODULE The technical field to which the invention relates: The invention represents a single semiconductor driver and submodule 5 that bridges both half-bridge and full-bridge configurations. The module required for modular multi-level converters that switch between circuits. It is related to a submodule. State of the art: Converters for high power levels required in the field of power electronics. As power requirements increase in applications, systematic multi-level converters are needed. 10 Its structure offers significant advantages. Therefore, multi-level converters are the latest... In recent years, it has been the most preferred grid-connected application at medium and high voltage levels. The converters that have been used are uninterruptible power supplies, wind and solar energy. converter circuits, motor drivers used in transportation, high voltage direct Current systems and power quality regulators are examples of application areas. It can be provided. Due to their structural characteristics, they can be offered in different numbers of submodules and Modular multi-level converters designed in their configurations, circuit structures Depending on their intended use, they can be used with different switching methods. It provides. However, submodules belonging to modular multi-level converters Separately but also synchronized with each other, they enable the converter's functionality 20 It is controlled by algorithms that provide this. Modular multi-level converters are divided into four classes according to their circuit structures. These are single-star bridge cells, single-delta bridge cells, and double-star chopper cells. and are dual-star bridge cells. The power of the converter depends on the circuit module used. The advantages that electronics will provide to the circuit vary. These four groups have 25. The submodules included have different circuit topologies depending on the purpose of the application. It can include half-bridge and full-bridge submodules, which are the most common types. These are the structures. When switching between these groups is desired, in the circuit topology... Structural changes are required. Modular solutions are needed for each application. Designing a multi-level converter requires different sub-modules. 30 2 Various proposals for modular multi-level converters in the current state of the art. And although applications have been improved, they do not cover all intended uses of converters. There is not enough complete range of driver and module designs available to meet this demand. Some examples of invention applications developed for this purpose are given below. Patent file number “CN108959671A”, which is in the known state of the art, 5 The invention in question has been examined. It involves the modeling and simulation of a power system. modular multi-level, belonging to its field, using half-bridge and full-bridge submodules. The method includes a real-time simulation method of the converter. Numerical model used in electromagnetic transient analysis of the given submodule With the help of a multi-level converter, real-time based 10 at a specific scale A simulation is being conducted that provides an analysis of the electromagnetic transient state. It has high-precision resolution. Half-bridge and full-bridge submodules. Real-time simulation modeling of the modular multi-level converter This is the method. The model of a submodule also includes the model of numerous independent submodules. It includes. In the submodule model, there are 15 semi-bridge and full-bridge submodules. a numerical modeling method for electromagnetic transient analysis It is granted. Patent number CN108959671A is divided into different subgroups (single-star). bridge cells, single-triangle bridge cells, double-star chopper cells, and double-star (bridge cells) wiring and sensor count for multi-level converters It does not have the feature of presenting its change within a unified structure. 20 Patent file number “CN108763835A” which is in the known state of the art. The invention in question has been examined. The invention in question is flexible DC modeling and simulation. to the field, reconfiguring the modular multi-level converter topology sub-field It belongs to the module and its modeling method. It has different sub-module structures. 25 multi-level converters via physical or simulation platform It can be applied to simulations. One positive terminal, one negative terminal, six IGBTs and Modular multi-level system containing anti-parallel diode, two capacitors and five switches. The submodule has a converter topology and a reconfiguration type. Each of the topologically reconfigurable submodules is a modular multi-level structure. a positive terminal and a negative 30 to form a bridge arm of the converter It is cascaded via the terminal. Here, a multi-level converter is used. The topology focuses on the switching area and is multi-level. 3 four groups in converters (single-star bridge cells, single-delta bridge cells, Combined implementation for binary star chopper cells and binary star bridge cells) No topology is formed. Patent file number “CN107317472A” exists in the known state of the art. It has been examined. The invention that is the subject of the application relates to the field of flexible direct current transmission, 5 especially full-bridge and half-bridge hybrid modular multi-level converters It relates to the initiation method. Full bridge and half bridge hybrid modular multi-level. The converter includes three-phase units as a starting method. Presented here... The invention relates to the initiation method of modular multi-level converters. In the current state of the art, there are 10 inter-topology options related to modular multi-level converters. There are needs that cannot be met during the transition. In conclusion, due to the negative aspects described above and the subject of the current proposals... half bridge with integrated design that we proposed due to its shortcomings and is a transition between full bridge and single-star bridge on a single circuit. cells, single-triangle bridge cells, double-star chopper cells, and double-star bridge 15 The goal is to enable operation between cells with a single submodule topology. The purpose of the invention: The aim of the invention is to create single-star bridge cells in modular multi-level converters. 20 types of cells: triangular bridge cells, double-star chopper cells, double-star bridge cells When flexibility in implementation arises among the four groups, there is no infrastructural limitation. The half-wave bridge used in the submodules without modification is now full wave. The goal is to make crossings possible by converting it into a bridge. Another objective of the invention is to develop an integrated circuit infrastructure in all four groups. It is about applicability and meeting the need for flexible technology. 25 Another purpose of the invention is to eliminate the need for any cabling infrastructure or number of sensors in the system. exchange and data communication exchange requested between four groups The key is having flexible technology in place that will allow for time-sensitive application transitions. 4 Another aim of the invention is to provide half-wave and full-wave bridges within all four classes. Bridge submodules can be driven and data transmitted via the same fiber optic cable infrastructure. The goal is to ensure the transfer of information. Another purpose of the invention is to ensure its suitability for mass production in industry, thereby enabling mass production. The production of a single submodule in a combined structure, 5 in other classes belonging to the manufacturer. It is the unification and integration of the sub-modules found. Thus, the manufacturers' By producing a single sub-module, we can create the necessary sub-modules for modular converters in four groups. The goal is to meet the module requirement. The structural and characteristic features and all the advantages of the invention are given in the figures below. And thanks to the detailed explanation written with references to these figures, it becomes clearer. 10 This will be understood as such. Therefore, an invention is defined with the given figures and detailed descriptions. It will be expressed in its entirety. Explanation of the figures: FIGURE -1; Top view of the modular multi-level converter sub-module, which is the subject of the invention. It is a drawing that gives the image. 15 FIGURE 2; Side view of the modular multi-level converter sub-module, which is the subject of the invention. It is a drawing that gives the image. FIGURE 3; Side view of the modular multi-level converter sub-module, which is the subject of the invention. It is a drawing that gives the image. FIGURE -4; Isometric 20 of the modular multi-level converter sub-module, which is the subject of the invention. It is a drawing that gives the image. FIGURE 5; The modular multi-level converter sub-module, which is the subject of the invention, is used. This is a diagram showing a single-star bridge cell system. FIGURE 6; The modular multi-level converter sub-module, which is the subject of the invention, is used. This is a diagram showing a single-triangular bridge cell system. 25 FIGURE 7; The modular multi-level converter sub-module, which is the subject of the invention, is used. This is a diagram illustrating a binary-star chopper cell system. FIGURE 8; The modular multi-level converter sub-module, which is the subject of the invention, is used. This is a diagram illustrating a double-star bridge cell system. Reference numbers: M. Submodule 1. Fiber optic inputs 5 2. Isolated voltage sensor 3. Thyristor 4. Capacitor 5. Isolated door driver 6. Converter 10 7. Port 8. Semiconductors A. A-phase B. B-phase C. C-phase 15 Description of the invention: The invention enables a transition between a half-bridge and a full bridge; single-star bridge cells, single-triangle bridge cells, double-star chopper cells, and double-star The demand among multi-level converters using bridge cells is 20 modular flexibility in its modifications, without requiring radical changes in the submodules. It is related to ensuring production. Modular multi-level converters, single-star bridge cells, single-delta bridge four types of cells: binary star chopper cells, binary star bridge cells It includes circuit systems divided into classes (groups). Modular multi-level 25 Converters, depending on the circuit module used, provide conversion function and power. The capabilities it will provide to electronics vary. These four groups are listed here. The submodules included have different features. These four classes The most common submodules in converters are half-wave bridge and full-wave bridge. It is known that bridges are used. The developed modular multi-level converter sub-30 Intergroup switching with module (M) and isolated gate driver (5) circuits, developed 6 Thanks to the system's flexibility, there is no need to change the cabling or the number of sensors in the system. It can be provided. In the modular multi-level converter submodule (M), any of the four classes no infrastructural changes will be made during the implementation phase and if needed. 5 with half-wave bridge and full-wave bridge isolated gate driver (5) circuits It can be converted. This conversion requires no cabling infrastructure for the system and Data exchange can be done without changing the data. Thus, single-star bridge cells, single-delta bridge cells, double-star chopper cells, and double-star bridge circuits Application topology by allowing for changes between systems as desired. It can be changed. With fiber optic infrastructure, both half-wave bridge and full 10 The wave bridge can be driven with the same cable infrastructure. Each submodule (M) has four class (single-star bridge cells, single-triangle bridge cells, double-star chopper cells) isolated gate driving circuits (5) of the converters belonging to (double-star bridge cells) It is located there. The sub-15 of modular multilevel converters that use semiconductors are divided into four classes. Connection infrastructure required for transitioning to a full bridge by holding a half-bridge in module (M) It also includes the required PWM signals and analog data, modularly. The submodule (M) of the multi-level converter is configured at the level. Thus The PWM port used to access the system remains the same. Isolated gate drivers (5) located in the integrated submodule (M), semi 20 It can detect problems that may occur in the conductor (8). Thus, the submodule (M) half Problems that may occur in the conductors (8) are detected and a signal is sent to the data output. is provided. Any problems that may occur in the created submodule (M) will result in the submodule being affected. Removal of module (M) from the system or sub-module 25 kept in the system as a backup (M) Submodule (M) is disabled (bypassed) on the module for activation. The infrastructure to deploy or activate it is in place. The integrated submodule (M) that was created targets four modular multi-modules. While there are multiple-level converter circuit modules, there are also many other different types besides these. If the structures within the multi-level converters are suitable, then that 30 7 The integrated submodule (M) proposed with this invention can be used with the systems. Thanks to the isolated voltage sensors (2) it contains, the system has the same flexibility as other It is included within the converters. In addition, the isolated module (M) in the integrated submodule. Door drivers (5) can be driven individually, thus providing insulation in any configuration. It can be implemented without any problems. 5 Thanks to the isolated voltage sensors (2) located on the submodule (M), the system has an overload This makes it possible to detect current, short circuit, and open circuit conditions. Detection of faults that may occur in submodules (M) (Semiconductor (8) damage and Data flow can be fully ensured even if the capacitor (4) is damaged. Data flow between the submodule (M) and the signal processing unit (DSP) is 10 in the submodule (M). open circuits that may occur on the semiconductor (8) and direct current line capacitor (4) The circuit is designed to detect short circuit faults. The isolated voltage sensor (2) used is an optically isolated sensor and has a voltage of 5000V. It has isolation. Signal conversion uses sigma-delta modulation technology. It uses the sensor output as a differential and common mode 15. circuit to minimize common mode noise level It has been established. In case of a failure in the submodule (M) during development, bypass the submodule. It has a thyristor (3) and driver that will bypass it. Isolated gate drivers (5) can also address problems that may occur in the semiconductor (8) 20 It detects the problem and sends a signal to the main control board to protect the system. DC / DC (DC / DC) used for isolated door drivers (5) There are converters (6). When direct drive method is preferred instead of fiber optic inputs (1) data There are entry ports (7) created for the purpose of transfer. 25 The phase paths of three-phase units using submodules (M) are shown in Figures 5, 6, and 7. In Figure 8, the phases are labeled A-phase (A), B-phase (B), and C-phase (C).

Claims

8 REQUESTS 1. Single-star bridge cells developed for modular multi-level converters, single-triangle bridge cells, double-star chopper cells, and double-star bridge It is a circuit module used with cells; its feature is: - single-star bridge cells, single-triangle bridge cells, double-star chopper 5 four different groups consisting of cells and double star bridge cells used in transition processes between half-wave and full-wave bridges. the integrated connection infrastructure of wave bridge modules and single- star bridge cells, single-triangle bridge cells, double-star chopper 10 transitions between star-bridge cells and double-star bridge cells containing a single segment in which it was performed, from half-wave to full-wave PWM signals and analog data needed for waveform transition arrangement and modular multi-level converter with fiber optic its infrastructure includes both half-wave and full-wave bridges. an integrated 15 that enables it to be driven with cabling infrastructure It contains a certain number of submodules (M).

2. It is a circuit module that conforms to Claim 1, and its characteristic is that it connects the signal processing unit to the circuit. data flow, semiconductor (8) and direct current line capacitor on it (4) able to detect open circuit and short circuit faults that may occur on it It contains a submodule (M) with a specific feature. 20 3. It is a circuit module that complies with Claim 1, and its feature is; wiring and sensors in the system. single-star bridge with isolated gate driver (5) circuits without number change cells, single-triangle bridge cells, double-star chopper cells, and double-star The bridge contains a submodule (M) that can enable transitions between groups of cell bridges.

4. It is a circuit module that complies with Claim 1, and its feature is; overcurrent and short circuit protection in the system. 25 and in submodules (M) that make it possible to detect open circuit conditions possible semiconductor (8) damage and capacitor (4) damage Isolated voltage used in fault detection and ensuring complete data flow. It includes the sensor (2). 9 5. The circuit module conforming to claim 1 is an optically isolated sensor that transmits signals. common mode, using sigma-delta modulation technology for its transformation It includes an isolated voltage sensor (2) which minimizes the noise level.

6. It is a circuit module conforming to Claim 1, and its feature is; an insulated circuit with 5000V insulation. It includes a voltage sensor (2). 5 7. It is a circuit module that complies with Claim 1, and its feature is that it can prevent problems that may occur in the sub-module (M). It contains a thyristor (3) which will bypass the submodule (M) in case of failure.

8. It is a circuit module that complies with claim 1, and its feature is that it can be used in semiconductors (8) detects faults and sends a signal to the main control board to protect the system. The sender includes an isolated door driver (5). 10 9. It is a circuit module that conforms to Claim 1 and is characterized by having a component (M) located in each sub-module. single-star bridge cells, single-triangle bridge cells, double-star chopper cells converters belonging to four classes, including dual-star bridge cells It includes an isolated door driver (5).

10. It is a circuit module that complies with Claim 1 and has the following feature; 15 for isolated gate drivers (5). It includes the DC / DC converters (6) used.

11. It is a circuit module that complies with claim 1 and has the feature of; instead of fiber optic inputs (1) When the direct drive method is preferred for data transfer purposes. It includes the input ports (7) created. 25

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